CS 3104 M will protect electrical connections from corrosion by atmospheric moisture. Its low adhesive strength makes it possible to remove the encapsulating material from the connections. Bonding to the remaining cured material during re-encapsulation is obtained without special preparation.
A soft, low adhesion potting compound for electrical components. CS 3104 M is easily removed for access to the encapsulated components, and easily repaired. CS 3104 M is a two-part polysulfide based compound.
| ACCRAbond, Inc. | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | CS 3104 |
| Product Name | Polysulfide |
| Chemical System | Polyphenylene Sulfide |
