ACCRAbond, Inc. Potting/Encapsulation Compound INSTAbond® 826

Description
INSTAbond® 826 A low viscosity, two-component epoxy compound that cures at room temperature. High flexibility, high impact resistance, thermal shock, water/chemical resistance, and good mechanical properties. Wicking and air release capabilities of INSTAbond® 826 make it ideal for molding applications having intricate shapes or tightly packed coils and components.
  • Potting/Encapsulation Compound - INSTAbond® 826 - ACCRAbond, Inc.
    ACCRAbond, Inc.
Description
INSTAbond® 826 A low viscosity, two-component epoxy compound that cures at room temperature. High flexibility, high impact resistance, thermal shock, water/chemical resistance, and good mechanical properties. Wicking and air release capabilities of INSTAbond® 826 make it ideal for molding applications having intricate shapes or tightly packed coils and components.

Suppliers

Company
Product
Description
Supplier Links
Potting/Encapsulation Compound - INSTAbond® 826 - ACCRAbond, Inc.
ACCRAbond, Inc.
Olive Branch, MS, USA
Potting/Encapsulation Compound
INSTAbond® 826
Potting/Encapsulation Compound INSTAbond® 826
INSTAbond® 826 A low viscosity, two-component epoxy compound that cures at room temperature. High flexibility, high impact resistance, thermal shock, water/chemical resistance, and good mechanical properties. Wicking and air release capabilities of INSTAbond® 826 make it ideal for molding applications having intricate shapes or tightly packed coils and components.

INSTAbond® 826

A low viscosity, two-component epoxy compound that cures at room temperature. High flexibility, high impact resistance, thermal shock, water/chemical resistance, and good mechanical properties. Wicking and air release capabilities of INSTAbond® 826 make it ideal for molding applications having intricate shapes or tightly packed coils and components.

Supplier's Site

Technical Specifications

  ACCRAbond, Inc.
Product Category Encapsulants and Potting Compounds
Product Number INSTAbond® 826
Product Name Potting/Encapsulation Compound
Cure / Technology Two Component  
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