Liquid acid cleaner formulated for the removal of oxides, fingerprints, and light resist residues from copper seed layer surfaces prior to electrolytic copper plating.
| Technic, Inc. | |
|---|---|
| Product Category | Cleaning Agents and Surface Treatments |
| Product Number | Elevate Cu 6300 Cleaner |
| Product Name | Precleaner for Electrolytic Copper Plating |
| Type | Cleaner |
