Protavic America, Inc. Datasheets for Electrical and Electronic Resins
Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications.
Electrical and Electronic Resins: Learn more
| Product Name | Notes |
|---|---|
| Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available... | |
| Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm°K thermal performance with supporting laser flash data. Room temperature cure. | |
| Filled epoxy system. Excellent chemical and heat resistance. Excellent for stencil and screen bonding due to its high strength fast cure at low temperatures. | |
| Filled epoxy system. Very high performance material designed for difficult bonding applications. This material will bond to stencil foil without holes and can withstand high heat and harsh chemical environments. | |
| Filled one-part system with 30 days of storage at room temperature. Electronics grade, offers excellent bond strength while dissipating heat up to 1Wm°K. Often used as a die & | |
| Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing. | |
| Silver filled epoxy system for coating tantalum capacitor slugs. This product offers ideal protection from moisture and excellent high temperature operation. Consistent operation of 175C is typical. The product is... | |
| Silver filled epoxy system for tantalum & ceramic termination coating. This product is commonly used for flexible termination of capacitors and offers high strength and flexibility. This product is the... | |
| Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast... | |
| Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachsuch as RFID isotropic applications and can be dispensed, printed... | |
| Two part Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the assembly ofnon heat cure products and can be used for... | |
| A silver filled, fast curing, solvent-free, single component electroconductive adhesive with a high silver content for LED applications. It has a pot life of 2 days and its rheology is... | |
| A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. | |
| A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. Its good fluidity enables it to flow at 20°C into cavities about... | |
| Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and... | |
| ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is... | |
| ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electroni c casting and encapsulating... | |
| ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued... | |
| ANE-57103 is a toughened two part adhesive. ANE-57103 is used for high speed bonding even at lower temperatures. ANE-57103is specifically developed for bonding difficult substrates such as glass, ceramics, metals... | |
| Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist... | |
| Clear unfilled epoxy in a one-part system that can be stored at room temperature for up to 6 months. This material is excellent for ferrite and ceramic bonding applications. Non-hazardous... | |
| Epoxy system commonly used as an underfill material. This material is designed to survive extreme heat and can be used on various sized BGA devices. It can be used... | |
| Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. | |
| Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap... | |
| PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and... | |
| PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid... | |
| PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread... | |
| PNU-46202™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. | |
| PNU-46203™ is an electronics grade, two-component polyurethane adhesive or encapsulant for high temperature resistance. PNU-46203™ is designed for the encapsulation by casting of completed circuit boards. Cured PNU-46203™ is expected... | |
| PNU-56200™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. | |
| PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ | |
| PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance... | |
| PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are... | |
| PTS-46323™ is a two-component ONE TO ONE MIX RATIO silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity,... | |
| PVIC ACE24511 electrically conductive die attach adhesive is specially designed for tantalum condenser application. This single component, fast cure adhesive also can be snap cured in hot plate or in-line... | |
| PVIC ACE34030 electrically conductive die attach adhesive is designed for high reliability semiconductor or LED packaging application. This high purity adhesive has been engineered for use in high throughput in-line... | |
| PVIC ACE34033 electrically conductive die attach adhesive is designed for high reliability semiconductor packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach... | |
| Single component resin with very low linear expansion of 10 ppm per degree and high ionic purity for protecting semi-conductor silicon crystals, in particularly BGA. | |
| Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic... | |
| The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids... | |
| The PROTAVIC® PNE 40824-A and PROTAVIC® PNE 40824-B is a two-component system, solvent free, electrically insulating epoxy adhesive, which is specially designed for protecting the devices from heat, humidity and... | |
| The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of... | |
| The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit boards. When applied in thin layers, < 0.01� it... |