Epoxy system commonly used as an underfill material. This material is designed to survive extreme heat and can be used on various sized BGA devices. It can be used for STB underfill protection applications.
| Protavic America, Inc. | |
|---|---|
| Product Category | Industrial Adhesives |
| Product Number | ANE-10931 |
| Product Name | Fast Flow, Fast Cure Epoxy Adhesive |
| Cure / Technology | Thermoset; Single Component |
| Chemical System | Epoxy |
| Type / Form | Gel |
| Features | High Dielectric |
| Substrate Compatibility | Ceramic, Glass; Metal; Plastic |
