Technic, Inc. Mid Phos (7-8% P) Electroless Nickel Plating Process Techni EN 2600 SB

Description
Semi bright EN deposit, deposition rate 500-1000 u-in/hr (12-25 um/hr).
Description
Semi bright EN deposit, deposition rate 500-1000 u-in/hr (12-25 um/hr).

Suppliers

Company
Product
Description
Supplier Links
Mid Phos (7-8% P) Electroless Nickel Plating Process - Techni EN 2600 SB - Technic, Inc.
Cranston, RI, USA
Mid Phos (7-8% P) Electroless Nickel Plating Process
Techni EN 2600 SB
Mid Phos (7-8% P) Electroless Nickel Plating Process Techni EN 2600 SB
Semi bright EN deposit, deposition rate 500-1000 u-in/hr (12-25 um/hr).

Semi bright EN deposit, deposition rate 500-1000 u-in/hr (12-25 um/hr).

Technical Specifications

  Technic, Inc.
Product Category Plating Chemicals and Anodizing Chemicals
Product Number Techni EN 2600 SB
Product Name Mid Phos (7-8% P) Electroless Nickel Plating Process
Chemical / Composition Hard Nickel Plating
Unlock Full Specs
to access all available technical data

Similar Products

Molded Interconnect Device Plating - Copper Plating: MID Copper 100 - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Copper Plating; Hard Nickel Plating; Silver Plating; Tin Plating; Electroless
View Details
SafeGard® 3400 Seal#10 -  - Sanchem, Inc.
Specs
Chemical / Composition Anodizing
Form Liquid / Solution
View Details