Protavic America, Inc. Datasheets for Thermal Compounds and Thermal Interface Materials

Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
Thermal Compounds and Thermal Interface Materials: Learn more

Product Name Notes
Room Temp Curing Epoxy Adhesive -- ATE-46446 Filled epoxy system for high thermal applications such as heat-sink bonding. This material has 2.2 Wm°K thermal performance with supporting laser flash data. Room temperature cure.
Thermo-Conducting Epoxy Adhesive -- ATE-10120 Filled one-part system with 30 days of storage at room temperature. Electronics grade, offers excellent bond strength while dissipating heat up to 1Wm°K. Often used as a die &
Non-Conductive Insulating Epoxy Resin -- ANE-10932 Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.
Electro-Conductive Epoxy Varnish -- BCE-60462 (formerly C3462 LV) Silver filled epoxy system for coating tantalum capacitor slugs. This product offers ideal protection from moisture and excellent high temperature operation. Consistent operation of 175C is typical. The product is...
Electro-Conductive Epoxy Varnish -- BCE-30370 (formerly C 370) Silver filled epoxy system for tantalum & ceramic termination coating. This product is commonly used for flexible termination of capacitors and offers high strength and flexibility. This product is the...
Electro-Conductive Epoxy Adhesive -- ACE-10131 Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture of tantalum capacitors and can be dispensed or printed. It offers fast...
Electro-Conductive Epoxy Adhesive -- ACE-60705 Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the manufacture die attachsuch as RFID isotropic applications and can be dispensed, printed...
Electro-Conductive Epoxy Adhesive -- ACE-40010AB Two part Silver filled epoxy system with excellent conductivity and thermal properties. This product is commonly used for the assembly ofnon heat cure products and can be used for...
Electro-Conductive Epoxy Adhesive -- ACE-30510 A silver filled, fast curing, solvent-free, single component electroconductive adhesive with a high silver content for LED applications. It has a pot life of 2 days and its rheology is...
Epoxy Adhesive -- PNE-30270
Filled Epoxy Cast -- PNE-30270
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.
Epoxy Adhesive -- PNE-30273
Filled Epoxy Cast -- PNE-30273
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. Its good fluidity enables it to flow at 20°C into cavities about...
Epoxy Adhesive -- ANE-20904 Epoxy system designed for underfill applications. This material is fast flowing and provides excellent properties for common device packaging.
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225 PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid...
Epoxy Cast -- PTE-36977 PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™
Silicone Adhesive -- PTS-46303
Silicone Encapsulant -- PTS-46303
PTS-46303 A/B™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance...
Silicone Adhesive -- PTS-46313
Silicone Encapsulant -- PTS-46313
PTS-46313 is a one-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are...
Electro-Conductive Epoxy Adhesive -- ACE-24511 PVIC ACE24511 electrically conductive die attach adhesive is specially designed for tantalum condenser application. This single component, fast cure adhesive also can be snap cured in hot plate or in-line...
Electro-Conductive Epoxy Adhesive -- ACE-34030 PVIC ACE34030 electrically conductive die attach adhesive is designed for high reliability semiconductor or LED packaging application. This high purity adhesive has been engineered for use in high throughput in-line...
Electro-Conductive Epoxy Adhesive -- ACE-34033 PVIC ACE34033 electrically conductive die attach adhesive is designed for high reliability semiconductor packaging application. This high purity adhesive has been engineered for use in high throughput in-line die attach...
Filled Epoxy Cast -- PNE-20262 Single component resin with very low linear expansion of 10 ppm per degree and high ionic purity for protecting semi-conductor silicon crystals, in particularly BGA.
Non Conductive Epoxy Adhesive -- ANE-10700 Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic...
Conductive Hybrid Adhesive -- ACH-20120 The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids...
Filled Epoxy Cast Adhesive -- PNE-40824-A
Filled Epoxy Cast Adhesive -- PNE-40824-B
The PROTAVIC® PNE 40824-A and PROTAVIC® PNE 40824-B is a two-component system, solvent free, electrically insulating epoxy adhesive, which is specially designed for protecting the devices from heat, humidity and...