Technic, Inc. Advanced Metal Etchant for Semiconductor Packaging Applications TechniEtch AC35

Description
Gold and copper etchant offering minimal metal undercutting while performing an effective etching of each or both metals.
Description
Gold and copper etchant offering minimal metal undercutting while performing an effective etching of each or both metals.

Suppliers

Company
Product
Description
Supplier Links
Advanced Metal Etchant for Semiconductor Packaging Applications - TechniEtch AC35 - Technic, Inc.
Cranston, RI, USA
Advanced Metal Etchant for Semiconductor Packaging Applications
TechniEtch AC35
Advanced Metal Etchant for Semiconductor Packaging Applications TechniEtch AC35
Gold and copper etchant offering minimal metal undercutting while performing an effective etching of each or both metals.

Gold and copper etchant offering minimal metal undercutting while performing an effective etching of each or both metals.

Supplier's Site

Technical Specifications

  Technic, Inc.
Product Category Cleaning Agents and Surface Treatments
Product Number TechniEtch AC35
Product Name Advanced Metal Etchant for Semiconductor Packaging Applications
Type Surface Treatment; Etchant
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