Technic, Inc. Advanced Metal Etchant for Semiconductor Packaging Applications TechniEtch SLC

Description
Ideal for seed layer removal, this selective gold etchant performs with a minimum of Cu sidewall erosion and is Sn and alloy compatible.
Description
Ideal for seed layer removal, this selective gold etchant performs with a minimum of Cu sidewall erosion and is Sn and alloy compatible.

Suppliers

Company
Product
Description
Supplier Links
Advanced Metal Etchant for Semiconductor Packaging Applications - TechniEtch SLC - Technic, Inc.
Cranston, RI, USA
Advanced Metal Etchant for Semiconductor Packaging Applications
TechniEtch SLC
Advanced Metal Etchant for Semiconductor Packaging Applications TechniEtch SLC
Ideal for seed layer removal, this selective gold etchant performs with a minimum of Cu sidewall erosion and is Sn and alloy compatible.

Ideal for seed layer removal, this selective gold etchant performs with a minimum of Cu sidewall erosion and is Sn and alloy compatible.

Supplier's Site

Technical Specifications

  Technic, Inc.
Product Category Cleaning Agents and Surface Treatments
Product Number TechniEtch SLC
Product Name Advanced Metal Etchant for Semiconductor Packaging Applications
Type Surface Treatment; Etchant
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