Technic’s newly developed chemical deflash chemistry which operates in immersion mode followed by water jet for removal of mold flash and resin bleed from semiconductor packages sensitive to mold compound delamination issues.
| Technic, Inc. | |
|---|---|
| Product Category | Cleaning Agents and Surface Treatments |
| Product Number | Techni Chemical Deflash 38 |
| Product Name | Pre-treatment Processes |
| Type | Surface Treatment; Pretreatment |
