High-speed copper plating bath able to achieve very fast plating rates on a variety of semiconductor applications while maintaining good WIW and WID coplanarity. 4 microns/minute can be attained on bump on passivation, bump on pad and other advanced packaging structures. Electrolyte can be modified to offer optimum performance on tight RDL features. Produces bright deposit and is fully analyzable with Technic’s Real Time Analyzer (RTA).
| Technic, Inc. | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Name | Elevate® Cu 6370 |
| Chemical / Composition | Copper Plating |
