Accuris Semiconductor devices - Micro-electromechanical devices - Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures JIS C 5630-13

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Semiconductor devices - Micro-electromechani cal devices - Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
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Semiconductor devices - Micro-electromechani cal devices - Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
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Semiconductor devices - Micro-electromechanical devices - Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures - JIS C 5630-13 - Accuris
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Semiconductor devices - Micro-electromechanical devices - Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
JIS C 5630-13
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures JIS C 5630-13
Semiconductor devices - Micro-electromechani cal devices - Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

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  Accuris
Product Category Standards and Technical Documents
Product Number JIS C 5630-13
Product Name Semiconductor devices - Micro-electromechanical devices - Part 13: Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
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