Smiths Interconnect, a Molex company C-Series H-Pin® Socket: Accelerated life testing solution

C-Series H-Pin® Socket is a modular burn-in socket with clamshell-style lid. The small footprint outline allows for a best-in-class range of package accommodations, from 0.5 mm body size up to 12 mm and optimal socket density per burn-in board. Features & Benefits Design flexibility, in-house tooling and molds allow for lowest cost of test. Extensive catalog of standard components reduces cost and lead-time. ≥0.35 pitch accommodates a wide variety of application needs. Optimized thermal profile to end-use specification Feature options LCC,QFP, QFN, LGA, BGA, and WLCSP Spring-loaded plunger Heat sink HAST venting features Integrated thermal control with heater and sensor Reverse seating plane Package inserts for a variety of sizes High temperature materials for above 200 °C applications