ToneCooling Technology Co., Ltd Datasheets for CPU Coolers
CPU fans and coolers are integrated fans and heat sink assemblies packaged to provide optimum cooling performance, often for specific processors.
CPU Coolers: Learn more
| Product Name | Notes |
|---|---|
| High Efficiency: Provides excellent thermal conductivity for stable operation. Durability: Withstands high pressure and temperatures, suitable for tough conditions. Complex Design Flexibility: Can be custom-designed with intricate channels. Leak-Proof: Fully... | |
| High Thermal Conductivity: Utilizes Friction Stir Welding (FSW) technology to enhance heat transfer efficiency. Robust Construction: Strong, durable joints created by FSW ensure long-lasting performance under high thermal and mechanical... | |
| 》Efficient heat dissipation and noise control. 》Higher performance and longer life of graphics cards. 》Compatible with and made of high thermal conductivity materials Materials such as copper and aluminum. “Easy... | |
| · Placing the pump at the cold end to allow it to run at a lower temperature is more conducive to extending the life of the pump; · Precision ammonia... | |
| ·High Efficiency: Provides excellent thermal conductivity for stable operation. ·Durability: Withstands high pressure and temperatures, suitable for tough conditions. ·Complex Design Flexibility: Can be custom-designed with intricate channels. ·Leak-Proof: Fully... | |
| ·High Thermal Conductivity: Efficiently transfers heat from the CPU or GPU to the cooling fluid for effective heat dissipation. ·Customizable Designs: Available in various sizes and configurations to fit different... | |
| ·High Thermal Performance: Efficiently dissipates heat to enhance cooling in servers and data centers. ·Customizable Designs: Tailored to specific cooling needs with various sizes and configurations. ·Robust Construction: Durable materials... | |
| ·The patented design is compact and simple, without the need to redesign the internal structure of the housing ·The advantages of the pump being located in the heat sink ·Avoid... | |
| ·The pump and radiator are integrated with welding technology to reduce the risk of artificial joints and leakage; ·The size of the radiator can be customized to meet the various... | |
| ·The ultra-thin water cooling head can be used for heat dissipation in systems with limited height or compact space; ·The main body is welded by mature all-copper friction welding to... | |
| ·When the water is drained, the effect of reducing the movement of the CPU ·When the cold end is installed, it operates at a lower temperature, and has a longer... | |
| • Dual cold plates type in parallel. • Water-block can be used as an ultra-thin structure for heat dissipation in some highly limited tight spaces. • Less conjunctions means leakage... | |
| • Water-block can be used as an ultra-thin structure for heat dissipation in some highly limited tight spaces. • Few manual assembled and mature all – copper friction brazing process... | |
| . Placingthe pump at the cold end can make the pump run at a lower temperature more conduciveto the norma operction ofthe pump and extend the life of the pump. | |
| . Precision structure, saving space; · No pipe welding technology, reducing the risk of leakage; · Simple and convenient installation; · Reduce the number of unnecessary joints to reduce the... | |
| . Pump located in the cold side (radiator) instead of the hot side..(W/B) may avoid the damages from the high-temperature coolant.. Pump located in the radiator instead of the waterblock... | |
| . Water-block can be used as an ultra-thin structure for heat dissipation in some highly limited tight spaces..Few manual assembled and mature all- copper friction brazing process to ensure zero... | |
| 1. High Discharge Rate: These systems support a 1C discharge rate, meaning they can discharge their entire capacity in one hour, which is ideal for applications requiring rapid energy delivery... | |
| 1. High Thermal Conductivity • Description: These adhesives are formulated to conduct heat efficiently, making them ideal for applications where heat management is crucial. • Advantages: Helps in dissipating heat... | |
| 1. High-Pressure Operation: These systems operate under high pressure, which enhances the efficiency of energy storage and retrieval processes 2. Cascade Design: The cascade structure allows for multiple stages of... | |
| 1. Effective Heat Dissipation: Liquid cooling systems use a coolant, typically water or a specialized fluid, to absorb and dissipate heat from the energy storage components. This helps in maintaining... | |
| 1. Enhanced Structural Integrity: The reinforced rib design provides additional strength and durability, making it suitable for heavy-duty applications. 2. Efficient Heat Dissipation: Optimized for superior thermal management, ensuring effective... | |
| 1. High Load-Bearing Capacity: Engineered to support up to 600kg, this cooling plate is ideal for applications requiring substantial weight-bearing capabilities, ensuring stability and reliability. 2. Reinforced Structure: The reinforced... | |
| 1. Improved Heat Dissipation • The thickened spoiler structure significantly enhances heat transfer efficiency by increasing turbulence within the cooling channels. This results in better heat dissipation from high-performance components... | |
| 1. Narrow Channel Design: The narrow channel design enhances fluid dynamics, allowing for efficient heat transfer and cooling. This design minimizes fluid resistance, ensuring optimal performance. 2. Sturdy Bracket Structure:... | |
| 1. Robust Protection: These housings provide durable protection against environmental factors such as dust, moisture, and temperature fluctuations. This ensures the longevity and reliability of the energy storage systems 2. | |
| 1. Wide Channels: These allow for increased coolant flow, enhancing heat transfer efficiency. 2. Spoiler Structures: These are designed to create turbulence within the coolant flow, improving heat dissipation. 3. | |
| VC welding process Welding process Diffusion welding Copper solder paste welding Features Service life 15 years; high cost; high fixture cost Service life 10 years; low cost; low fixture cost... | |
| 》Efficient heat dissipation and noise control. 》Higher performance and extended graphics card life. 》Compatible with, and manufactured from highly thermally conductive materials such as copper and aluminum. 》Easy to install. | |
| ·High Efficiency: Provides excellent thermal conductivity for stable operation. ·Durability: Withstands high pressure and temperatures, suitable for tough conditions. ·Complex Design Flexibility: Can be custom-designed with intricate channels. ·Leak-Proof: Fully... | |
| ·High Thermal Conductivity: Efficiently transfers heat from the CPU or GPU to the cooling fluid for effective heat dissipation. ·Customizable Designs: Available in various sizes and configurations to fit different... | |
| ·High Thermal Conductivity: The Vapor Chamber uses phase change through liquid evaporation and condensation to rapidly and evenly spread heat, offering excellent thermal conductivity. ·Uniform Heat Distribution: The design allows... | |
| ·High Thermal Performance: Efficiently dissipates heat to enhance cooling in servers and data centers. ·Customizable Designs: Tailored to specific cooling needs with various sizes and configurations. ·Robust Construction: Durable materials... | |
| Advanced Liquid Cooling Technology from Coolserver for Modern Data Centers CPU coolserver W2 The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular... | |
| Custom Heat Sink Solutions from Coolserver for Electronics Cooling CPU coolserver B6 The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling... | |
| Custom Liquid Cooling Plates for Advanced Electronic Applications Intel CPU X3 liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU, and... | |
| Efficient Liquid Cooling Plates for High-Power GPU Systems NVIDIA GPU A100/A800 single-width liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU, GPU,... | |
| High-Performance Liquid Cooling Plates for Data Centers AMD CPU liquid cooling plate SP5 liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the CPU,... | |
| High-Quality Liquid Cooling Plates by Coolserver for Server Applications CPU coolserver H2 The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling... | |
| How to Choose the Right Liquid Cooling Plate for Your Server GPU TTC-1000W/1200W/1500 W liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the... | |
| Optimize Your Cooling with Coolserver’s High-Efficiency Heat Sink Solutions CPU coolserver P9 The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling... | |
| Target Scenarios The LGA9324-1U-FWA31 is a 1U server cooler purpose-built for Intel’s next-generation LGA9324 socket CPUs (e.g., Xeon Ultra 9000 series). It targets high-density data centers, AI training clusters, and... | |
| Top Benefits of Using Coolserver Heat Sinks for Electronic Devices CPU coolserver W2 The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular... | |
| Top Benefits of Using Liquid Cooling Plates in Modern Computing NVIDIA GPU 4090 double-wide liquid cooling plate The unique heat dissipation design cleverly directs the water cooling liquid to the... | |
| Vapor Chamber (VC) heat spreaders, leveraging advanced two-phase cooling technology, have become a cornerstone of efficient thermal management in modern high-performance systems. Below, we explore their transformative applications in... | |
| VC welding process Welding process Diffusion welding Copper solder paste welding Features Service life 15 years; high cost; high fixture cost Service life 10 years; low cost; low fixture cost... | |
| AlO(AllHn-One) structure is more suitable for modular management of server.. Non-tube means leakage risk considerably reduces and the less evapotranspiration to be a long life .. NLP “(Non-Leaking Point) Tech:... | |
| As modern CPUs become increasingly powerful, effective thermal management is essential for maintaining performance and system stability. The TC-LGA1700-W1 CPU Cooler is specifically designed to meet the cooling needs of... | |
| CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve... | |
| CMc is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides.It was invented by Americans in the 1990s to solve the... | |
| Copper/Kovar/Copper, Copper/Invar/Copper, and Copper/Steel/Copper series products are similar to CMC and CPC series sandwich composite materials. They combine the high thermal conductivity of copper with the low thermal expansion coefficient... | |
| designed for next-generation 800G, 1.6T, and beyond optical transceivers. By utilizing efficient micro-channel design and superior thermal conductive materials, it directly attaches to the optical module, rapidly dissipating heat and... | |
| Diamond copper is a composite material made of diamond powder and a copper alloy. It utilizes high-quality artificial synthetic diamond powder, which boasts a thermal conductivity of about 1000W/M.K and... | |
| Double pump series structure provides stronger and safer power output.It is convenient to add multiple cold-plate, and can be used for CPU, GPU, memory, M.2, MOS and so onFew manual... | |
| In the ever-evolving landscape of information technology, innovation is the driving force behind progress. As the demand for high-performance computing continues to grow, the need for efficient and sustainable solutions... | |
| In the ever-evolving landscape of information technology, the need for high-performance computing solutions is greater than ever. As workloads become more complex and data-intensive, efficient thermal management has emerged as... | |
| In the fast-paced world of information technology, innovation is key to staying ahead. As computational demands grow exponentially, the need for efficient and sustainable cooling solutions becomes critical. Enter the... | |
| In the fast-paced world of information technology, the demand for high-performance computing solutions continues to grow. As workloads become more complex and data-intensive, efficient thermal management has become a critical... | |
| In the fields of high-performance computing, gaming, and content creation, AMD CPUs have become the preferred choice for many users due to their exceptional multi-core performance and cost-effectiveness. However, as... | |
| In the fields of high-performance computing, gaming, and content creation, NVIDIA GPUs are the preferred choice for many users due to their powerful graphics processing capabilities and exceptional performance. However,... | |
| In the rapidly evolving fields of electric vehicles (EVs) and semiconductor manufacturing, thermal management plays a critical role in ensuring efficiency, reliability, and performance. The Thermoelectric Cooler (TEC) liquid cooling... | |
| In the rapidly evolving world of high-performance computing (HPC), artificial intelligence (AI), and data-intensive applications, NVIDIA GPUs have established themselves as the gold standard for delivering unmatched computational power. However,... | |
| In the rapidly evolving world of information technology, the demand for high-performance computing continues to surge. As workloads become more complex and data-intensive, efficient thermal management has become a critical... | |
| In the rapidly evolving world of information technology, the demand for high-performance computing solutions is greater than ever. As workloads become more complex and data-intensive, efficient thermal management has emerged... | |
| In the realms of high-performance computing and gaming, AMD CPUs have won the favor of many users with their powerful multi-core performance and cost-effectiveness. However, as CPU performance continues to... | |
| In the realms of high-performance computing and gaming, GPU performance is critical. To fully unleash the potential of NVIDIA GPUs, an ultimate cooling solution is essential. The NVIDIA GPU L40... | |
| In today’s high-performance computing and gaming landscape, GPU performance is crucial. To fully unleash the potential of NVIDIA GPUs, an efficient cooling solution is essential. The NVIDIA GPU L20 liquid... | |
| In today’s high-tech industry, laser projection technology is widely used in home theaters, commercial displays, and educational training due to its advantages such as high brightness, high clarity, and long... | |
| In today’s pursuit of ultimate performance, efficient heat dissipation has become a key focus for PC users, especially gamers and content creators. The Intel CPU Birch Stream liquid cooling plate,... | |
| Intel processors are renowned for their powerful performance, but high performance also means higher heat generation. To fully unleash the potential of Intel CPUs, choosing an efficient cooler is crucial. | |
| Lasers come in many different qualities,and carbon dioxide lasers are stillused in certain specific situations. However, solid-state lasers are currently the main type, and semiconductorlasers are the most common. The... | |
| Liquid Cooling Solutions· Precision structure, saving space · No pipe welding technology, reducing the risk of leakage · Simple and convenient installation · Reduce the number of unnecessary joints to... | |
| Molybdenum copper series is also a pseudo alloy. Molybdenum and copper are not miscible. It fully combines the high thermal conductivity, high melting point, low thermal expansion coefficient, and high... | |
| Pump located in the cold side (radiator) instead of the hot side.(W/B) may avoid the damages from the high-temperature coolant..Pump located in the radiator instead of the waterblock may avoid... | |
| tc-lga1700-1u1c-cpu- cooler | |
| tc-lga2011-1u1c-1-cp u-cooler | |
| tc-lga3647-1u-r73-cp u-cooler | |
| The 1P104S battery pack cold plate provides efficient liquid cooling for high-voltage battery packs, maintaining stable temperatures and enhancing long-term performance. It is ideal for electric vehicles, energy storage systems,... | |
| The LGA1700-1U3C is an ultra-compact 1U server-grade CPU cooler engineered for Intel® 12th/13th Gen Core™ processors (LGA1700). Featuring an all-copper thermal stack and a high-RPM dual-ball bearing fan, it delivers... | |
| The LGA3647-W1 is a mission-critical CPU cooler designed for Intel® Xeon® Scalable Processors (LGA3647 socket), delivering 350W TDP cooling capacity in a slim 19.1mm profile. Featuring a revolutionary 0.15mm micro-fin... | |
| The TC-4677-1UF71-P (EAVC) CPU cooler is a purpose-built thermal solution optimized for Intel LGA4677 processors used in 4th and 5th Gen Xeon Scalable platforms (Sapphire Rapids / Emerald Rapids). Designed... | |
| The TC-4677-1UF72-P (EAVC) is a high-performance 1U CPU cooler designed specifically for Intel® LGA4677 socket processors, including the 4th and 5th Gen Xeon Scalable (Sapphire Rapids and Emerald Rapids) platforms. | |
| The TC-4677-1UM71-P CPU cooler is an ultra-low-profile thermal solution designed for Intel’s LGA4677 socket, supporting 4th and 5th Gen Xeon Scalable processors (Sapphire Rapids / Emerald Rapids). Engineered for high-density... | |
| The TC-4677-2UF76 CPU Cooler is a high-efficiency thermal solution developed for Intel’s LGA4677 socket, supporting 4th and 5th Generation Xeon® Scalable processors (Sapphire Rapids & Emerald Rapids). Designed for... | |
| The TC-4677-2UM81-P is a high-performance air cooler specifically designed for Intel’s LGA4677 socket, compatible with 4th and 5th Gen Xeon Scalable processors (Sapphire Rapids / Emerald Rapids). Tailored for... | |
| The TC-4677-2UM82 is a high-performance air cooling solution designed for Intel’s LGA4677 socket, fully compatible with 4th and 5th Gen Xeon Scalable processors (Sapphire Rapids / Emerald Rapids). Engineered... | |
| The TC-4677-2UM83 is a next-generation CPU cooler specifically engineered for Intel LGA4677 sockets, fully supporting Xeon Scalable 4th and 5th Generation processors (Sapphire Rapids & Emerald Rapids). Tailored for 2U... | |
| The TC-4677-2UM87 CPU Cooler is purpose-built for Intel’s LGA4677 socket, supporting 4th and 5th Gen Xeon Scalable Processors (Sapphire Rapids & Emerald Rapids). Engineered to handle extreme compute loads... | |
| The TC-AMD AM4 1U-P31 CPU Cooler is a highly efficient and compact thermal solution specifically designed for AMD’s AM4 processors. Ideal for use in server environments, data centers, and high-performance... | |
| The TC-AMD AM4 1U-P32 CPU Cooler is a compact and high-performance thermal solution designed to meet the cooling demands of AMD’s AM4 processors. Perfectly suited for small form-factor servers, high-performance... | |
| The TC-AMD AM4 2U-M62 CPU Cooler is a high-performance thermal solution designed specifically for AMD’s AM4 processors, optimized for use in 2U server environments. With its robust heat dissipation capabilities,... | |
| The TC-AMD AM4-2U6C CPU Cooler is a high-performance cooling solution designed specifically for AMD’s AM4 processors. Built to deliver superior heat dissipation in high-density 2U server environments, this cooler is... | |
| The TC-AMD AM4-2U6CA CPU Cooler is a high-performance thermal solution specifically designed for AMD AM4 socket processors. With its 2U form factor, advanced cooling technology, and durable design, this cooler... | |
| The TC-AMD AM4-R63 CPU cooler is a high-performance thermal solution specifically engineered for AMD’s AM4 socket processors. With its efficient heat dissipation, compact design, and durable construction, the TC-AMD AM4-R63... | |
| The TC-AMD AM4-R64 CPU Cooler is a high-performance thermal solution designed specifically for AMD’s AM4 processors. With advanced cooling technology, efficient heat dissipation, and a robust design, the TC-AMD AM4-R64... | |
| The TC-AMD AM5 1U1CA CPU Cooler is a high-performance cooling solution designed specifically for AMD’s AM5 socket, making it ideal for cooling the latest Ryzen and EPYC processors. Its 1U... | |
| The TC-AMD AM5 1U3C CPU Cooler is a state-of-the-art cooling solution tailored for AMD’s AM5 processors, including the Ryzen 7000 series and EPYC processors. Designed specifically for 1U server configurations,... | |
| The TC-AMD AM5 R65 CPU Cooler is an advanced thermal solution designed specifically for AMD’s AM5 processors, including the Ryzen 7000 series and EPYC processors. Engineered to deliver superior cooling... | |
| The TC-AMD AM5-R64 CPU Cooler is a high-performance thermal solution designed specifically for AMD’s AM5 processors, including the latest Ryzen and EPYC chips. With a focus on cooling efficiency, reliability,... | |
| The TC-AMD SP3 1U-P11 CPU Cooler is an advanced thermal solution designed specifically for AMD processors with an SP3 socket, making it ideal for environments that demand both high cooling... | |
| The TC-AMD SP3 2U-P21 CPU Cooler is a premium cooling solution specifically designed for AMD processors with the SP3 socket, including the high-performance EPYC series. With a 2U form factor,... | |
| The TC-AMD SP3 2U-P22 CPU Cooler is an advanced cooling solution designed specifically for AMD’s SP3 socket, including the powerful EPYC processors. With its 2U form factor, this cooler is... | |
| The TC-AMD SP3 W7 CPU Cooler is an advanced and high-performance thermal management solution designed specifically for AMD processors utilizing the SP3 socket. With a robust design that prioritizes cooling... | |
| The TC-AMD SP6 M87 CPU Cooler is a high-performance thermal solution specifically designed for AMD processors, providing reliable cooling and optimal performance in demanding applications. This cooler is engineered to... | |
| The TC-AMD-AM4-R22 CPU Cooler is a high-performance cooling solution specifically designed to handle the thermal demands of AMD’s AM4 socket processors. Whether you’re building a high-performance gaming rig, an enterprise... | |
| The TC-LGA115X-1U1C CPU Cooler is a low-profile, high-efficiency cooling solution designed for Intel® LGA115X socket processors, including LGA1150, LGA1151, LGA1155, and LGA1156. Engineered for 1U rackmount server environments, this cooler... | |
| The TC-LGA115X-1U1CA CPU Cooler is a high-efficiency, low-profile cooling solution engineered for Intel® LGA115X socket processors—including LGA1150, LGA1151, LGA1155, and LGA1156. Designed specifically for 1U server environments, this cooler delivers... | |
| The TC-LGA115X-1U3C CPU Cooler is a high-efficiency, low-profile cooling solution specifically designed for Intel® LGA115X socket processors. With enhanced cooling capacity and a triple-fan configuration, this cooler is engineered for... | |
| The TC-LGA115X-1U3CC CPU Cooler is a highly efficient, low-profile cooling solution designed for Intel® LGA115X socket processors, including LGA1150, LGA1151, LGA1155, and LGA1156. This cooler is tailored for 1U rackmount... | |
| The TC-LGA115X-R28 CPU Cooler is an efficient, robust cooling solution designed for Intel® processors using the LGA115X socket, including LGA1150, LGA1151, LGA1155, and LGA1156. With a focus on reliability, durability,... | |
| The TC-LGA115X-W1 CPU Cooler is a versatile and compact cooling solution designed for Intel® processors using the LGA 115X socket family, including LGA 1150, 1151, 1155, and 1156. With a... | |
| The TC-LGA1700-V11-A CPU Cooler is a high-performance thermal solution tailored for Intel’s LGA 1700 socket, supporting 12th, 13th, and 14th generation processors. Designed for both reliability and ease of use,... | |
| The TC-LGA2011-1U1C CPU Cooler is a high-efficiency thermal solution designed specifically for Intel® Xeon® processors using the LGA 2011 socket in 1U rackmount server systems. Engineered with a compact profile... | |
| The TC-LGA2011-1U3C CPU Cooler is a high-performance, low-profile cooling solution tailored for Intel® Xeon® processors on the LGA 2011 socket platform. Optimized for use in 1U rackmount servers, it combines... | |
| The TC-LGA2011-1U3C-1 CPU Cooler is a high-performance cooling solution designed for Intel’s LGA 2011 socket processors, including Xeon E5 series CPUs. Specifically tailored for 1U rackmount servers, this cooler offers... | |
| The TC-LGA2011-1U3CC CPU Cooler is a compact, high-performance cooling solution engineered for Intel® Xeon® processors with LGA 2011 sockets. Built to meet the demanding requirements of 1U rackmount servers, this... | |
| The TC-LGA2011-2U3C CPU Cooler is a high-efficiency cooling solution designed for Intel® Xeon® processors with the LGA 2011 socket. Built specifically for 2U rackmount servers, it delivers outstanding thermal performance,... | |
| The TC-LGA2011-2U3C-1 CPU Cooler is a robust and high-performance thermal solution designed for Intel’s LGA 2011 socket processors, including Xeon E5 series CPUs. Tailored for 2U rackmount servers, this cooler... | |
| The TC-LGA2011-2U3CC CPU Cooler is a powerful and efficient thermal solution engineered for Intel® Xeon® processors on the LGA 2011 socket platform. Optimized for 2U rackmount servers, this cooler is... | |
| The TC-LGA2011-R16 CPU Cooler is a reliable and high-efficiency thermal solution designed for Intel® Xeon® processors using the LGA 2011 socket. Engineered to deliver exceptional heat dissipation and long-term stability,... | |
| The TC-LGA3647-1U-R77 CPU Cooler is a compact, high-efficiency thermal solution specifically engineered for Intel’s LGA 3647 socket CPUs, such as the Xeon Scalable series. Designed to fit within 1U rackmount... | |
| The TC-LGA3647-2U-R81 CPU Cooler is a high-performance cooling solution designed specifically for Intel’s LGA 3647 socket, supporting Xeon Scalable processors used in enterprise-grade 2U servers. With a larger heatsink and... | |
| The TC-LGA3647-2U-S81 CPU Cooler is a powerful thermal solution designed for Intel’s LGA 3647 socket processors, including the Xeon Scalable series. Tailored for 2U rackmount systems, this cooler delivers efficient... | |
| The TC-LGA3647-2U-S82 CPU Cooler is a high-performance, reliable cooling solution designed for Intel’s LGA 3647 socket processors, including the Xeon Scalable series. Engineered specifically for 2U rackmount server environments, this... | |
| The TC-LGA3647-4U-R92 CPU Cooler is a robust and high-performance cooling solution designed for Intel’s LGA 3647 socket processors, including Xeon Scalable CPUs. Built to meet the demanding cooling needs of... | |
| The TC-LGA3647-R97 CPU Cooler is a high-performance cooling solution specifically designed for Intel’s LGA 3647 socket processors, including Xeon Scalable series CPUs. Engineered to provide optimal thermal performance, this cooler... | |
| The TC-LGA3647-W1 CPU Cooler is a high-efficiency thermal solution engineered for Intel’s LGA 3647 socket, supporting Xeon Scalable processors used in data centers, workstations, and enterprise environments. With its robust... | |
| The TC-SP5-1US11-P CPU Cooler is a high-performance cooling solution designed to provide efficient thermal management for compact and space-constrained systems. Engineered for small form factor PCs, embedded devices, and other... | |
| The TC-SP5-1UW13 CPU Cooler is a compact and highly efficient thermal solution designed to provide reliable cooling for CPUs in space-constrained environments. Ideal for small form factor systems, servers, and... | |
| The TC-SP5-1UW5 CPU Cooler is a high-performance, space-efficient cooling solution designed to keep CPUs cool in environments where space is limited but cooling efficiency remains crucial. Built for small form... | |
| The TC-SP5-2UF21 (EVAC) CPU Cooler is a high-performance cooling solution designed to provide exceptional thermal management in environments where efficiency, reliability, and durability are critical. The “EVAC” designation highlights its... | |
| The TC-SP5-2US21-P CPU Cooler is an advanced cooling solution designed to provide exceptional thermal management for high-performance CPUs in a variety of demanding applications. Combining efficient heat dissipation, a compact... | |
| The TC-SP5-2US22 CPU Cooler is a high-performance cooling solution designed to meet the thermal management needs of advanced computing systems. With its robust design, efficient heat dissipation, and low-noise operation,... | |
| The TC-SP6-1UT11-P CPU Cooler is a high-performance thermal management solution designed for cooling processors in space-constrained environments. With its innovative design, energy-efficient cooling capabilities, and reliable performance, the TC-SP6-1UT11-P is... | |
| The TC-SP6-2UT21-P CPU Cooler is an advanced thermal solution designed for dual-processor systems, providing exceptional cooling efficiency and reliable performance. With its efficient heat dissipation capabilities and durable design, this... | |
| The TC-SP6-2UT22 CPU Cooler is a state-of-the-art cooling solution designed to provide efficient thermal management for dual-processor configurations. Built for high-performance systems that require precise cooling, this cooler ensures optimal... | |
| The TC-SP7-1US11 CPU Cooler is a high-performance, space-efficient cooling solution designed to handle the thermal demands of modern processors in environments where space is at a premium. Whether you’re working... | |
| The TC-SP7-2US21 CPU Cooler is designed to provide efficient thermal management for dual-processor systems in space-constrained environments. Offering high-performance cooling in a compact design, this cooler is the ideal solution... | |
| The TC-SP7-2US22 CPU Cooler is designed to provide exceptional cooling performance for dual-processor systems in high-density environments. With a compact, space-saving design and advanced thermal management features, the TC-SP7-2US22 ensures... | |
| The TC-SP7-2US87 CPU Cooler is a high-performance cooling solution designed to handle the thermal demands of dual-processor systems in space-constrained environments. Engineered for optimal heat dissipation and efficiency, this cooler... | |
| The TC-SP7-4UM95 CPU Cooler is an advanced thermal management solution designed to provide superior cooling for high-density systems with multiple processors. With its efficient heat dissipation capabilities and space-saving design,... | |
| The TC-SP7-4US42 CPU Cooler is engineered to deliver superior cooling performance for multi-processor systems, particularly in high-density, space-limited environments. With advanced thermal management features, it ensures that processors remain cool... | |
| The CS-4189-1UW11 is a high-performance, two-way water cooling kit designed to efficiently cool dual TC-LGA4189 CPUs in demanding server environments. This liquid cooling solution is essential for maintaining optimal performance... | |
| The K800-104 wide-channel turbulence structure 104P offers several distinct advantages and features that make it a standout in the field of liquid cooling technology. One of its primary advantages is... | |
| The LGA 7529 is a CPU socket designed for high-performance Intel Xeon processors used in servers and workstations. With a power consumption of 350W, these processors require a robust and... | |
| The LGA7529 CPU cooler is designed for Intel server processors with the LGA 7529 socket. These coolers come in various designs, including active heat sink, passive cooler, and liquid cooler... | |
| The NVIDIA H100 Cold Plate by ToneCooling is a precision-engineered liquid cooling solution designed to manage the extreme heat generated by NVIDIA H100 GPUs. Built for data centers, AI training... | |
| The pump is integrated with the radiator using the welding technology, which reduces the manual joints and the risk of leakageThe size of the radiator can be flexibly adjusted to... | |
| The TC-LGA9324-2U-FA35 (FA35) is a next-generation 2U CPU cooler engineered for Intel’s LGA9324 socket (e.g., Xeon Ultra 9000 and upcoming Xeon Ultra Gaudi platforms). 1. Dual-Chamber EVAC Vapor System... | |
| The TC-LGA 7529 socket is designed for the latest generation of high-performance Intel Xeon processors, including the “Sierra Forest” series. These processors, aimed at cloud and HPC server applications, can... | |
| The TC-LGA 7529 socket is the platform for Intel’s latest high-performance Xeon processors, including the “Granite Rapids AP.” These processors are designed for demanding server and workstation applications. To maintain... | |
| The TC-LGA4189 CPU cooler is specifically designed for Intel Xeon processors, providing exceptional cooling performance for high-power applications. With a robust build and optimized design, this cooler is ideal for... | |
| The TC-LGA9324-1U-FA31 (FA31 for short) is a 1U ultra-thin, high-efficiency CPU cooler specifically designed for Intel’s LGA9324 socket (e.g., Xeon Ultra 9000 series). MTBF: >250,000 hours (per Telcordia SR-332... | |
| This active LGA4189 CPU cooler is designed for Intel Xeon processors on rectangular motherboards within 2U server environments, delivering efficient cooling with a copper base and aluminum fin design. AI... | |
| This active LGA4189 CPU cooler is engineered for efficient cooling of Intel Xeon processors on rectangular motherboards within 2U server environments, combining a high-speed fan with an aluminum fin design... | |
| This active TC-LGA4189 CPU cooler is designed for Intel Xeon processors on rectangular motherboards in 2U server environments and above. It delivers maximum cooling performance with a copper base, aluminum... | |
| This active TC-LGA4189 CPU cooler is designed for reliable cooling of Intel Xeon processors on rectangular motherboards within 2U server environments. It combines a copper base with aluminum fins, heat... | |
| This active TC-LGA4189 CPU cooler is engineered to provide reliable cooling for Intel Xeon processors in 1U server environments, using a copper vapor chamber (VC) base and copper fins to... | |
| This compact LGA4189 CPU cooler is designed for Intel Xeon processors in space-constrained server environments (rectangular motherboard), balancing size and cooling performance. ✅ Ultra-Quiet Operation: 45 dB(A) at full... | |
| This compact TC-LGA4189 CPU water cooler is designed for Intel Xeon processors in 1U server environments. Its full-copper construction ensures efficient heat dissipation in space-constrained applications. Copper Microchannel Cold Plate... | |
| This high-performance TC-LGA7529 CPU cooler is designed for Intel server processors utilizing the TC-LGA 7529 socket. It provides a balance of efficient cooling and quiet operation, making it an excellent... | |
| This high-performance TC-LGA7529-M98 CPU cooler is engineered for Intel server processors using the TC-LGA 7529-M98 socket, offering a balance of efficient cooling and quiet operation, ideal for 2U server environments. | |
| This low-profile TC-LGA4189 CPU cooler is designed for Intel Xeon processors, balancing a compact form factor with efficient cooling performance. It’s ideal for server environments where space is limited but... | |
| This TC-LGA7529-M95 CPU cooler is designed for Intel server processors that utilize the TC-LGA 7529-M95 socket. It balances thermal performance and noise level, making it suitable for various server environments. | |
| ToneCooling IGBT heat sink is made from AlSiC material and features a Pin-fin design, offering excellent thermal performance to efficiently reduce IGBT module temperatures and extend the lifespan of equipment. | |
| ToneCooling is a leading manufacturer of custom liquid cooling plates for high-end GPUs. Our flagship solution — the liquid cooling plate for RTX 5090 graphics card — is precision-engineered to... | |
| Water-block can be used as an ultra-thin structure for heat dissipation in some highly limited tight spaces. Few manual assembled and mature all- copper friction brazing proces to ensure zero... | |
| With the increasing power demands of today’s processors, reliable thermal solutions are essential for performance, stability, and longevity. The TC-LGA1700-V11 CPU Cooler is purpose-built for Intel’s LGA 1700 socket, offering... | |
| High Thermal Conductivity Efficiently transfers heat from the Eagle-Stream platform‘s CPUs or GPUs to the cooling fluid, ensuring effective heat dissipation for high-performance computing systems. Customizable Designs Available in... | |
| Adopt all-aluminum brazing process to ensure no leakage. Water-block can be used as an ultra-thin structure for heat dissipation in some highly limited tight spaces. Few manual assembled and greatly... | |
| Adopt pure copper brazing process to ensure no leakage. Water-block can be used as an ultra-thin structure for heat dissipation in some highly limited tight spaces. A copper pagoda-shaped spout,CNC... | |
| Adopt pure copper brazing process to ensure no leakage. Water-block can be used as an ultra-thin structure for heat dissipation in some highly limited tight spaces. The size of the... | |
| Adopting all copper brazing process to ensure no leakage; The ultra-thin structure of the water-cooled head can be applied to systems with limited height or compact space for cooling; CNC... | |
| AIO(All-In-One) structure is more suitable for modular management of server. Non-tube means leakage risk considerably reduces and the less evapotranspiration to be a long life . NLP (Non-Leaking Point) Tech:... | |
| AIO(All-In-One) structure is more suitable for modular management of server. Non-tube means leakage risk considerably reduces and the less evapotranspiration to be a long life. NLP (Non-Leaking Point) Tech: Few... | |
| GPU Liquid Cooling Modules High capacity tank can storage much more coolant to keep the lifetime be longer. Compact design on optimized density, no expanding the internal structure of case. | |
| High capacity tank can storage much more coolant to keep the lifetime be longer. Compact design on optimized density, no expanding the internal structure of case. Dual cold plates type... | |
| Mini Pc liquid cooling. High efficient heat exchange and pipeline . Scientific Structure, save space for mini PC . Easy to assemble . Heat absorption Hi-conductive components copper/aluminum Seal components... | |
| Multiple heat source solutions, total 4,000 Watt cooling capacity. Few manual assembled and mature brazing process guarantees zero leakage. Metal material means nominal evaporation and long working lifetime. High capacity... | |
| Non-tube design means conjunction leakage risks considerably eliminate. Patented design on optimized density, no espanding the caseinternal strructure. Ceramic bearing system in pump guarantees low noise and long working life... | |
| Placing the pump at the cold end can make the pump run at a lower temperature more conducive to the normal operation of the pump and extend the life of... | |
| Precise helium leakage testing system(HLTS) . Scientific Structure, save space for PC case.Easy to assemble . Liquid cooling solution for compact server case. 1. No Mechanical Pump: By eliminating the... | |
| Strict process control flow. Production in dust-free workshop with high cleanliness. High reliability, with dual pressure tests for gas and liquid. Even flow distribution. The manifold pipeline has self-locking and... | |
| The pump is integrated with the radiator using the welding technology, which reduces the manual joints and the risk of leakage. The size of the radiator can be flexibly adjusted... | |
| The pump is integrated with the radiator using the welding technology, which The size of the radiator can be flexibly adjusted to meet various specifications Ceramic bearing system in pump... | |
| The pump located on radiator reduces the impact of vibration on the CPU. Placing the pump at the cold end can make the pump run at a lower temperature more... | |
| The tank insided pump affords even-distributed waterflow with multi-connector to waterblocks creates our patents. Large tankstoraged more coolant keeps the long lifetime. Utilize the space inside the sever case reasonably... | |
| The water-cooled plate of the heat dissipation module is fixed by a combination of steel and aluminum, the steel plate is adhered to the chip, and the aluminum bracket is... | |
| Water-block can be used as an ultra-thin structure for heat dissipation in some highly limited tight spaces. Few manual assembled and mature all – copper friction brazing process to ensure... |