ACCRAbond, Inc. Datasheets for Encapsulants and Potting Compounds
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Encapsulants and Potting Compounds: Learn more
| Product Name | Notes |
|---|---|
| INSTAbond® 838 A low-viscosity, very flowable formula. Excellent adhesion to most substrates. | |
| INSTAbond® 803 A low viscosity two-component general purpose electrical encapsulant/molding compound that is designed for applications requiring high-impact strength, thermal shock resistance, good corrosion resistance, and good water resistance. INSTAbond® | |
| INSTAbond® 806 A two-component low-viscosity epoxy that is designed for general potting and encapsulation. | |
| INSTAbond® 807 An epoxy electrical encapsulant that meets V-0 flammability rating and has excellent electrical properties. Low shrinkage and low thermal expansion to maximize adhesion and reduce mechanical stress on... | |
| INSTAbond® 808 A two-component general purpose potting compound for electrical components. Properties include enhancement of mecahnical strength, low dielectrics, vibration and shock resistance of assembled components. | |
| INSTAbond® 808LV A general purpose epoxy encapsulant that features good electrical and mechanical properties for applications requiring low viscosity or higher flow properties. | |
| INSTAbond® 809FR INSTAbond® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond® 809 FR meets the requirements for UL-94 V-0 rating for... | |
| INSTAbond® 812 A low viscosity, two part epoxy system that is for all types of room temperature curing adhesive applications including Casting, Encapsulating and 100% solids coatings that require cure... | |
| INSTAbond® 812FR A low viscosity, two part, UL94 V0 epoxy system that is for all types of room temperature curing adhesive applications including Casting, Encapsulating and 100% solids coatings that... | |
| INSTAbond® 813 INSTAbond® is a general purpose electrical encapsulating and potting compound designed for applications requiring low exotherm and large masses with pot lives in excess of 2 hours. It... | |
| INSTAbond® 814 A two part, electrical grade epoxy system designed for casting and encapsulation applications and 100% solids coatings that cure at room temperature or with an elevated temperature cure. | |
| INSTAbond® 826 A low viscosity, two-component epoxy compound that cures at room temperature. High flexibility, high impact resistance, thermal shock, water/chemical resistance, and good mechanical properties. Wicking and air release... | |
| INSTAbond® 850 One part heat cure aluminum filled epoxy. | |
| Casting resin. When cured with any of the hardeners presented below, these systems possess low viscosity, low shrinkage, low exotherm, excellent resistance to thermal shock, good electrical properties and hardnesses. | |
| CONAP® CE-1170 is a single-component air drying room temperature curing acrylic conformal coating that meets the requirements of MIL-I-46058-C for Type AR coatings. | |
| CONAP® CE-1171 is a single-component acrylic conformal coating that has been formulated in Rule 66 exempt solvents and meets the latest requirements of MIL-I-46058-C for Type AR. | |
| CONAPOXY® FR-1046 is a low cost, epoxy potting and casting system. Major characteristics include: low viscosity, low shrinkage, low exotherm, excellent resistance to thermal shock, and very good electrical insulation... | |
| CONAPOXY® FR-1047 is an inexpensive, flame retardant, non-abrasive epoxy potting and casting system. It has excellent resistance to thermal shock, low exotherm, and good electrical properties, typified by very good... | |
| CONAPOXY® FR-1080 is a two-part high temperature epoxy potting system designed to meet Class H (180°C) operating requirements. | |
| CONAPOXY® FR-1210 is a filled epoxy potting casting resin. When cured with any of the hardeners listed below, systems possessing low shrinkage, low coefficient of expansion, good resistance to mechanical... | |
| CONAPOXY® FR-1274 is a two-component, low exotherm, flame retardant, long pot life epoxy potting and casting system with excellent handling properties. Because of its excellent thermal shock resistance, CONAPOXY® FR-1274... | |
| CONAPOXY® FR-1610 with CONACURE® EA-039 is a high performance flexible epoxy potting and encapsulating system. Flexibility has been built into the cured compound without degradation of electrical properties at elevated... | |
| CONAPOXY® FR-1612-1 with CONACURE® EA-039 is a high performance flexible epoxy potting and encapsulating system. Flexibility has been built into the cured compound without degradation of electrical properties at elevated... | |
| CONAPOXY® FR-1810 is a flexible two-component, low exotherm, flame retardant, long pot life epoxy potting and casting system with excellent handling properties. CONAPOXY FR-1810 is filled with a non-abrasive filler... | |
| CONAPOXY® FR-1820 is a two component, flame retardant, short pot life epoxy potting and casting system with excellent handling properties. CONAPOXY® FR-1820 is filled with a non abrasive filler to... | |
| CONAPOXY® FR-1830 is an ambient cure two component, low viscosity, flame retardant epoxy potting, casting and coating system with excellent handling properties. CONAPOXY® FR-1830 is filled with a non abrasive... | |
| CONAPOXY® RN-1000 is a diluted epoxy potting and casting resin. When CONAPOXY® RN-1000 is cured with the hardeners listed below, these systems possess low shrinkage, low exotherm, good thermal shock... | |
| CONAPOXY®FR-1273 is a two-component, low exotherm, long pot life epoxy potting and casting system with excellent handling properties. Because of it's excellent thermal shock resistance, CONAPOXY® FR-1273 is recommended for... | |
| CONATHANE® FP-1303 White or Amber is a two-component, unfilled, fast setting polyurethane sealant designed for use in HEPA and other air filtration devices. CONATHANE ® FP-1303 is also used for... | |
| CONATHANE® CE-1155 is a two-component, solvent-based polyurethane printed circuit board coating designed for use in adverse environments. CE-1155 provides outstanding resistance to moisture and good abrasion resistance. | |
| CONATHANE® CE-1155-35 is a two-component, high-performance, solvent-based polyurethane coating system for protecting circuit assemblies in adverse environments. | |
| CONATHANE® CE-1164 is a single-component, air drying, room temperature curing, polyurethane conformal coating which meets the requirements of MIL-I-46058-C for Type UR coatings and appears on the Qualified Products List... | |
| CONATHANE® CE-1175 is a single-component water based polyurethane conformal coating that meets the requirements of MIL-I-46058-C Type UR. | |
| CONATHANE® UF-3 is a unique polyurethane foam characterized by low vapor pressure. UF-3 is unaffected by grease, oils, and most solvents. Also, it is ozone resistant, has excellent insulation characteristics,... | |
| CONATHANES® EN-2541 and EN-2543 are filled, flame resistant polyurethane resins, specially formulated for general purpose electrical/electroni c potting, casting and encapsulation. When tested in accordance with UL-94, flame resistance ratings... | |
| CS 3100 is used for potting and sealing electrical connectors and components for protection from moisture, fuels, dirt and other contaminants. CS 3100 is a two-part polysulfide component that cures... | |
| CS 3104 M will protect electrical connections from corrosion by atmospheric moisture. Its low adhesive strength makes it possible to remove the encapsulating material from the connections. Bonding to the... | |
| CS 3105 is a thixotropic type, adhesive sealing compound Suitable for use in edge seal encapsulation. CS 3105 is a two-part, polysulfide base compound that cures at room temperature to... | |
| INSTAbond® M810 -- a two-part epoxy compound that is used in potting, casting, encapsulation, adhesive and coatings applications. Key benefits include excellent adhesion, good water resistance, good toughness and flexibility. | |
| INSTAbond® M810-1 -- a two-part, epoxy compound that is used in potting, casting, encapsulation, adhesive and coatings applications Key benefits include excellent adhesion, good water resistance, good toughness and flexibility. | |
| INSTAbond® M810B -- a two-part, black epoxy compound formulated to the requirements of DWG # B5-81-159 that is used in potting, casting, encapsulation, adhesive and coatings applications Key benefits include... |