Copper seed layer etchant providing selective etch and high loading capacity for UBM and RDL applications. Used also for selective Cu/Ni in UBM stack because of its great etching metal selectivity.
| Technic, Inc. | |
|---|---|
| Product Category | Cleaning Agents and Surface Treatments |
| Product Number | TechniEtch CN10 |
| Product Name | Advanced Metal Etchant for Semiconductor Packaging Applications |
| Type | Surface Treatment; Etchant |
