The DaVinci 112 test socket extends the 'DaVinci’ Series with an innovative solution for testing the most complex functionality of ASICs (Application Specific Integrated Circuits). Testing these devices at full functionality is challenging. With hundreds of PAM-4 signals, the ability to isolate pin-to-pin cross-talk at the fundamental frequency below -40dB becomes critical. DaVinci 112 increases production yields and throughput, eliminating false faults and complete functional failures.
Features & Benefits
Product Features
Solution for BGA, LGA and other variants
Spring probe technology using homogenous alloy gold plated
RF Bandwidth > 40 Ghz @ -1dB IL
Short signal path 4.90 mm test height
43, 50 Ohm impedance (single-ended)
Consistent stable contact resistance 80 mΩ (Ave)
Hi-Coplanarity accommodation
Tri-Temp socket design to support -55 °C to +125 °C
Designed for manual test, bench test, and HVM production test using the same socket Benefits
Design adaptation to meet the requirement
Long contact life, tested to 500K insertions
Impedance can match the system or be defined as needed
Excellent DC performance
Patented Insulated Metal socket housing for optimal signal integrity performance and strength
Precision-machined socket housing ensures robust mechanical performance
Field repairable, replace a single probe or full array
Cleaning can be done online with a cleaning surrogate
Match existing PCB socket footprint and test hardware lead to cost saving for customers
The DaVinci 112 test socket extends the 'DaVinci’ Series with an innovative solution for testing the most complex functionality of ASICs (Application Specific Integrated Circuits). Testing these devices at full functionality is challenging. With hundreds of PAM-4 signals, the ability to isolate pin-to-pin cross-talk at the fundamental frequency below -40dB becomes critical. DaVinci 112 increases production yields and throughput, eliminating false faults and complete functional failures.
Features & Benefits
Product Features
- Solution for BGA, LGA and other variants
- Spring probe technology using homogenous alloy gold plated
- RF Bandwidth > 40 Ghz @ -1dB IL
- Short signal path 4.90 mm test height
- 43, 50 Ohm impedance (single-ended)
- Consistent stable contact resistance 80 mΩ (Ave)
- Hi-Coplanarity accommodation
- Tri-Temp socket design to support -55 °C to +125 °C
- Designed for manual test, bench test, and HVM production test using the same socket
Benefits
- Design adaptation to meet the requirement
- Long contact life, tested to 500K insertions
- Impedance can match the system or be defined as needed
- Excellent DC performance
- Patented Insulated Metal socket housing for optimal signal integrity performance and strength
- Precision-machined socket housing ensures robust mechanical performance
- Field repairable, replace a single probe or full array
- Cleaning can be done online with a cleaning surrogate
- Match existing PCB socket footprint and test hardware lead to cost saving for customers