Protavic America, Inc. Datasheets for Thermoset Adhesives
Thermoset adhesives are crosslinked polymeric resins that are cured using heat and/or heat and pressure. They are used for high load assemblies and in severe service conditions.
Thermoset Adhesives: Learn more
| Product Name | Notes |
|---|---|
| Epoxy Adhesive -- ANE-46505 | Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available... |
| Room Temp Curing Epoxy Adhesive -- ATE-46446 | Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm°K thermal performance with supporting laser flash data. Room temperature cure. |
| Epoxy Adhesive -- ANE-47927 | Filled epoxy system. Excellent chemical and heat resistance. Excellent for stencil and screen bonding due to its high strength fast cure at low temperatures. |
| Epoxy Adhesive -- ANE-47932 | Filled epoxy system. Very high performance material designed for difficult bonding applications. This material will bond to stencil foil without holes and can withstand high heat and harsh chemical environments. |
| Thermo-Conducting Epoxy Adhesive -- ATE-10120 | Filled one-part system with 30 days of storage at room temperature. Electronics grade, offers excellent bond strength while dissipating heat up to 1Wm°K. Often used as a die & |
| Non-Conductive Insulating Epoxy Resin -- ANE-10932 | Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing. |
| Electro-Conductive Epoxy Varnish -- BCE-60462 (formerly C3462 LV) | Silver filled epoxy system for coating tantalum capacitor slugs. This product offers ideal protection from moisture and excellent high temperature operation. Consistent operation of 175C is typical. The product is... |
| Electro-Conductive Epoxy Varnish -- BCE-30370 (formerly C 370) | Silver filled epoxy system for tantalum & ceramic termination coating. This product is commonly used for flexible termination of capacitors and offers high strength and flexibility. This product is the... |
| Electro-Conductive Epoxy Adhesive -- ACE-10131 | Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast... |
| Electro-Conductive Epoxy Adhesive -- ACE-60705 | Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachsuch as RFID isotropic applications and can be dispensed, printed... |
| Electro-Conductive Epoxy Adhesive -- ACE-40010AB | Two part Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the assembly ofnon heat cure products and can be used for... |
| Electro-Conductive Epoxy Adhesive -- ACE-30510 | A silver filled, fast curing, solvent-free, single component electroconductive adhesive with a high silver content for LED applications. It has a pot life of 2 days and its rheology is... |
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Epoxy Adhesive -- PNE-30270
Filled Epoxy Cast -- PNE-30270 |
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. |
|
Epoxy Adhesive -- PNE-30273
Filled Epoxy Cast -- PNE-30273 |
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. Its good fluidity enables it to flow at 20°C into cavities about... |
| Epoxy Adhesive -- ANE-46515 | Amber epoxy system for high strength applications. Bonds well to metals, plastics and wood. Can be use as a general- purpose adhesive. 20-minute gel time. Available in colors and... |
| UV Potting Material -- ANA-97174 | ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is... |
| Optically Clear UV Adhesive -- ANA-97290 | ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications... |
| Clear UV Adhesive -- ANA-97773 | ANA-97773 is a very fast curing adhesive that is fully cured and at its ultimate hardness in seconds. Other similar UV materials continue to harden for several minutes causing continued... |
| High Speed Epoxy Adhesive -- ANE-57103 | ANE-57103 is a toughened two part adhesive. ANE-57103 is used for high speed bonding even at lower temperatures. ANE-57103is specifically developed for bonding difficult substrates such as glass, ceramics, metals... |
| Epoxy Adhesive -- ANE-26144 | Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist... |
| Heat Cure Epoxy Adhesive -- ANE-17794 | Clear unfilled epoxy in a one-part system that can be stored at room temperature for up to 6 months. This material is excellent for ferrite and ceramic bonding applications. Non-hazardous... |
| Fast Flow, Fast Cure Epoxy Adhesive -- ANE-10931 | Epoxy system commonly used as an underfill material. This material is designed to survive extreme heat and can be used on various sized BGA devices. It can be used... |
| Epoxy Adhesive -- ANE-20904 | Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging. |
| Reworkable Underfill Epoxy Resin -- ANA-10199R | Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap... |
| Epoxy Potting/Sealant -- PNE-47207 | PNE-47207™ is an adhesive/sealant and potting compound. PNE-47207™ is designed to provide air free potting and casting of electronic devices. PNE-47207™ will bond difficult substrates such as glass, ceramics, and... |
| Clear Non-Yellowing Silicone Encapsulant -- PNS-56225 | PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid... |
| Urethane Adhesive/Encapsulant -- PNU-46220 | PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread... |
| Urethane Cast Adhesive -- PNU-46202 | PNU-46202™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. |
| Urethane Cast/Adhesive -- PNU-46203 | PNU-46203™ is an electronics grade, two-component polyurethane adhesive or encapsulant for high temperature resistance. PNU-46203™ is designed for the encapsulation by casting of completed circuit boards. Cured PNU-46203™ is expected... |
| Polyurethane Adhesive -- PNU-56200 | PNU-56200™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. |
| Epoxy Cast -- PTE-36977 | PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ |
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Silicone Adhesive -- PTS-46303
Silicone Encapsulant -- PTS-46303 |
PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance... |
|
Silicone Adhesive -- PTS-46313
Silicone Encapsulant -- PTS-46313 |
PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are... |
| Silicone Encapsulant -- PTS-46323 | PTS-46323™ is a two-component ONE TO ONE MIX RATIO silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity,... |
| Electro-Conductive Epoxy Adhesive -- ACE-24511 | PVIC ACE24511 electrically conductive die attach adhesive is specially designed for tantalum condenser application. This single component, fast cure adhesive also can be snap cured in hot plate or in-line... |
| Electro-Conductive Epoxy Adhesive -- ACE-34030 | PVIC ACE34030 electrically conductive die attach adhesive is designed for high reliability semiconductor or LED packaging application. This high purity adhesive has been engineered for use in high throughput in-line... |
| Electro-Conductive Epoxy Adhesive -- ACE-34033 | PVIC ACE34033 electrically conductive die attach adhesive is designed for high reliability semiconductor packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach... |
| Filled Epoxy Cast -- PNE-20262 | Single component resin with very low linear expansion of 10 ppm per degree and high ionic purity for protecting semi-conductor silicon crystals, in particularly BGA. |
| Non Conductive Epoxy Adhesive -- ANE-10700 | Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic... |
| Conductive Hybrid Adhesive -- ACH-20120 | The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids... |
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Filled Epoxy Cast Adhesive -- PNE-40824-A
Filled Epoxy Cast Adhesive -- PNE-40824-B |
The PROTAVIC® PNE 40824-A and PROTAVIC® PNE 40824-B is a two-component system, solvent free, electrically insulating epoxy adhesive, which is specially designed for protecting the devices from heat, humidity and... |
| Clear Urethane Cast/Adhesive -- PNU-46201 | The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of... |
| Filled Urethane Cast/Adhesive -- PTU-46201 | The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit boards. When applied in thin layers, < 0.01� it... |