Kionix, Inc. Datasheets for Sensor Chips
Sensor chips are dies incorporating semiconductor circuit elements that are used to convert changes to some physical parameter to an electrical signal.
Sensor Chips: Learn more
| Product Name | Notes |
|---|---|
| The KXTC9 series is designed to provide a high signal-to-noise ratio with excellent performance over temperature. These sensors can accept supply voltages between 1.8V and 3.6V. Sensitivity is factory programmable... | |
| The KXTG9 series adds a flexible programmable motion-interrupt chip with fast SPI interface into the Kionix suite of products. These sensors can accept supply voltages between 1.8V and 3.6V. Sensitivity... | |
| The KXTH5 series is designed to provide a high signal-to-noise ratio with excellent performance over temperature. These sensors can accept supply voltages between 1.8V and 3.6V. Sensitivity is factory programmable... | |
| The KXTH9 series is designed to provide a high signal-to-noise ratio with excellent performance over temperature. These sensors can accept supply voltages between 1.8V and 3.6V. Sensitivity is factory programmable... | |
| The KXTI9's Directional Tap/Double-Tap™ detection feature recognizes single-tap and double-tap input and reports the acceleration axis and direction from which each tap originated, enabling up to 12, user-defined, function commands. | |
| The KXUD9 series of linear accelerometers and inclinometers is designed to provide flexibility. These sensors can accept supply voltages between 1.8V and 3.6V. Sensitivity is user selectable at 2g, 4g,... | |
| These high-performance silicon micromachined linear accelerometers and inclinometers consist of a sensor element and an ASIC packaged in a 3x3x0.9mm Land Grid Array (LGA). The sensor element is fabricated from... | |
| These high-performance silicon micromachined linear accelerometers and inclinometers consist of a sensor element and an ASIC packaged in a 3x3x0.9mm Land Grid Array Dual (LGA). The sensor element is fabricated... | |
| These high-performance silicon micromachined linear accelerometers and inclinometers consist of a sensor element and an ASIC packaged in a 3x5x0.9 mm Land Grid Array (LGA). The sensor element is fabricated... | |
| These high-performance silicon micromachined linear accelerometers and inclinometers consist of a sensor element and an ASIC packaged in a 3x5x0.9mm Land Grid Array (LGA). The sensor element is fabricated from... | |
| These high-performance silicon micromachined linear accelerometers and inclinometers consist of a sensor element and an ASIC packaged in a 5x5x1.2mm Dual Flat No-lead (DFN). The sensor element is fabricated from... | |
| These high-performance silicon micromachined linear accelerometersand inclinometers consist of a sensor element and an ASIC packaged in a3x3x0.9mm Land Grid Array (LGA). The sensor element is fabricated fromsingle-crystal silicon with... | |
| These high-performance silicon micromachined linear accelerometersand inclinometers consist of a sensor element and an ASIC packaged in a3x5x0.9mm Land Grid Array (LGA). The sensor element is fabricated fromsingle-crystal silicon with... | |
| These high-performance silicon micromachined linear accelerometersand inclinometers consist of a sensor element and an ASIC packaged in a5x5x1.2mm Dual Flat No-lead (DFN). The sensor element is fabricatedfrom single-crystal silicon with... |