ACCRAbond, Inc. Potting/Encapsulation Compound INSTAbond® 813

Description
INSTAbond® 813 INSTAbond® is a general purpose electrical encapsulating and potting compound designed for applications requiring low exotherm and large masses with pot lives in excess of 2 hours. It exhibits good electrical and mechanical properties over a wide range of operating environments.
  • Potting/Encapsulation Compound - INSTAbond® 813 - ACCRAbond, Inc.
    ACCRAbond, Inc.
Description
INSTAbond® 813 INSTAbond® is a general purpose electrical encapsulating and potting compound designed for applications requiring low exotherm and large masses with pot lives in excess of 2 hours. It exhibits good electrical and mechanical properties over a wide range of operating environments.

Suppliers

Company
Product
Description
Supplier Links
Potting/Encapsulation Compound - INSTAbond® 813 - ACCRAbond, Inc.
ACCRAbond, Inc.
Olive Branch, MS, USA
Potting/Encapsulation Compound
INSTAbond® 813
Potting/Encapsulation Compound INSTAbond® 813
INSTAbond® 813 INSTAbond® is a general purpose electrical encapsulating and potting compound designed for applications requiring low exotherm and large masses with pot lives in excess of 2 hours. It exhibits good electrical and mechanical properties over a wide range of operating environments.

INSTAbond® 813

INSTAbond® is a general purpose electrical encapsulating and potting compound designed for applications requiring low exotherm and large masses with pot lives in excess of 2 hours. It exhibits good electrical and mechanical properties over a wide range of operating environments.

Supplier's Site

Technical Specifications

  ACCRAbond, Inc.
Product Category Encapsulants and Potting Compounds
Product Number INSTAbond® 813
Product Name Potting/Encapsulation Compound
Cure / Technology Two Component  
Unlock Full Specs
to access all available technical data

Similar Products

Potting Resin - 297478-002 - TE Connectivity
TE Connectivity
Potting Resin
297478-002
Specs
Chemical System Two-Component Hydrocarbon Resin
Features Flame Retardant
View Details
Epoxy Has Low Thermal Expansion Coefficient - EP30LTE - Master Bond, Inc.
Master Bond, Inc.
Epoxy Has Low Thermal Expansion Coefficient
EP30LTE
Specs
Type High Dielectric; Optical
Form / Function Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
Cure / Technology Thermoset; Two Component  
View Details
Epoxylite® - E 813-9 Hi Temp Epoxy Kit - ELANTAS North America LLC
ELANTAS North America LLC
Epoxylite®
E 813-9 Hi Temp Epoxy Kit
Specs
Type High Dielectric
Form / Function Liquid
Cure / Technology Thermoset; Two Component  
View Details
Carbon Fiber Encapsulation - Wraptite® - Arnold Magnetic Technologies
Arnold Magnetic Technologies
Carbon Fiber Encapsulation
Wraptite®
Specs
Cure / Technology Wound in place or pressed on sleeve
Chemical System Include Carbon Fiber, Zylon Fiber And Glass Fiber Composites
Industry Aerospace; Automotive; OEM or Industrial; Oil and Gas
View Details