Hernon Manufacturing, Inc. Datasheets for Encapsulants and Potting Compounds
Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Encapsulants and Potting Compounds: Learn more
| Product Name | Notes |
|---|---|
| Hernon 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond | |
| Tuffbond® 302 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 302 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy... | |
| Tuffbond® 304 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 304 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy... | |
| Tuffbond® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy... | |
| Tuffbond® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond® 313 is recommended for bonding metals, wood, ceramics, etc., and can... | |
| Tuffbond® 315 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond® 315 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is... | |
| Tuffbond® 316 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a... | |
| Tuffbond® 317 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a... | |
| Tuffbond® 42121 is a thixotropic and modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 42121 exhibits very good moisture chemical and heat resistance. This very fast... | |
| Tuffbond® 65891 is a two-component, room temperature cure system. Tuffbond® 65891 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of... |