MacDermid Alpha Electronics Solutions ALPHA ® WS698CPS Solder Paste

Description
High-activity, water-soluble lead-free solder paste offers high yields, low voiding, and excellent residue cleaning performance. Product Overview ALPHA WS-698CPS is a high-activity solder paste formulated for a broad range of stencil printing applications, including surface mount and solder bumping processes. Its outstanding reflow process window enables reliable soldering on CuOSP with excellent coalescence across varying deposit sizes, strong resistance to random solder balls, and robust mid-chip solder ball performance. The paste provides consistent fine-pitch printing and is compatible with solder powder sizes ranging from T4 to T5.
Request a Quote
Description
High-activity, water-soluble lead-free solder paste offers high yields, low voiding, and excellent residue cleaning performance. Product Overview ALPHA WS-698CPS is a high-activity solder paste formulated for a broad range of stencil printing applications, including surface mount and solder bumping processes. Its outstanding reflow process window enables reliable soldering on CuOSP with excellent coalescence across varying deposit sizes, strong resistance to random solder balls, and robust mid-chip solder ball performance. The paste provides consistent fine-pitch printing and is compatible with solder powder sizes ranging from T4 to T5.
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
ALPHA ® WS698CPS Solder Paste -  - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
ALPHA ® WS698CPS Solder Paste
ALPHA ® WS698CPS Solder Paste
High-activity, water-soluble lead-free solder paste offers high yields, low voiding, and excellent residue cleaning performance. Product Overview ALPHA WS-698CPS is a high-activity solder paste formulated for a broad range of stencil printing applications, including surface mount and solder bumping processes. Its outstanding reflow process window enables reliable soldering on CuOSP with excellent coalescence across varying deposit sizes, strong resistance to random solder balls, and robust mid-chip solder ball performance. The paste provides consistent fine-pitch printing and is compatible with solder powder sizes ranging from T4 to T5.

High-activity, water-soluble lead-free solder paste offers high yields, low voiding, and excellent residue cleaning performance.

Product Overview

ALPHA WS-698CPS is a high-activity solder paste formulated for a broad range of stencil printing applications, including surface mount and solder bumping processes.

Its outstanding reflow process window enables reliable soldering on CuOSP with excellent coalescence across varying deposit sizes, strong resistance to random solder balls, and robust mid-chip solder ball performance. The paste provides consistent fine-pitch printing and is compatible with solder powder sizes ranging from T4 to T5.

Supplier's Site

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Soldering Irons, Stations, and Accessories
Product Name ALPHA ® WS698CPS Solder Paste
Unlock Full Specs
to access all available technical data

Similar Products

ALPHA ® WS9180-MHV Flux -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
View Details
Kester ® TSF-6522RH Flux -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
View Details
ALPHA ® Argomax ® 2141 Paste -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
View Details