Smiths Interconnect, a Molex company Datasheets for IC Sockets and Headers
IC sockets and headers are board-mounted female connectors that serve as carriers for integrated circuit (IC) chips.
IC Sockets and Headers: Learn more
| Product Name | Notes |
|---|---|
| C-Series H-Pin® Socket is a modular burn-in socket with clamshell-style lid. The small footprint outline allows for a best-in-class range of package accommodations, from 0.5 mm body size up... | |
| Celsius test sockets feature a wiping contact technology perfect for QFN testing. The elastomer is utilized for load board compliance only and allows the contact to be cycled in temperature... | |
| Customized test sockets for any IC packages. Suitable for lab, Engineering, SLT & ATE test application. Wide selection of Smiths Interconnects spring pins with low and stable contact resistance. World... | |
| D-Series H-Pin® Socket is a performance burn-in socket, with a clamshell-style lid that can be equipped with a heater and thermal sensor. The D-Series line shares the same configurable... | |
| ES family Series of sockets extended the scope of a burn-in socket. The modular lid construction can handle up to 1 kW of power and is optimized with thermal simulation... | |
| ES Micro Series Socket is a technological advancement in the burn-in socket segment, with a dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is... | |
| ESJ Series socket is a high-performance burn-in socket, with dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated. The patented H-Pin contact technology... | |
| Galileo is an innovative, low-profile test socket that provides outstanding electrical and mechanical performance for IC test customers who need a cost effective, rapid delivery solution. Combining a universal interconnect... | |
| Gutenberg sockets address requirements of the most advanced strip test applications. They are designed for million cycle reliability and are particularly well suited to the aggressive auto-clean technologies prevalent in... | |
| Highly precised top and bottom array simultaneous test capable socket for effective package on package test. Customized socket design is capable to test high speed signals in lab, engineering, SLT... | |
| IC developers are increasingly integrating functionalities within a single package, escalating the complexity of test. Higher speed digital and analog devices are being manufactured at record volumes and the need... | |
| M-Series socket has long been the gold standard for reliability and out-of-the-box performance burn-in sockets. The high-quality components have been refined and enhanced over their lifetime for optimum performance and... | |
| Smiths Interconnect has taken a leadership role in designing and developing socket solutions for the newest QFN packages such as MLF, BCC, and LPCC. These sockets offer a modular design... | |
| Smiths Interconnect offers high value Thermal Management Lid capabilities including air-chilled or liquid cooled technology, capable of dissipating up to 650 Watts. Our solutions are developed to be compatible with... | |
| The DaVinci 112 test socket extends the 'DaVinci’ Series with an innovative solution for testing the most complex functionality of ASICs (Application Specific Integrated Circuits). Testing these devices at full... | |
| The K-Series socket is designed to apply flat even pressure on the DUT with a secondary lever once the lid has been closed. This is to ensure that the platen... | |
| The Kepler contact technology combines the scrub motion of a cantilever contact with the versatility and modularity of a spring probe. The design includes horizontal movement during the downward stroke... | |
| The Levan Elastomeric socket family is engineered specifically with precision. The elastomeric grid of Levan features conductive columns that guarantee accurate and consistent test results across a spectrum of devices. | |
| The next generation of high-performance semiconductors—from advanced Consumer SoCs and GPUs to AI Accelerators and Data Center processors demands unprecedented bandwidth and speed. Yet as data rates climb, ensuring signal... | |
| The Q-Series socket is available for mid to large package sizes. The Q-Series is a fully molded socket body and lid designed to meet the rigors of a wide variety... | |
| The R-Series product line is an open-top reliability socket used for accelerated life testing. With versions of the compression mount open-top design available as a drop-in replacement for other legacy... | |
| The rapid expansion of connected devices and data-intensive applications are driving the growing demand for highly efficient and adaptive high-performance computing solutions. Whether it’s a complex SoC for a mobile... |