Dampney Company, Inc. Datasheets for Encapsulants and Potting Compounds

Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Encapsulants and Potting Compounds: Learn more

Product Name Notes
Hi-Temp Lab-metal is ready-to-use right from the can. Developed for difficult repairs subject to excessive heat, Hi-Temp Lab-metal withstands temperatures as high as 1000ºF.
Ready-to-use metal repair putty, dent filler and patching compound. Durable metal filler for fast, permanent repairs. A unique, quality problem-solver! Lab-metal ready-to-use repair compound spreads like paste and hardens quickly...