ToneCooling Technology Co., Ltd Datasheets for Heat Sinks
Heat sinks are thermally conductive, usually metallic components or devices that absorb and dissipate heat generated by electronic components such as computers. Common heat sink materials include aluminum, copper, and steel.
Heat Sinks: Learn more
| Product Name | Notes |
|---|---|
| Custom Heat Sink Solutions from Coolserver for Electronics Cooling CPU coolserver B6 The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling... | |
| At ToneCooling, we specialize in manufacturing high-quality aluminum heat sinks for effective passive cooling. As an experienced OEM manufacturer, we offer both standard and custom designs to fit your specific... | |
| CMC is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides. It was invented by Americans in the 1990s to solve... | |
| CMc is a sandwich composite sheet with a core material of molybdenum plate and oxygen-free copper plates on both sides.It was invented by Americans in the 1990s to solve the... | |
| Copper/Kovar/Copper, Copper/Invar/Copper, and Copper/Steel/Copper series products are similar to CMC and CPC series sandwich composite materials. They combine the high thermal conductivity of copper with the low thermal expansion coefficient... | |
| Diamond copper is a composite material made of diamond powder and a copper alloy. It utilizes high-quality artificial synthetic diamond powder, which boasts a thermal conductivity of about 1000W/M.K and... | |
| Heat Sink offers an advanced solution to computer heat management, ensuring that your system’s components run efficiently even under heavy workloads. ToneCooling focuses on precision and customization, offering high performance... | |
| Lasers come in many different qualities,and carbon dioxide lasers are stillused in certain specific situations. However, solid-state lasers are currently the main type, and semiconductorlasers are the most common. The... | |
| Molybdenum copper series is also a pseudo alloy. Molybdenum and copper are not miscible. It fully combines the high thermal conductivity, high melting point, low thermal expansion coefficient, and high... | |
| The BGA 2518 is a type of CPU socket used for Intel Xeon D processors. These processors are often found in embedded systems and other applications where space is at... | |
| This compact TC-LGA4189 CPU cooler combines a vapor chamber (VC) soaking plate with copper fins to provide efficient cooling for Intel Xeon processors in space-constrained server environments. It’s designed for... | |
| This compact TC-LGA4189 CPU cooler leverages vapor chamber (VC) technology to provide efficient cooling for Intel Xeon processors. It’s designed for space-constrained server environments requiring reliable thermal management. This cooler... | |
| ToneCooling delivers high-quality SSD heatsinks with customizable options, engineered to optimize performance and ensure stability through advanced thermal management. Features of Our SSD Heatsinks Premium Materials: Commonly crafted from... | |
| ToneCooling IGBT heat sink is made from AlSiC material and features a Pin-fin design, offering excellent thermal performance to efficiently reduce IGBT module temperatures and extend the lifespan of equipment. | |
| ToneCooling‘s copper heat sinks are designed to effectively manage heat in various applications. Copper is more efficient than aluminum at transferring heat, which makes it ideal for high-performance applications like... |