TechniFlex CU 120 is a high speed, stress free copper specifically designed for Flexible Circuits. Unlike standard acid copper processes, the TechniFlex CU 120 is capable of plating at over 40 ASF (4 ASD) in standard process tanks. The use of unique leveling agents helps to overcome incomplete coverage in sputtered coatings, making it ideal for plating of seed layer flex or direct metallization systems.
| Technic, Inc. | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Name | TechniFlex CU 120 |
| Chemical / Composition | Copper Plating |
