Technic, Inc. Advanced Metal Etchant for Semiconductor Packaging Applications TechniEtch TBR19

Description
Ti/TiN/TiW etchant with low undercut and high Cu, Al, Sn compatibility.
Description
Ti/TiN/TiW etchant with low undercut and high Cu, Al, Sn compatibility.

Suppliers

Company
Product
Description
Supplier Links
Advanced Metal Etchant for Semiconductor Packaging Applications - TechniEtch TBR19 - Technic, Inc.
Cranston, RI, USA
Advanced Metal Etchant for Semiconductor Packaging Applications
TechniEtch TBR19
Advanced Metal Etchant for Semiconductor Packaging Applications TechniEtch TBR19
Ti/TiN/TiW etchant with low undercut and high Cu, Al, Sn compatibility.

Ti/TiN/TiW etchant with low undercut and high Cu, Al, Sn compatibility.

Supplier's Site

Technical Specifications

  Technic, Inc.
Product Category Cleaning Agents and Surface Treatments
Product Number TechniEtch TBR19
Product Name Advanced Metal Etchant for Semiconductor Packaging Applications
Type Surface Treatment; Etchant
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