Technic, Inc. Advanced Metal Etchant for Semiconductor Packaging Applications TechniEtch SLC

Name: Advanced Metal Etchant for Semiconductor Packaging Applications
Brand: Technic, Inc.

Description

Ideal for seed layer removal, this selective gold etchant performs with a minimum of Cu sidewall erosion and is Sn and alloy compatible.

Description

Ideal for seed layer removal, this selective gold etchant performs with a minimum of Cu sidewall erosion and is Sn and alloy compatible.

Suppliers

Company

Product

Description

Supplier Links

Cranston, RI, USA

Advanced Metal Etchant for Semiconductor Packaging Applications
TechniEtch SLC

Advanced Metal Etchant for Semiconductor Packaging Applications TechniEtch SLC

Ideal for seed layer removal, this selective gold etchant performs with a minimum of Cu sidewall erosion and is Sn and alloy compatible.

Supplier's Site

	Technic, Inc.
Product Category	Cleaning Agents and Surface Treatments
Product Number	TechniEtch SLC
Product Name	Advanced Metal Etchant for Semiconductor Packaging Applications
Type	Surface Treatment; Etchant

Unlock Full Specs

to access all available technical data

Competition Chemicals, Inc.

Specs

Type Surface Treatment; Abrasive; Rust Remover; Cleaner

Industry Applications Industrial, Automotive, Consumer

RS Components, Ltd.

Specs

Type Cleaner

QualiChem, Inc.

Specs

Type Mild Alkaline; Cleaner

Hernon Manufacturing, Inc.

Specs

Type Surface Treatment