Technic, Inc. Post Treatment for Silver Tarniban® E

Description
Recommended for minimization of epoxy bleed-out without adversely affecting downstream assembly operations such as wire bonding and die attach.
Description
Recommended for minimization of epoxy bleed-out without adversely affecting downstream assembly operations such as wire bonding and die attach.

Suppliers

Company
Product
Description
Supplier Links
Post Treatment for Silver - Tarniban® E - Technic, Inc.
Cranston, RI, USA
Post Treatment for Silver
Tarniban® E
Post Treatment for Silver Tarniban® E
Recommended for minimization of epoxy bleed-out without adversely affecting downstream assembly operations such as wire bonding and die attach.

Recommended for minimization of epoxy bleed-out without adversely affecting downstream assembly operations such as wire bonding and die attach.

Technical Specifications

  Technic, Inc.
Product Category Plating Chemicals and Anodizing Chemicals
Product Number Tarniban® E
Product Name Post Treatment for Silver
Chemical / Composition Silver Plating
Unlock Full Specs
to access all available technical data

Similar Products

PCB Process Chemicals for Circuit Formation - Copper Thinning: CircuEtch 100 - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Copper Plating; Tin Plating
View Details
Electro Cleaner - COLCLEAN® ELECTRO 420 - Columbia Chemical Corporation
Columbia Chemical Corporation
Specs
Chemical / Composition Electro Cleaner
Form Powder
View Details
Precious Metal Plating -  - Metalor Technologies USA Corporation
Metalor Technologies USA Corporation
View Details
uDiamond® Plating Additive for Electroless Nickel -  - Advanced Abrasives Corp.
Specs
Chemical / Composition Hard Nickel Plating; Electroless
Form Liquid / Solution
View Details