Dymax Datasheets for Encapsulants and Potting Compounds
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Encapsulants and Potting Compounds: Learn more
| Product Name | Notes |
|---|---|
| Conformal Coating with Secondary Moisture Cure Dual-cure 9481-E-PZ conformal coating is chemically resistant and free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO) and PIP 3:1. It is a UV/Visible light- and moisture-cure... | |
| High-Performance Conformal Coating with Secondary Moisture Cure Dual-cure 9483-Z conformal coating is free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO). It cures tack-free upon exposure to UV/Visible light and then with ambient... | |
| Dual-cure 9014 encapsulant is formulated to cure primarily with UV light and includes a secondary moisture curing function for applications where shadow areas exist on printed circuit boards. Curing in... | |
| Dual-Cure 9101 light/moisture-cure encapsulant is an improved, resilient, chip-encapsulating material designed with a UV/Visible light and secondary ambient moisture-cure system, making it ideal for encapsulation applications where shadowed areas are... | |
| Dual-Cure 9103 encapsulant is a resilient light/moisture-cure chip-encapsulating material. 9103 cures first upon exposure to UV/Visible light, then with ambient moisture over time for areas on PCBs where shadow areas... | |
| Dual-cure 9210-W electronic encapsulant is designed for FPC reinforcement, selective coating, and component encapsulation applications in consumer wearable devices. The product cures with light energy first and then ambient moisture... | |
| Dymax 9008 is engineered for chip encapsulation on flex circuits cures upon exposure to UV/Visible light and is designed for rapid chip encapsulation in chip-on-board or chip-on-flex printed circuit board... | |
| Dymax 9309-SC adhesive cures upon exposure to UV/Visible light to quickly ruggedize circuit board components. This edgebond material is ideal for applications where shock attenuation or ruggedization is necessary. The... | |
| Dymax dual-cure 9102 is an improved, resilient, chip-encapsulant material designed with a UV/visible light and secondary ambient moisture-cure system, making it ideal for encapsulation applications where shadowed areas are present. | |
| Dymax Multi-Cure® 9001-E-V3.1 encapsulant cures in seconds to enhance moisture, thermal cycle, and abrasion resistance of electronic and microelectronic assemblies. This material offers adhesion to various component substrates. The... | |
| Dymax Multi-Cure® 921-GEL is designed for rapid rigid adhesive bonding and shallow potting (0.25 in/6mm) in a wide variety of substrates including metal, glass, ceramic, and many thermoset plastics. | |
| Dymax Multi-Cure® 921-VT is a high-tensile-strengt h, UV-curable resin that is especially well suited when rigid adhesive bonds or potted areas are desired. Multi-Cure® 921-VT was designed to... | |
| Dymax Multi-Cure® 984-LVUF conformal coating is a fluorescing, single-component material formulated with no solvents added for rapid room-temperature cure when exposed to UV light. This coating has a secondary... | |
| Multi-Cure® 9001-E-V3.0 is a performance grade with improved moisture and thermal cycle resistance and adhesion to various component substrates. Curing completely in as little as 5 seconds upon exposure... | |
| Multi-Cure® 9037-F is a resilient chip encapsulant designed for applications where a thixotropic, high-viscosity encapsulant or a damming material is required. This is often the case for conventional glob... | |
| Multi-Cure® 921-T is a high-tensile-strengt h, UV-curable resin that is especially well suited when rigid adhesive bonds or potting areas are desired. Multi-Cure® 921-T was designed to bond... | |
| UV Light + moisture cure 9201-W electronic encapsulant is a next-generation product formulated without materials of concern such as IBOA (isobornyl acrylate), a known skin sensitizer. This encapsulant utilizes low-sensitizing... |