Technic, Inc. Advanced Metal Etchant for Semiconductor Packaging Applications TechniEtch SLC

Name: Advanced Metal Etchant for Semiconductor Packaging Applications
Brand: Technic, Inc.

Description

Ideal for seed layer removal, this selective gold etchant performs with a minimum of Cu sidewall erosion and is Sn and alloy compatible.

Description

Ideal for seed layer removal, this selective gold etchant performs with a minimum of Cu sidewall erosion and is Sn and alloy compatible.

Suppliers

Company

Product

Description

Supplier Links

Cranston, RI, USA

Advanced Metal Etchant for Semiconductor Packaging Applications
TechniEtch SLC

Advanced Metal Etchant for Semiconductor Packaging Applications TechniEtch SLC

Ideal for seed layer removal, this selective gold etchant performs with a minimum of Cu sidewall erosion and is Sn and alloy compatible.

Supplier's Site

	Technic, Inc.
Product Category	Cleaning Agents and Surface Treatments
Product Number	TechniEtch SLC
Product Name	Advanced Metal Etchant for Semiconductor Packaging Applications
Type	Surface Treatment; Etchant

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