Protavic America, Inc. Non Conductive Epoxy Adhesive ANE-10700

Description
Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic machines. It presents a one day pot life at 20-25C, a high reactivity at medium temperature and a high purity. It exhibits an excellent thermal stability and a low humidity uptake.
Datasheet
Description
Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic machines. It presents a one day pot life at 20-25C, a high reactivity at medium temperature and a high purity. It exhibits an excellent thermal stability and a low humidity uptake.
Datasheet

Suppliers

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Description
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Non Conductive Epoxy Adhesive - ANE-10700 - Protavic America, Inc.
Londonderry, NH, USA
Non Conductive Epoxy Adhesive
ANE-10700
Non Conductive Epoxy Adhesive ANE-10700
Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic machines. It presents a one day pot life at 20-25C, a high reactivity at medium temperature and a high purity. It exhibits an excellent thermal stability and a low humidity uptake.

Skip cure non conductive epoxy adhesive used for the bonding of microchips on RFID antennas. The rheology of PROTAVIC ANE 10700 has been developed for application by micro-dispenser using automatic machines.

It presents a one day pot life at 20-25C, a high reactivity at medium temperature and a high purity. It exhibits an excellent thermal stability and a low humidity uptake.

Supplier's Site Datasheet

Technical Specifications

  Protavic America, Inc.
Product Category Industrial Adhesives
Product Number ANE-10700
Product Name Non Conductive Epoxy Adhesive
Cure / Technology Thermoset; Single Component
Chemical System Epoxy
Type / Form Liquid
Features High Dielectric; Thermally Conductive
Substrate Compatibility Ceramic, Glass; Metal; Plastic
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