GS Polymers, Inc. Datasheets for Encapsulants and Potting Compounds

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Encapsulants and Potting Compounds: Learn more

Product Name Notes
Two part, 1:1, optically clear soft, water and UV resistant
Two part, 1:1, provides low stress on internal components, long open time
Two part, 1:1, thermal conductive compound, available in cartridges
Two part, 1:2 cost-effective general purpose potting system
Two part, 1:2, 1-2 hours working time, water resistant, excellent adhesion
Two part, 1:2, fast cure, provides superior adhesion to vinyl
Two Part, 1:2, gels quickly, water resistant, excellent adhesive
Two part, 2:1 optically clear hard
Two part, excellent impact resistance, heat cure
Two part, general purpose potting compound and adhesive