Accuris Datasheets for Standards and Technical Documents
Standards and technical documents includes standards, codes, regulation, handbooks, manuals, comprehensive guides and other formal publications. Standards, codes, and regulation establish uniform specifications, procedures or technical criteria.
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| Product Name | Notes |
|---|---|
| An appraisal of the problems of accelerated testing for atmospheric corrosion | |
| Analog Interconnection of Television Receivers and Electronic Equipments (21 Pin) | |
| Audio and audiovisual equipment - Digital audio parts - Basic measurement methods of audio characteristics - Part 1: General | |
| Audio and audiovisual equipment - Digital audio parts - Basic measurement methods of audio characteristics - Part 2: Consumer use | |
| Audio and audiovisual equipment \x96 Digital audio parts \x96 Basic measurement methods of audio characteristics \x96 Part 4: Personal computer | |
| Audio, video and similar electronic apparatus - Safety requirements (Amendment 1) | |
| Audio, video and similar electronic apparatus - Safety requirements | |
| Background information, Section One - Cold and dry heat tests | |
| Basic environmental testing procedures - Part 2: Tests - Test Q: Sealing | |
| Basic environmental testing procedures Part 2: Tests - Test Ga and guidance: Acceleration, steady state | |
| Basic Environmental Testing Procedures Part 2: Tests - Test Ka: Salt mist | |
| Basic environmental testing procedures Part 2: Tests Guidance to Test Kc: Sulphur dioxide test for contacts and connections | |
| Basic environmental testing procedures Part 2: Tests Guidance to Test Kd: Hydrogen sulphide test for contacts and connections | |
| Basic environmental testing procedures Part 2: Tests Guidance to tests Z/AFc and Z/BFc: Combined temperature (cold and dry heat) and vibration (sinusoidal) tests | |
| Basic environmental testing procedures Part 2: Tests Test Eb and guidance: Bump | |
| Basic environmental testing procedures Part 2: Tests Test Kc: Sulphur dioxide test for contacts and connections | |
| Basic environmental testing procedures Part 2: Tests Test Kd: Hydrogen sulphide test for contacts and connections | |
| Basic environmental testing procedures Part 2: Tests Test Z/AD: Composite temperature/humidity cyclic test | |
| Basic environmental testing procedures Part 2: Tests Tests Z/AFc: Combined cold/vibration (sinusoidal) tests for both heat-dissipating and non-heat-dissipating specimens | |
| Basic environmental testing procedures Part 2: Tests Tests Z/BFc: Combined dry heat/vibration (sinusoidal) tests for both heat-dissipating and non-heat-dissipating specimens | |
| Basic environmental testing procedures Part 2: Tests, Test B: Dry heat | |
| Basic environmental testing procedures Part 2: Tests, Test Ca: Damp heat, steady state | |
| Basic Environmental Testing Procedures Part 2: Tests, Test Db: Damp Heat, Cyclic (12 + 12-Hour Cycle) | |
| Basic environmental testing procedures Part 2: Tests, Test Ea and guidance: Shock | |
| Basic environmental testing procedures Part 2: Tests, Test M: Low air pressure | |
| Basic environmental testing procedures Part 2: Tests. Test T: Soldering | |
| Basic environmental testing procedures Part 3: Background information Section Two - Combined temperature/low air pressure tests | |
| C01 type connectors for radio frequency coaxial cables | |
| C02 type connectors for radio frequency coaxial cables | |
| C03 type connectors for radio frequency coaxial cables | |
| C04 type connectors for radio frequency coaxial cables | |
| C05 type connectors for radio frequency coaxial cables | |
| C11 type connectors for radio frequency coaxial cables | |
| Capacitors and resistors for use in electronic equipment - Preferred dimensions of shaft ends, bushes and for the mounting of single-hole, bush-mounted, shaft-operated electronic components | |
| Components for low-voltage surge protection - Part 351: Performance requirements and test methods for telecommunications and signalling network surge isolation transformers (SIT) | |
| Components for low-voltage surge protection -- Part 352: Selection and application principles for telecommunications and signalling network surge isolation transformers (SITs) | |
| Components for low-voltage surge protective devices - Part 312: Selection and application principles for gas discharge tubes | |
| Components for low-voltage surge protective devices - Part 331: Specification for metal oxide varistors (MOV) | |
| Components for low-voltage surge protective devices - Part 341: Specification for thyristor surge suppressors (TSS) | |
| Components for Low-Voltage Surge Protective Devices - Specification for Gas Discharge Tubes (GDT) | |
| Components for Low-Voltage Surge Protective Devices - Specifications for Avalanche Breakdown Diode (ABD) | |
| Connection of Video Tape Recorder | |
| Connectors for electrical equipment - Tests and measurements - Part 2-2: Electrical continuity and contact resistance tests - Test 2b: Contact resistance - Specified test current method | |
| Connectors for electronic equipment - Part 1: Generic specification | |
| Connectors for electronic equipment - Part 2-001: Circular connectors - Blank detail specification | |
| Connectors for electronic equipment - Part 2: Circular connectors with assessed quality - Sectional specification | |
| Connectors for electronic equipment - Part 3-001: Rectangular connectors with assessed quality - Blank detail specification | |
| Connectors for electronic equipment - Part 3: Rectangular connectors with assessed quality - Sectional specification | |
| Connectors for electronic equipment - Part 4-001: Printed board connectors with assessed quality - Blank Detail Specification | |
| Connectors for electronic equipment - Part 4: Printed board connectors with assessed quality - Sectional specification | |
| Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications | |
| Connectors for electronic equipment - Tests and measurements - Part 1-1: General examination - Test 1a: Visual examination | |
| Connectors for electronic equipment - Tests and measurements - Part 1-2: General examination - Test 1b: Examination of dimension and mass | |
| Connectors for electronic equipment - Tests and measurements - Part 1-3: General examination - Test 1c: Electrical engagement length | |
| Connectors for electronic equipment - Tests and measurements - Part 1-4: General examination - Test 1d: Contact protection effectiveness (scoop-proof) | |
| Connectors for electronic equipment - Tests and measurements - Part 10-4: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests - Test 10d: Electrical overload... | |
| Connectors for electronic equipment - Tests and measurements - Part 11-10: Climatic tests - Test 11j: Cold | |
| Connectors for electronic equipment - Tests and measurements - Part 11-11: Climatic tests - Test 11k: Low air pressure | |
| Connectors for electronic equipment - Tests and measurements - Part 11-12: Climatic tests - Test 11m: Damp heat, cyclic | |
| Connectors for electronic equipment - Tests and measurements - Part 11-13: Climatic tests - Test 11n: Gas tightness, solderless wrapped connections | |
| Connectors for electronic equipment - Tests and measurements - Part 11-14: Climatic tests - Test 11p: Flowing single gas corrosion test | |
| Connectors for electronic equipment - Tests and measurements - Part 11-1: Climatic tests - Test 11a: Climatic sequence | |
| Connectors for electronic equipment - Tests and measurements - Part 11-2: Climatic tests - Test 11b: Combined/sequential cold, low air pressure and damp heat | |
| Connectors for electronic equipment - Tests and measurements - Part 11-3: Climatic tests - Test 11c: Damp heat, steady state | |
| Connectors for electronic equipment - Tests and measurements - Part 11-4: Climatic tests - Test 11d: Rapid change of temperature | |
| Connectors for electronic equipment - Tests and measurements - Part 11-5: Climatic tests - Test 11e: Mould growth | |
| Connectors for electronic equipment - Tests and measurements - Part 11-6: Climatic tests - Test 11f: Corrosion, salt mist | |
| Connectors for electronic equipment - Tests and measurements - Part 11-7: Climatic tests - Test 11g: Flowing mixed gas corrosion test | |
| Connectors for electronic equipment - Tests and measurements - Part 11-8: Climatic tests - Test 11h: Sand and dust | |
| Connectors for electronic equipment - Tests and measurements - Part 11-9: Climatic tests - Test 11i: Dry heat | |
| Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method | |
| Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method | |
| Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method | |
| Connectors for electronic equipment - Tests and measurements - Part 12-5: Soldering tests - Test 12e: Resistance to soldering heat, soldering iron method | |
| Connectors for electronic equipment - Tests and measurements - Part 12-6: Soldering tests - Test 12f: Sealing against flux and cleaning solvents in machine soldering | |
| Connectors for electronic equipment - Tests and measurements - Part 12-7: Soldering tests - Test 12g: Solderability, wetting balance method | |
| Connectors for electronic equipment - Tests and measurements - Part 13-1: Mechanical operating tests - Test 13a: Engaging and separating forces | |
| Connectors for electronic equipment - Tests and measurements - Part 13-2: Mechanical operation tests - Test 13b: Insertion and withdrawal forces | |
| Connectors for electronic equipment - Tests and measurements - Part 13-5: Mechanical operation tests - Test 13e: Polarizing and keying method | |
| Connectors for electronic equipment - Tests and measurements - Part 14-2: Sealing tests - Test 14b: Sealing - Fine air leakage | |
| Connectors for electronic equipment - Tests and measurements - Part 14-4: Sealing tests - Test 14d: Immersion -- Waterproof | |
| Connectors for electronic equipment - Tests and measurements - Part 14-5: Sealing tests - Test 14e: Immersion at low air pressure | |
| Connectors for electronic equipment - Tests and measurements - Part 14-6: Sealing tests - Test 14f: Interfacial sealing | |
| Connectors for electronic equipment - Tests and measurements - Part 14-7: Sealing tests - Test 14g: Impacting water | |
| Connectors for electronic equipment - Tests and measurements - Part 15-1: Connector tests (mechanical) - Test 15a: Contact retention in insert | |
| Connectors for electronic equipment - Tests and measurements - Part 15-2: Connector tests (mechanical) - Test 15b: Insert retention in housing (axial) | |
| Connectors for electronic equipment - Tests and measurements - Part 15-3: Connector tests (mechanical) - Test 15c: Insert retention in housing (torsional) | |
| Connectors for electronic equipment - Tests and measurements - Part 15-4: Connector tests (mechanical tests) - Test 15d: Contact insertion, release and extraction force | |
| Connectors for electronic equipment - Tests and measurements - Part 15-5: Connector tests (mechanical) - Test 15e: Contact retention in insert, cable nutation | |
| Connectors for electronic equipment - Tests and measurements - Part 15-6: Connector tests (mechanical tests) - Test 15f: Effectiveness of connector coupling devices | |
| Connectors for electronic equipment - Tests and measurements - Part 15-8: Connector tests (mechanical) - Test 15h: Contact retention system, resistance to tool application | |
| Connectors for electronic equipment - Tests and measurements - Part 16-13: Mechanical tests on contacts and terminations - Test 16m: Un-wrapping, solderless wrapped connections | |
| Connectors for electronic equipment - Tests and measurements - Part 16-1: Mechanical tests on contacts and terminations - Test 16a: Probe damage | |
| Connectors for electronic equipment - Tests and measurements - Part 16-20: Mechanical tests on contacts and terminations - Test 16t: Mechanical strength (Wired termination of soldersless connections) | |
| Connectors for electronic equipment - Tests and measurements - Part 16-2: Mechanical tests on contacts and terminations - Test 16b: Restricted entry | |
| Connectors for electronic equipment - Tests and measurements - Part 16-3: Mechanical tests on contacts and terminations - Test 16c: Contact-bending strength | |
| Connectors for electronic equipment - Tests and measurements - Part 16-4: Mechanical tests on contacts and terminations - Test 16d:Tensile strength (crimped connections) | |
| Connectors for electronic equipment - Tests and measurements - Part 16-5: Mechanical tests on contacts and terminations - Test 16e: Gauge retention force (resilient contacts) | |
| Connectors for electronic equipment - Tests and measurements - Part 16-6: Mechanical tests on contacts and terminations - Test 16f: Robustness of terminations | |
| Connectors for electronic equipment - Tests and measurements - Part 16-7: Mechanical tests on contacts and terminations - Test 16g: Measurement of contact deformation after crimping | |
| Connectors for electronic equipment - Tests and measurements - Part 16-8: Mechanical tests on contacts and terminations - Test 16h: Insulating grip effectiveness (crimped connections) | |
| Connectors for electronic equipment - Tests and measurements - Part 16-9: Mechanical tests on contacts and terminations - Test 16i: Grounding contact spring holding force | |
| Connectors for electronic equipment - Tests and measurements - Part 17-1: Cable clamping tests - Test 17a: Cable clamp robustness | |
| Connectors for electronic equipment - Tests and measurements - Part 17-2: Cable clamping tests - Test 17b: Cable clamp resistance to cable rotation | |
| Connectors for electronic equipment - Tests and measurements - Part 17-3: Cable clamping tests - Test 17c: Cable clamp resistance to cable pull (tensile) | |
| Connectors for electronic equipment - Tests and measurements - Part 17-4: Cable clamping tests - Test 17d: Cable clamp resistance to cable torsion | |
| Connectors for electronic equipment - Tests and measurements - Part 19-3: Chemical resistance tests - Test 19c: Fluid resistance | |
| Connectors for electronic equipment - Tests and measurements - Part 2-1: Electrical continuity and contact resistance tests - Test 2a: Contact resistance - Millivolt level method | |
| Connectors for electronic equipment - Tests and measurements - Part 2-3: Electrical continuity and contact resistance tests - Test 2c: Contact resistance variation | |
| Connectors for electronic equipment - Tests and measurements - Part 2-5: Electrical continuity and contact resistance tests - Test 2e: Contact disturbance | |
| Connectors for electronic equipment - Tests and measurements - Part 2-6: Electrical continuity and contact resistance tests - Test 2f: Housing (shell) electrical continuity | |
| Connectors for electronic equipment - Tests and measurements - Part 22-1: Capacitance tests - Test 22a: Capacitance | |
| Connectors for electronic equipment - Tests and measurements - Part 23-4: Screening and filtering tests - Test 23d: Transmission line reflections in the time domain | |
| Connectors for electronic equipment - Tests and measurements - Part 3-1: Insulation tests - Test 3a: Insulation resistance | |
| Connectors for electronic equipment - Tests and measurements - Part 4-1: Voltage stress tests - Test 4a: Voltage proof | |
| Connectors for electronic equipment - Tests and measurements - Part 4-2: Voltage stress tests - Test 4b: Partial discharge | |
| Connectors for electronic equipment - Tests and measurements - Part 4-3: Voltage stress tests - Test 4c: Voltage proof of pre-insulated crimp barrels | |
| Connectors for electronic equipment - Tests and measurements - Part 5-1: Current-carrying capacity tests - Test 5a: Temperature rise | |
| Connectors for electronic equipment - Tests and measurements - Part 5-2: Current-carrying capacity tests - Test 5b: Current-temperature derating | |
| Connectors for electronic equipment - Tests and measurements - Part 6-1: Dynamic stress tests - Test 6a: Acceleration, steady state | |
| Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests - Test 6b: Bump | |
| Connectors for electronic equipment - Tests and measurements - Part 6-3: Dynamic stress tests - Test 6c: Shock | |
| Connectors for electronic equipment - Tests and measurements - Part 6-4: Dynamic stress tests - Test 6d: Vibration (sinusoidal) | |
| Connectors for electronic equipment - Tests and measurements - Part 7-1: Impact tests (free connectors) - Test 7a: Free fall (repeated) | |
| Connectors for electronic equipment - Tests and measurements - Part 7-2: Impact tests (free connectors) - Test 7b: Mechanical strength impact | |
| Connectors for electronic equipment - Tests and measurements - Part 8-1: Static load tests (fixed connectors) - Test 8a: Static load, transverse | |
| Connectors for electronic equipment - Tests and measurements - Part 8-2: Static load tests (fixed connectors) - Test 8b: Static load, axial | |
| Connectors for electronic equipment - Tests and measurements - Part 8-3: Static load tests (fixed connectors) - Test 8c: Robustness of actuating lever | |
| Connectors for electronic equipment - Tests and measurements - Part 9-1: Endurance tests - Test 9a: Mechanical operation | |
| Connectors for electronic equipment - Tests and measurements - Part 9-2: Endurance tests - Test 9b: Electrical load and temperature | |
| Connectors for electronic equitment - Tests and measurements - Part 1: General | |
| Dependability management - Part 1: Dependability management systems | |
| Dependability management - Part 2: Guidelines for dependability management | |
| Dependability management - Part 3-1: Application guide - Analysis techniques for dependability - Guide on methodology | |
| Dependability management - Part 3-2: Application guide - Collection of dependability data from the field | |
| Dependability management - Part 3-3: Application guide - Life cycle costing | |
| Dependability management - Part 3-4: Application guide - Guide to the specification of dependability requirements | |
| Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles | |
| Dependability management - Part 3-6: Application guide - Software aspects of dependability | |
| Dependability management - Part 3-7: Application guide - Reliability stress screening of electronic hardware | |
| Dependability management - Part 4-1: Application guide - Dependability of products containing reused parts - Requirements for functionality and test | |
| Dependability management - Part 4-2: Software dependability through the software life-cycle processes - Application guide | |
| Dependability management - Part 4-3: Analysis techniques for system reliability - Procedure for failure mode and effects analysis (FMEA) | |
| Dependability management - Part 4-4: Analysis techniques for system reliability - Fault Tree Analysis (FTA) | |
| Dependability management-Part 1: Managing dependability | |
| Digital Interconnection of Television Receivers and Electronic Equipments (8 Pin) | |
| Dimensions of Racks and Unit Chassis of Electronic Equipment for General Use | |
| Electrical apparatus for explosive gas atmospheres - Part 10: Classification of hazardous areas | |
| Electrical apparatus for explosive gas atmospheres - Part 11: Intrinsic safety "i" | |
| Electrical apparatus for explosive gas atmospheres - Part 14: Electrical installations in hazardous areas (other than mines) | |
| Electrical apparatus for explosive gas atmospheres - Part 15: Construction, test and marking of type of protection "n" electrical apparatus | |
| Electrical apparatus for explosive gas atmospheres - Part 18: Construction, test and marking of type of protection encapsulation "m" electrical apparatus | |
| Electrical apparatus for explosive gas atmospheres - Part 1: Flameproof enclosures "d" | |
| Electrical apparatus for explosive gas atmospheres - Part 25: Intrinsically safe systems | |
| Electrical apparatus for explosive gas atmospheres - Part 2: Pressurized enclosure "p" | |
| Electrical apparatus for explosive gas atmospheres - Part 6: Oil immersion "o" | |
| Electrical apparatus for explosive gas atmospheres - Part 7: Increased safety "e" | |
| Electrical installations of buildings - Part 4-42: Protection for safety - Protection against thermal effects | |
| Electrical installations of buildings - Part 4-43: Protection for safety - Protection against overcurrent | |
| Electrical installations of buildings - Part 4-44: Protection for safety - Protection against voltage disturbances and electromagnetic disturbances | |
| Electrical installations of buildings - Part 5-52: Selection and erection of electrical equipment - Wiring systems | |
| Electrical installations of buildings - Part 5-53: Selection and erection of electrical equipment - Isolation, switching and control | |
| Electrical installations of buildings - Part 5-54: Selection and erection of electrical equipment - Earthing arrangements, protective conductors and protective bonding conductors | |
| Electrical installations of buildings - Part 5-55: Selection and erection of electrical equipment - Other equipment | |
| Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 20-2: Test 20b - Flammability tests - Fireproofness | |
| Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 23-3: Test 23c: Shielding effectiveness of connectors and accessories | |
| Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification | |
| Environmental Requirements for Electronic Equipments | |
| Environmental testing - Electrotechnical products - Dust and sand test | |
| Environmental testing - Electrotechnical products - Time-history vibration test method | |
| Environmental testing - Part 2-21: Tests - Test U: Robustness of termination and integral mounting devices | |
| Environmental testing - Part 2-47: Tests - Mounting of specimens for vibration, impact and similar dynamic tests | |
| Environmental testing - Part 2-55: Tests - Test Ee and guidance - Loose cargo testing including bounce | |
| Environmental testing - Part 2-65: Vibration, acoustically induced | |
| Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method | |
| Environmental testing - Part 2-75 : Tests - Test Eh: Hammer tests | |
| Environmental testing - Part 2-77 : Tests - Test 77 : Body Strength and Impact shock | |
| Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state | |
| Environmental testing - Part 2-80 : Tests - Test Fi : Vibration - Mixed mode | |
| Environmental testing - Part 2-81: Shock - Shock response spectrum synthesis | |
| Environmental testing - Part 2-82: Tests-Test XW1: Whisker test methods for electronic and electric components | |
| Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste | |
| Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) | |
| Environmental testing - Part 2: Test methods Test Fe : Vibration - Sine-beat method | |
| Environmental testing - Part 2: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components | |
| Environmental testing - Part 2: Tests - Test Fc: Vibration (sinusoidal) | |
| Environmental testing - Part 2: Tests - Test Kb: Salt mist, cyclic (sodium, chloride solution) | |
| Environmental testing - Part 2: Tests - Test Ke: Flowing mixed gas corrosion test | |
| Environmental testing - Part 2: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) | |
| Environmental testing - Part 2: Tests - Test Xb: Abrasion of markings and letterings caused by rubbing of fingers and hands | |
| Environmental testing - Part 2: Tests. Guidance on the application of the tests of JIS environmental testing series to simulate the effects of storage | |
| Environmental testing - Part 2: Tests. Test Z/AMD: Combined sequential cold, low air pressure, and damp heat test | |
| Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering | |
| Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests | |
| Environmental testing - Part 3-5: Supporting documentation and guidance - Confirmation of the performance of temperature chambers | |
| Environmental testing - Part 3-6: Supporting documentation and guidance - confirmation of the performance of temperature/humidity chambers | |
| Environmental testing - Part 3-7: Supporting documentation and guidance - Measurements in temperature chambers for tests A and B (with load) | |
| Environmental testing - Part 3-8: Supporting documentation and guidance - Selecting amongst vibration tests | |
| Environmental testing - Part 3: Guidance Seismic test method for equipments | |
| Environmental testing -- Part 2-58: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Amendment 1) | |
| Environmental testing -- Part 2-5: Tests -- Test S: Simulated solar radiation at ground level and guidance for solar radiation testing and weathering | |
| Environmental testing -- Part 2-69: Tests -- Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Amendment 1) | |
| Environmental testing -- Part 2-85: Tests -- Test Fj: Vibration -- Long time history replication | |
| Environmental testing -- Part 2: Tests -- Test Cy: Damp heat, steady state, accelerated test primarily intended for components (Amendment 1) | |
| Environmental testing -- Part 3-3: Supporting documentation and guidance -- Seismic test methods for equipment (Amendment 1) | |
| Environmental testing Part 1: General and guidance | |
| Environmental testing Part 2: Test methods - Test Fh: Vibration, broad-band random (digital control) and guidance | |
| Environmental testing Part 2: Test methods Test Z/ABDM: Climatic sequence | |
| Environmental testing Part 2: Tests - Test R and guidance: Water | |
| Environmental testing Part 2: Tests, Test Z/AM: Combined cold/low air pressure tests | |
| Environmental testing Part 2: Tests, Test Z/BM: Combined dry heat/low air pressure tests | |
| Environmental testing Part 2: Tests. Test Cb: Damp heat, steady state, primarily for equipment | |
| Environmental testing Part 2: Tests. Test Ec: Drop and topple, primarily for equipment-type specimens | |
| Environmental testing Part 2: Tests. Test Ed: Free fall | |
| Environmental testing Part 2: tests. Test Ta: Soldering. Solderability testing by the wetting balance method | |
| Environmental testing procedures of electronic and electrical resistance to solvents (immersion in cleaning solvents) | |
| Environmental testing procedures Part 2: Tests, Tests A: Cold | |
| Environmental testing, Part 2: Tests - Guidance for damp heat tests | |
| Environmental testing- Part 2-14: Tests-Test N: Change of temperature | |
| Explosive atmospheres - Part 0: Equipment - General requirements | |
| F01 Type Connectors for Optical Fiber Cords | |
| F02 Type Connectors for Optical Fiber Cords | |
| F03 Type Connectors for Optical Fiber Cords | |
| F04 Type Connectors for Optical Fiber Cords | |
| F05 Type Connectors for Optical Fiber Cords | |
| F06 Type Connectors for Optical Fiber Cords | |
| F07 Type Connectors for Optical Fiber Cords | |
| F08 Type Connectors for Optical Fiber Cords | |
| F09 Type Connectors for Optical Fiber Cords | |
| F10 Type Connectors for Optical Fiber Cords | |
| F11 Type Connectors for Optical Fiber Cables | |
| F12 Type Connectors for Optical Fiber Cables | |
| F13 Type Connectors for Optical Fiber Ribbons | |
| F14 Type Connectors for Optical Fiber Cables | |
| F15 Type connectors for optical fiber cables | |
| F16 Type connectors for optical fiber cables (Type SC-SR connector) (Amendment 1) | |
| F16 Type connectors for optical fiber cables | |
| F17 Type connectors for optical fiber cables (Type MU-SR connector) (Amendment 1) | |
| F17 Type connectors for optical fiber cables | |
| F18 Type connectors for optical fiber cables | |
| F19 Type connectors for optical fiber cables | |
| Fiber optic active components and devices - Performance standard template - Part 1: Transmitting and/or receiving modules for single fiber serial transmission link | |
| Fiber optic active components and devices - Performance standards - Part 1: General and guidance | |
| Fiber optic active components and devices - Performance standards - Part 3: 2.5 Gbit/s modulator-intergrate d laser diode transmitters | |
| Fiber optic active components and devices - Performance standards - Part 4: 1300 nm fiber optic transceivers for gigabit Ethernet application | |
| Fiber Optic Active Components And Devices - Performance Standards - Part 5: ATM-PON Transceivers With LD Driver And CDR ICs | |
| Fiber optic active components and devices - Performance standards - Part 6: 650 nm 250 Mbit/s plastic optical fiber transceivers | |
| Fiber optic active components and devices - Performance standards - Part 7: GPON transceivers | |
| Fiber Optic Active Components And Devices - Test And Measurement Procedures - Part 1: General And Guidance | |
| Fiber Optic Active Components And Devices - Test And Measurement Procedures - Part 2: ATM-PON Transceivers | |
| Fiber optic active components and devices - Test and measurement procedures - Part 3: Optical transmitting and/or receiving modules for single fiber serial transmission link | |
| Fiber optic active components and devices - Test and measurement procedures - Part 4: GPON transceivers | |
| Fiber optic active components and devices -- Performance standard template -- Part 2: Optical transmitting and/or receiving modules for multi fiber parallel transmission link | |
| Fiber optic active components and devices -- Performance standard template -- Part 3: Optical transceiver modules for single fiber parallel transmission link with wavelength division multiplexing | |
| Fiber optic active components and devices -- Test and measurement procedures -- Part 6: Optical transmitting and/or receiving modules for multi fiber parallel transmission link | |
| Fiber optic active components and devices -- Test and measurement procedures -- Part 7: Optical transceiver modules for single fiber parallel transmission link with wavelength division multiplexing | |
| Fiber optic active components and devices-Performance standard template-Part 4: Laser diodes and laser diode modules for fiber optic transmission | |
| Fiber optic active components and devices-Performance standard template-Part 6: Photodiodes for fiber optic transmission | |
| Fiber optic active components and devices-Performance standard temprate-Part 5: Light emitting diodes for fiber optic transmission | |
| Fiber optic active components and devices-Test and measurement procedures-Part 8: Photoemitters and photoreceivers for fiber optic transmission | |
| Fiber optic chromatic dispersion compensator using single-mode dispersion compensating fiber | |
| Fiber optic connector interfaces - Part 13: Type FC-PC connector family (F01 Type) | |
| Fiber optic connector interfaces - Part 18: Type MT-RJ connector family (F19 type) | |
| Fiber optic connector interfaces - Part 20: Type LC connector family | |
| Fiber optic connector interfaces - Part 4-100: Type SC connector family - Simplified receptacle SC-PC connector interfaces (F16 type) | |
| Fiber optic connector interfaces - Part 4-1: Type SC connector family - Simplified receptacle SC-PC connector interfaces (F16 type) | |
| Fiber optic connector interfaces - Part 4: Type SC connector family (F04 Type) | |
| Fiber optic connector interfaces - Part 5: Type MT connector family (F12 type) | |
| Fiber optic connector interfaces - Part 6-100: Type MU connector family - Simplified receptacle MU-PC connector interfaces (F17 type) | |
| Fiber optic connector interfaces - Part 6-1: Type MU connector family - Simplified receptacle MU-PC connector interfaces (F17 type) | |
| Fiber optic connector interfaces - Part 6: Type MU connector family (F14 Type) | |
| Fiber optic connector interfaces - Part 7: Type MPO connector family (F13) | |
| Fiber optic connector interfaces -- Part 7-1: Type MPO connector family (F13 type) -- One fiber row | |
| Fiber optic connector interfaces -- Part 7-2: Type MPO connector family (F13 type) -- Two fiber rows | |
| Fiber optic connector optical interfaces - Part 1: Optical interfaces for single mode non-dispersion shifted fibers - General and guidance | |
| Fiber optic connector optical interfaces - Part 2-1: Optical interface standard single mode non-angled physically contacting fibers | |
| Fiber optic connector optical interfaces - Part 2-2: Optical interface standard single mode angled physically contacting fibers | |
| Fiber optic connector optical interfaces - Part 2-4: Connection parameters of single mode physically contacting fibers - Non-angled for reference connection applications | |
| Fiber optic connector optical interfaces - Part 2-5: Connection parameters of single mode physically contacting fibers - Angled for reference connection applications | |
| Fiber optic connector optical interfaces - Part 3-1: Optical interface, 2.5 mm and 1.25 mm diameter cylindrical full zirconia PC ferrule, single mode fiber | |
| Fiber optic connector optical interfaces - Part 3-2: Optical interface, 2.5 mm and 1.25 mm diameter cylindrical full zirconia ferrules for 8 degrees angled-PC single mode fibers | |
| Fiber optic filters - Part 1: Generic specification | |
| Fiber optic interconnecting devices and passive components - Connector optical interfaces - Part 3-31: Connector parameters of single mode physically contacting fibers - One-row 8 degree angled rectangular polyphenylene sulphide... | |
| Fiber optic passive power control devices - Part 1: Generic specification | |
| Fiber optic passive power control devices - Part 3: Non-connectorized, single-mode fiber, electrically controlled, variable optical attenuator | |
| Fiber optic passive power control devices -- Part 4: Single-mode fiber, plug-receptacle style, fixed optical attenuator | |
| Fiber optic switches - Part 1: Generic specification | |
| Fiber optic switches - Part 2: Test Methods | |
| Fiber optic switches -- Part 3: Single-mode fiber-pigtailed optical 1x2 and 2x2 switches | |
| Fiber optic WDM devices - Generic specification | |
| Fibre optic active components and devices - Package and interface standards - Part 11: 14-pin modulator-integrated laser diode transmitters | |
| Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance | |
| Fibre optic active components and devices - Package and interface standards - Part 2: SFF MT-RJ 10-pin transceivers | |
| Fibre optic active components and devices - Package and interface standards - Part 3: SFF MT-RJ 20-pin transceivers | |
| Fibre optic active components and devices - Package and interface standards - Part 4: PN 1x9 plastic optical fibre transceivers | |
| Fibre optic active components and devices - Package and interface standards - Part 5: SC 1x9 fibre optic modules | |
| Fibre optic active components and devices - Package and interface standards - Part 6: ATM-PON transceivers | |
| Fibre optic active components and devices - Package and interface standards - Part 7: SFF LC 10-pin transceivers | |
| Fibre optic active components and devices - Package interface standards - Part 12: Laser transmitters with a coaxial RF connector | |
| Fibre optic active components and devices \x96 Package and interface standards \x96 Part 10: SFF MU duplex 20-pin transceivers | |
| Fibre optic active components and devices \x96 Package and interface standards \x96 Part 8: SFF LC 20-pin transceivers | |
| Fibre optic active components and devices \x96 Package and interface standards \x96 Part 9: SFF MU duplex 10-pin transceivers | |
| Fire hazard testing - Glow-wire apparatus and common test procedure | |
| Fire hazard testing - Glow-wire flammability test method for end-products | |
| Fire hazard testing - Glow-wire flammability test method for materials | |
| Fire hazard testing - Glow-wire ignitability test method for materials | |
| Fire hazard testing - Part 1-10: Guidance for assessing the fire hazard of electrotechnical products - General guidelines | |
| Fire hazard testing - Part 1-30: Guidance for assessing the fire hazard of electrotechnical products - Use of preselection testing procedures | |
| Fire hazard testing - Part 10-3: Abnormal heat - Mould stress relief distortion test | |
| Fire hazard testing - Part 11-10: Test flames - 50 W horizontal and vertical flame test methods | |
| Fire hazard testing - Part 11-20: Test flames - 500 W flame test methods | |
| Fire hazard testing - Part 11-4: Test flames - 50 W flame - Apparatus and confirmational test method | |
| Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance | |
| Fire hazard testing - Part 1: Guidance for assessing fire hazard of electrotechnical products - Section 1: General guidance | |
| Fire hazard testing -- Part 11-11: Test flames -- Determination of the characteristic heat flux for ignition from a non-contacting flame source | |
| Fire Hazard Testing Part 10: Guidance and Test Methods for the Minimization of the Effects of Abnormal Heat on Electrotechnical Products Involved in Fires - Section 2: Method for Testing... | |
| Fire hazard testing Part 1: Guidance for the preparation of requirements and test specifications for assessing fire hazard of electrotechnical products guidance for electronic components | |
| Fire hazard testing Part 1: Guidance for the preparation of requirements and test specifications for assessing fire hazard of electrotechnical products Guidance for use preselection procedures | |
| Fire Hazard Testing Part 2: Test Methods - Section 4/Sheet 1: 1 kW Nominal Pre-Mixed Test Flame and Guidance | |
| Fire hazard testing Part 2: Test methods - Section 4/sheet 2: 500 W nominal test flames and guidance | |
| Fire hazard testing-Part 1-11: Guidance for assessing the fire hazard of electrotechnical products-Fire hazard assessment | |
| Fire hazard testing-Part 1-12: Guidance for assessing the fire hazard of electrotechnical products-Fire safety engineering | |
| Fire hazard testing-Part 1-20: Guidance for assessing the fire hazard of electrotechnical products-Ignitabilit y-General guidance | |
| Fixed carbon film chip resistors cylindrical type for use in electronic equipment (form 27, characteristic D and G, grade C) | |
| Fixed metal film chip resistors cylindrical type for use in electronic equipment (form 27 and 27S, characteristic G, grade C) | |
| Fixed metal film chip resistors rectangular type for use in electronic equipment (Form 72 and 73, characteristic F, G and H, grade C) | |
| Fixed metal film resistors for use in electronic equipment - form 05, grade A | |
| Fixed metal film resistors for use in electronic equipment - form 05, grade B | |
| Fixed metal film resistors for use in electronic equipment - form 14, grade A | |
| Fixed metal film resistors for use in electronic equipment - form 14, grade C | |
| Fixed metal film resistors for use in electronic equipment - form 92, grade C | |
| Fixed resistors for use in electronic equipment - Part 9-1: Blank detail specification: Fixed surface mount resistor networks with individually measurable resistors - Assessment level EZ | |
| Fixed resistors for use in electronic equipment - Part 9: Sectional specification: Fixed surface mount resistor networks with individually measurable resistors | |
| Fixed resistors for use in electronic equipment Part 6: Blank detail specification: Fixed resistor networks with individually measurable resistors, all of equal value and equal dissipation Assessment level E | |
| Fixed Resistors for Use in Electronic Equipment Part 6: Blank Detail Specification: Fixed Resistor Networks with Individually Measurable Resistors, of Either Different Resistance Values or Different Rated Dissipations Assessment Level... | |
| Fixed resistors for use in electronic equipment Part 6: Sectional specification: Fixed resistor networks with individually measurable resistors | |
| Fixed resistors for use in electronic equipment Part 8: Blank detail specification: Fixed chip resistors Assessment level E | |
| Fixed resistors for use in electronic equipment Part 8: Sectional specification: Fixed chip resistors | |
| Fixed thick film chip resistors rectangular type for use in electronic equipment (Form 72 and 73, characteristic H, K and M, grade C) | |
| General rules and testing methods for intercommunication equipments (Amendment 1) | |
| General rules and testing methods for intercommunication equipments | |
| General Rules for Power Transformers for Electronic Equipment | |
| General Rules for Reliability Assured Electronic Components | |
| General rules for reliability assured lowpower electromagnetic relays for industrial control circuits | |
| General Rules of Connectors for Optical Fiber Cords | |
| General rules of connectors for radio frequency coaxial cables | |
| General Rules of Connectors for Use in Electronic Equipment | |
| General rules of connectors with optical fiber cables | |
| General rules of dispersion compensators for fiber optic transmission (Amendment 1) | |
| General rules of dispersion compensators for fiber optic transmission | |
| General Rules of Fiber Optic Branching Devices | |
| General rules of fixed metal film resistors for use in electronic equipment | |
| General rules of fixed resistor networks for use in electronic equipment | |
| General Rules of High Frequency Coils and Intermediate Frequency Transformers for Electronic Equipment | |
| General rules of interference filters | |
| General rules of laser diode modules for fiber optic transmission | |
| General rules of laser diode modules for optical fiber amplifier | |
| General Rules of Laser Diodes for Fiber Optic Transmission | |
| General Rules of Laser Diodes Used for Recording and Playback | |
| General rules of lenses for fiber optic transmission | |
| General Rules of Light Emitting Diodes for Fiber Optic Transmission | |
| General Rules of Low Frequency Transformer for Electronic Equipment | |
| General rules of one-part connectors for printed wiring board | |
| General Rules of Optical Attenuator | |
| General rules of optical circulators | |
| General rules of optical isolators for fiber optic transmission | |
| General rules of optical isolators for light beam transmission | |
| General Rules of Optical Switches | |
| General Rules of Passive Device for Light Beam Transmission | |
| General Rules of Passive Devices for Fiber Optic Transmission | |
| General rules of passive devices for light beam transmission (Amendment 1) | |
| General Rules of Photodiodes for Fiber Optic Transmission | |
| General rules of potentiometers for use in electronic equipment | |
| General rules of wavelength switches | |
| General specifications of polarizer | |
| General specifications of retarder | |
| Generic specification of switches for use in electronic equipment | |
| Glossary of Passive Components for Electronic Equipment | |
| Glossary of Pulse Techniques | |
| Glossary of terms for nurse call system | |
| Glossary of Terms Used in Electronics and Telecommunications (Basic Terms) | |
| Glossary of terms used in electronics and telecommunications (radiotelecommunicat ions No.1) | |
| Glossary of terms used in integrated circuits | |
| Hearing Aids | |
| Helical-scan video tape cassette system using 12.65 mm (0.5 in) magnetic tape on type beta format | |
| Helical-scan video tape cassette system using 12.65 mm (0.5 in) magnetic tape on type VHS | |
| Helical-scan video tape cassette system using 8 mm magnetic tape - 8 mm Video | |
| Horn type loudspeakers | |
| Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests | |
| Insulation coordination for equipment within low-voltage systems - Part 3: Use of coating, potting or moulding for protection against pollution | |
| Insulation coordination for equipment within low-voltage systems - Part 4: Consideration of high-frequency voltage stress | |
| Insulation coordination for equipment within low-voltage systems - Part 5: Comprehensive method for determining clearances and creepage distances equal to or less than 2 mm | |
| Intermediate frequency for television receivers | |
| Intermediate frequency of radio receiver for broadcast | |
| International Electrotechnical Vocabulary - Part 551: Power electronics | |
| International Electrotechnical Vocabulary: Electromagnetic compatibility | |
| Laser modules used for telecommunication - Reliability assessment | |
| Loudspeakers for Sound System Equipment | |
| Low-voltage electrical installations - Part 1: Fundamental principles, assessment of general characteristics, definitions | |
| Low-voltage electrical installations - Part 4-41: Protection for safety - Protection against electric shock | |
| Low-voltage electrical installations - Part 5-51: Selection and erection of electrical equipment - Common rules | |
| Low-voltage electrical installations - Part 6: Verification | |
| Low-voltage surge protective devices - Part 11: Surge protective devices connected to low-voltage power systems - Requirements and test methods | |
| Low-voltage surge protective devices - Part 22: Surge protective devices connected to telecommunications and signalling networks - Selection and application principles | |
| Low-voltage surge protective devices -- Part 31: Requirements and test methods for SPDs for photovoltaic installations | |
| Low-voltage surge protective devices -- Part 32: Surge protective devices connected to the d.c. side of photovoltaic installations -- Selection and application principles | |
| Magnetic tape sound recording and reproducing systems Part 1: General conditions and requirements | |
| Magnetic tape sound recording and reproducing systems Part 2: Calibration tapes | |
| Magnetic tape sound recording and reproducing systems Part 3: Methods of measuring the characteristics of recording and reproducing equipment for sound on magnetic tape | |
| Magnetic tape sound recording and reproducing systems Part 4: Mechanical magnetic tape properties | |
| Magnetic tape sound recording and reproducing systems Part 5: Electrical magnetic tape properties | |
| Magnetic tape sound recording and reproducing systems Part 6: Reel-to-reel systems | |
| Magnetic tape sound recording and reproducing systems Part 7: Cassette for commercial tape records and domestic use | |
| Marking codes for resistors and capacitors | |
| Measurement methods of lenses for fiber optic transmission | |
| Measuring methods of laser diode modules for optical fiber amplifier | |
| Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482.6 mm (19 in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabinets... | |
| Method for test of connectors for use in electronic equipment (Amendment 1) | |
| Method for Test of Connectors for Use in Electronic Equipment | |
| Method of measurement of speed fluctuations in sound recording and reproducing equipment | |
| Methods for characterising signal processing in hearing aids with a speech-like signal | |
| Methods of measurement on communication receivers for amplitude-modulation transmissions | |
| Methods of Test for High Frequency Inductors and Intermediate Frequency Transformers for Electronic Equipment | |
| Microphones | |
| Midget Earphones | |
| Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard for modular order for the development of mechanical structures for electronic equipment practice... | |
| Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice | |
| Non-connectorized single-mode fiber optic 980/1 550nm WWDM devices | |
| Non-connectorized single-mode fiber optic C-band/L-band WDM devices | |
| Non-connectorized single-mode fibre optics middle-scale 1xN DWDM devices | |
| Non-wavelength-selec tive fiber optic branching devices - Part 1: Generic specification | |
| Non-wavelength-selec tive fiber optic branching devices - Part 3: Non-connectorized single-mode 1xN and 2xN non-wavelength-selec tive branching devices | |
| Optical circulators - Part 3: Non-connectorized single-mode fiber optic circulators | |
| Optical isolator - Part 1: Generic specification | |
| Optical isolators - Part 2: Test methods | |
| Optical isolators - Part 3: Non-connectorized single-mode fiber optic isolators | |
| Potentiometers for use in electronic equipment - Part 2: Blank detail specification: Lead-screw actuated and rotary preset potentiometers Assessment level E | |
| Potentiometers for use in electronic equipment - Part 2: Blank detail specification: Lead-screw actuated and rotary preset potentiometers Assessment level F | |
| Potentiometers for use in electronic equipment - Part 2: Sectional specification: Lead-screw actuated and rotary preset potentiometers | |
| Potentiometers for use in electronic equipment - Part 3: Blank detail specification: Rotary precision potentiometers Assessment level E | |
| Potentiometers for use in electronic equipment - Part 3: Sectional specification: Rotary precision potentiometers | |
| Potentiometers for use in electronic equipment - Part 4: Blank detail specification: Single-turn rotary power potentiometers Assessment level E | |
| Potentiometers for use in electronic equipment - Part 4: Blank detail specification: Single-turn rotary power potentiometers Assessment level F | |
| Potentiometers for use in electronic equipment - Part 4: Sectional specification: Single-turn rotary power potentiometers | |
| Potentiometers for use in electronic equipment - Part 5: Blank detail specification: Single-turn rotary low-power potentiometers Assessment level E | |
| Potentiometers for use in electronic equipment - Part 5: Blank detail specification: Single-turn rotary low-power potentiometers Assessment level F | |
| Potentiometers for use in electronic equipment - Part 5: Sectional specification: Single-turn rotary low-power wirewound and non-wirewound potentiometers | |
| Potentiometers for use in electronic equipment Part 1: Generic specification | |
| Preferred number series for resistors and capacitors | |
| Printed boards design, manufacture and assembly -- Vocabulary -- Part 1: Common usage in printed board and electronic assembly technologies | |
| Radio frequency connectors -- Part 1: Generic specification -- General requirements and measuring methods | |
| Semiconductor devices - Micro-electromechani cal devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures | |
| Semiconductor devices - Micro-electromechani cal devices - Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures | |
| Semiconductor devices - Micro-electromechani cal devices - Part 18: Bend testing methods of thin film materials | |
| Semiconductor devices - Micro-electromechani cal devices - Part 19: Electronic compasses | |
| Semiconductor devices - Micro-electromechani cal devices - Part 1: Terms and definitions | |
| Semiconductor devices - Micro-electromechani cal devices - Part 20: Gyroscopes | |
| Semiconductor devices - Micro-electromechani cal devices - Part 26: Description and measurement methods for micro trench and needle structures | |
| Semiconductor devices - Micro-electromechani cal devices - Part 3: Thin film standard test piece for tensile testing | |
| Semiconductor devices - Micro-electromechani cal devices - Part 6: Axial fatigue testing methods of thin film materials | |
| Semiconductor devices - Micro-electromechani cal devices-Part 2: Tensile testing method of thin film materials | |
| Semiconductor devices -- Micro-electromechani cal devices -- Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices | |
| Semiconductor devices -- Micro-electromechani cal devices -- Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film | |
| Single-mode fiber, pigtailed-style fixed optical attenuators | |
| Single-mode fiber, pigtailed-style optical circulators | |
| Single-mode fiber, pigtailed-style optical isolators | |
| Standard condenser microphones | |
| Surge protective devices connected to low-voltage power distribution systems - Performance requirements and testing methods | |
| Surge protective devices connected to low-voltage power distribution systems - Selection and application principles | |
| Surge protective devices connected to telecommunications and signalling networks - Performance requirements and testing methods | |
| Terms and definitions for printed circuits | |
| Test Methods for Optical Switches | |
| Test Methods for Passive Devices for Fiber Optic Transmission | |
| Test methods of connectors for optical fiber cables (Amendment 1) | |
| Test Methods of Connectors for Optical Fiber Cords | |
| Test methods of fixed resistors for electronic equipment | |
| Test methods of interference filter | |
| Test methods of laser diode modules for fiber optic transmission | |
| Test Methods of Laser Diodes for Fiber Optic Transmission | |
| Test Methods of Laser Diodes Used for Recording and Playback | |
| Test Methods of Light Emitting Diodes for Fiber Optic Transmission | |
| Test methods of low power electromagnetic relays for industrial control circuits | |
| Test methods of optical isolators for fiber optic transmission | |
| Test methods of optical isolators for light beam transmission | |
| Test methods of passive devices for fibre optic transmission (Amendment 1) | |
| Test Methods of Photodiodes for Fiber Optic Transmission | |
| Test methods of polarizer | |
| Test methods of potentiometers for use in electronic equipment | |
| Testing methods of image quality for video - Doorphone | |
| Testing Methods of Power Transformers for Electronic Equipment | |
| Testing methods of surface mounting switches for use in electronic equipment | |
| Testing methods of switches for use in electronic equipment (Amendment 1) | |
| Testing methods of switches for use in electronic equipment | |
| Tests for enclosures for JIS C 6010 (all parts) and IEC 60297 (all parts) - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks subracks and chassis | |
| Tests for enclosures for JIS C 6010 (all parts) and IEC 60297 (all parts) - Part 2: Seismic tests for cabinets and racks | |
| Tests for enclosures for JIS C 6010 (all parts) and IEC 60297 (all parts) - Part 3: Electromagnetic shielding performance tests for cabinets, racks and subracks | |
| Type R01 cylindrical connectors for use in electronic equipment |
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