Accuris Datasheets for Standards and Technical Documents
Standards and technical documents includes standards, codes, regulation, handbooks, manuals, comprehensive guides and other formal publications. Standards, codes, and regulation establish uniform specifications, procedures or technical criteria.
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| Product Name | Notes |
|---|---|
| A New Multiparameter Approach to the Prediction of Wear Rates in Agricultural Sprayer Nozzles | |
| ACACIA, TECHNICAL (GUM ARABIC) | |
| Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Devices | |
| Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components | |
| Addendum pour le secteur automobile \xe0 la norme IPC J-STD-001G Exigences relatives au brasage d\x92assemblages \xe9lectroniques et \xe9lectriques et \xe0 la norme IPC-A-610G Acceptabilit\xe9 des assemblages \xe9lectroniques | |
| Adenda para dispositivos electr\xf3nicos utilizados en aplicaciones militares y espaciales, realizada al documento IPC J-STD-001G titulado Requisitos de ensambles soldados el\xe9ctricos y electr\xf3nicos | |
| AIR SYSTEM | |
| AIR VEHICLE ELECTRICAL POWER SUBSYSTEM REQUIREMENTS AND GUIDANCE | |
| AIR VEHICLE HYDRAULIC POWER SUBSYSTEM REQUIREMENTS AND GUIDANCE | |
| Air Vehicle Landing Subsystem Requirements And Guidance | |
| AIR VEHICLE MECHANICAL SUBSYSTEMS REQUIREMENTS AND GUIDANCE | |
| AIR VEHICLE SUBSYSTEMS | |
| AIR VEHICLE/SHIP INTEGRATION | |
| AIR VEHICLE | |
| AIR VEHICLES SUBSYSTEMS | |
| AIRCRAFT STRUCTURES | |
| Anexo automotriz a IPC J-STD-001G Requisitos para ensambles soldados el\xe9ctricos y electr\xf3nicos y IPC-A-610G Aceptabilidad de ensambles electr\xf3nicos | |
| Anforderungen an gel\xf6tete elektrische und elektronische Baugruppen \xc4nderung 1 | |
| Anforderungen an gel\xf6tete elektrische und elektronische Baugruppen | |
| Annexe des produits \xe9lectroniques des applications spatiales et militaires \xe0 la norme J-STD-001G, Exigences des Assemblages \xc9lectriques et \xc9lectroniques Bras\xe9s | |
| Automotive 48-volt Technology | |
| Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies | |
| Automotive Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610H Acceptability of Electronic Assemblies | |
| Automotive Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610J Acceptability of Electronic Assemblies | |
| Automotive Cybersecurity: From Perceived Threat to Stark Reality | |
| Autonomous Technologies: Applications That Matter | |
| BALL, GAUZE | |
| BEANS, DRIED, CANNED (IN SAUCE OR BRINE, WITH OR WITHOUT MEAT OR MEAT PRODUCT) | |
| BEANS, DRY | |
| C\xe1c Y\xeau C?u \xd0?i V?i S?n Ph?m \xd0i?n v\xe0 \xd0i?n T? H\xe0n L?p R\xe1p | |
| CASTOR OIL, TECHNICAL | |
| Charged Device Model Testing of Integrated Circuits | |
| CHOCOLATE, COOKING, AND CHOCOLATE CHIPS | |
| Classification of Passive and Solid State Devices for Assembly Processes | |
| Commercial Building Grounding (Earthing) and Bonding Requirements For Telecommunications | |
| CONTAMINATION CONTROL REQUIREMENTS MANUAL | |
| COTTON, PURIFIED (STERILE) AND NONSTERILE | |
| CREW SYSTEMS AIRCRAFT LIGHTING HANDBOOK | |
| CREW SYSTEMS COCKPIT/CREW STATION/CABIN HANDBOOK | |
| CREW SYSTEMS CRASH PROTECTION HANDBOOK | |
| CREW SYSTEMS CREW STATION AUTOMATION, INFORMATION AND CONTROL/DISPLAY MANAGEMENT HANDBOOK | |
| CREW SYSTEMS DEPLOYABLE AERODYNAMIC DECELERATOR (DAD) SYSTEMS HANDBOOK | |
| Crew Systems Emergency Egress Handbook | |
| Crew Systems Energetics Handbook | |
| CREW SYSTEMS OXYGEN SYSTEMS HANDBOOK | |
| CREW SYSTEMS SURVIVAL, SEARCH, AND RESCUE (SSAR) HANDBOOK | |
| CREWED SPACE VEHICLE BATTERY SAFETY REQUIREMENTS | |
| Current Tin Whiskers Theory and Mitigation Practices Guideline | |
| Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers | |
| Damage Threat Assessment (DT A) and Damage Control Plan (DCP) Template for Composite Overwrapped Pressure Vessels | |
| Defining \x93Low-Halogen\x94 Electronic Products (Removal of BFR/CFR/PVC) | |
| Defining \x93Low-Halogen\x94 Passives and Solid State Devices (Removal of BFR/CFR/PVC) | |
| Definition of \x93Low-Halogen\x94 For Electronic Products | |
| Design Guideline for Printed Electronics | |
| Driver Distraction and Inattention | |
| Effect of Impact Energy in ESSO Test (Part 2: Proposal of Validity Criteria of Impact Condition in ESSO Test by FEM Crack Propagation Analysis | |
| Effect of Impact Energy in ESSO Test (Part 3: Experimental Validation for New Validity Criteria of Impact Condition Giving Constant Evaluation in ESSO Test) | |
| Effect of Impact Energy in the Esso Test (Part 1: Basic Experiments and Validation of FEM Analysis) | |
| Eisen voor gesoldeerde elektrische en elektronische geassembleerde printplaten | |
| Electrostatic Discharge Sensitivity Testing Charged Device Model (CDM) Device Level | |
| Electrostatic Discharge Sensitivity Testing Human Body Model (HBM) - Component Level | |
| Emergency Alert Message for Cable | |
| Emergency Alert Messaging for Cable | |
| Engine Emissions Measurement Handbook | |
| ENGINEERING DRAWING SYSTEM MANUAL DRAWING FORMAT, REQUIREMENTS, AND PROCEDURES | |
| ENGINES, AIRCRAFT, TURBINE | |
| Enhanced Wireless 9-1-1 Phase 2 Addendum 1 | |
| Enhanced Wireless 9-1-1 Phase 2 | |
| Enhanced Wireless 9-1-1 Phase II (Erratum) | |
| Enhanced Wireless 9-1-1 Phase II Addendum 1 | |
| Enhanced Wireless 9-1-1 Phase II | |
| Ethernet Ordering Technical Specification: Business Requirements and Use Cases | |
| FRACTURE CONTROL PLAN FOR JSC SPACE-FLIGHT HARDWARE | |
| GSM MAP and TIA-41 MAP - Revision B-cdma2000 Support | |
| Guide for Qualification of Nondestructive Evaluation procedures | |
| Guideline For Qualification of Fuzes, Safe and Arm (S&A) Devices, And Ignition Safety Devices (ISD) | |
| GUM, PRESERVATIVE AND ETCH; FOR OFFSET DUPLICATING PROCESS | |
| HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES **CONTAINS COLOR** | |
| Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices | |
| Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices | |
| HOSE, FIRE, LINEN, UNLINED (WITH OR WITHOUT COUPLINGS) | |
| Implementation of Ball Grid Array and Other High Density Technology | |
| Implementation of Flip Chip and Chip Scale Technology | |
| Job Code Classification System Part II - Production Operations and Marketing/Transporta tion Operations | |
| JOINT ATIS/TIA CMAS ALERT GATEWAY TO CMSP GATEWAY INTERFACE SPECIFICATION | |
| JOINT ATIS/TIA CMAS FEDERAL ALERT GATEWAY TO CMSP GATEWAY INTERFACE SPECIFICATION | |
| JOINT ATIS/TIA CMAS FEDERAL ALERT GATEWAY TO CMSP GATEWAY INTERFACE TEST SPECIFICATION | |
| Joint ATIS/TIA CMAS Mobile Device Behavior Specification | |
| Joint ATIS/TIA Native SMS to 9-1-1 Requirements and Architecture Specification | |
| Joint ATIS/TIA Standard on Coexistence and Interference Issues in Land Mobile Systems | |
| JOINT INDUSTRY STANDARD Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages | |
| JOINT INDUSTRY STANDARD Selection and Application of Board Level Underfill Materials | |
| JOINT INTEROPERABILITY AND WARRIOR SUPPORT | |
| Joomla! 2.5 Beginner\x92s Guide | |
| jQuery for Designers: Beginner\x92s Guide | |
| jQuery Mobile Web Development Essentials | |
| JSC Design and Procedural Standards | |
| JSC FILES AND RECORDS MANAGEMENT PROCEDURES | |
| Julia High Performance | |
| Julia: High Performance Programming | |
| Juran's Quality Handbook: The Complete Guide to Performance Excellence, Sixth Edition | |
| JUVINALL'S FUNDAMENTALS OF MACHINE COMPONENT DESIGN | |
| Lawfully Authorized Electronic Surveillance (LAES) \x96 Addendum 2 - Support for Carrier Identity | |
| Lawfully Authorized Electronic Surveillance (LAES) Addendum 1\x96Addition of Mobile Equipment IDentifier (MEID) | |
| Lawfully Authorized Electronic Surveillance (LAES) Addendum 3 \x96 Support for BSID or Subnet | |
| Lawfully Authorized Electronic Surveillance | |
| LEADS, ELECTRICAL, ARC-WELDING | |
| LEADS, STORAGE-BATTERY | |
| Les exigences relatives au brasage d\x92assemblages \xe9lectroniques et \xe9lectriques | |
| Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes | |
| Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Pb-Free and Other Attributes | |
| Marking, Symbols, and Labels of Leaded and Lead-Free Terminal Finished Materials Used in Electronic Assembly | |
| Mechanical Outline Standard for Flip Chip and Chip Size Configurations | |
| MODULAR OPEN SYSTEMS APPROACH (MOSA) PORTFOLIO \x96 HARDWARE OPEN SYSTEMS TECHNOLOGIES (HOST), FUTURE AIRBORNE CAPABILITY ENVIRONMENT\x99 OR FACE\x99, SENSOR OPEN SYSTEMS ARCHITECTURE OR SOSA\x99, UNMANNED SYSTEMS (UXS) CONTROL SEGMENT (UCS),... | |
| Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs) | |
| Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices | |
| Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices | |
| Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices | |
| NET, INSECT | |
| NETS, LAUNDRY | |
| Notification Standard for Product Discontinuance | |
| Performance Standard for Ball Grid Array Balls | |
| Performance Standard for Construction of Flip Chip and Chip Scale Bumps | |
| Performance Testing for Lighting Controls and Switching Devices with Electronic Drivers and Discharge Ballasts | |
| Personal Communications Services-SS7-Based A-Interface | |
| PICKLES | |
| POTATO SALAD, THERMOSTABILIZED, TRAY PACK | |
| POTATOES IN CHICKEN SAUCE, THERMOSTABILIZED, TRAY PACK | |
| POTATOES, WHITE, DEHYDRATED | |
| Requirements for Development of Explosive Ordnance Disposal Procedures | |
| REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS *** CALL FOR QUOTE *** | |
| Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1 | |
| Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications | |
| REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS | |
| Requirements for Solder Pastes | |
| REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES (SINGLE USE LICENSE)SPACE APPLICATIONS ELECTRONIC HARDWARE ADDENDUM TO J-STD-001 CD *** CALL FOR QUOTE *** | |
| REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES *** CALL FOR QUOTE *** | |
| Requirements for Soldered Electrical and Electronic Assemblies - Redline | |
| Requirements for Soldered Electrical and Electronic Assemblies Amendment 1 | |
| REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES | |
| REQUIREMENTS FOR SOLDERING FLUXES | |
| REQUIREMENTS FOR SOLDERING PASTES *** CALL FOR QUOTE *** | |
| Requirements for Soldering Pastes | |
| Requirements for welding electrical and electrical components | |
| REQUIREMENTS FRO SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES | |
| Requisitos de Ensambles El\xe9ctricos y Electr\xf3nicos Soldados | |
| Requisitos para Ensambles El\xe9ctricos y Electr\xf3nicos Soldados | |
| Requisitos para la soldadura de ensambles el\xe9ctricos y electr\xf3nicos Enmienda 1 | |
| Safety and Suitability For Service Assessment Testing For Mortar Cartridges | |
| SALAD OIL, VEGETABLE | |
| SEEDS, AGRICULTURAL | |
| Semiconductor Design Standard for Flip Chip Applications | |
| SOCKS, COTTON | |
| Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires Amendment 1 | |
| Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires | |
| SOLDERABILITY TESTS FOR PRINTED BOARDS *** CALL FOR QUOTE *** | |
| Solderability Tests for Printed Boards | |
| SOUPS; CANNED | |
| Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies Amendment 1 | |
| Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies | |
| Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies | |
| Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies - Redline | |
| Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies | |
| Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic Assemblies | |
| Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies | |
| Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies Amendment 1 | |
| Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies | |
| Space Applications Electronic Hardware Addendum to Requirements for Soldered Electrical and Electronic Assemblies | |
| SPACECRAFT MAXIMUM ALLOWABLE CONCENTRATIONS FOR AIRBORNE CONTAMINANTS | |
| Standard for Information Technology Software Life Cycle Processes Software Development Acquirer- Supplier Agreement | |
| STOCKINET, SURGICAL | |
| STRAP, WEBBING | |
| Study of Interworking between Land Mobile Radio (LMR as defined by TIA-102 series and TIA-603 series standards) and 3rd Generation Partnership Project (3GPP) Mission Critical Services | |
| SUGAR, REFINED AND BROWN: BEET OR CANE | |
| Supplement A to J-STD-100 Joint ATIS/TIA CMAS Mobile Device Behavior Specification | |
| SUSPENSORY, SCROTAL | |
| SYRUP, MAPLE | |
| SYRUP | |
| Technical Manual for The Use of Logic Devices in Safety Features | |
| Telecommunications - Personal Access Communications System Air Interface Standard | |
| Telecommunications - Personal Access Communications System Unlicensed (Version A) Air Interface Standard | |
| Telecommunications - Personal Access Communications System Unlicensed (Version B) Air Interface Standard | |
| Telecommunications - Personal Communications Services - PCS1900 - Air Interface Specification | |
| Telecommunications - Personal Station-Base Station Compatibility Requirements for 1.8 to 2.0 GHz Code Division Multiple Access (CDMA) Personal Communications Systems | |
| Telecommunications - Recommended Minimum Performance Requirements for 1.8 to 2.0 GHz Code Division Multiple Access (CDMA) Personal Stations | |
| Telecommunications - Recommended Minimum Performance Requirements for Base Stations Supporting 1.8 to 2.0 GHz Code Division Multiple Access (CDMA) Personal Stations | |
| Telecommunications - Recommended Minimum Performance Standards of Personal Access Communications System (PACS) Radio Ports | |
| Telecommunications - Recommended Minimum Performance Standards of Personal Access Communications System (PACS) Subscriber Units | |
| TOMATOES, STEWED, THERMOSTABILIZED, TRAY PACK | |
| Unwinding Electric Motors: Strategic Perspectives and Insights for Automotive Powertrain Applications | |
| User Guide of ANSI/ESDA/JEDEC JS-001 Human Body Model Testing of Integrated Circuits | |
| Vehical Control and Management System (VCMS) | |
| VEHICLE CONTROL AND MANAGEMENT SYSTEM (VCMS) | |
| W-CDMA (Wideband Code Division Multiple Access) Air Interface Compatibility Standard for 1.85 to 1.99 GHz PCS Applications | |
| WEBBING, TEXTILE, (COTTON, ELASTIC) | |
| WIRE, MAGNET, ELECTRICAL, CLASS 105, TYPE E OLEORESINOUS-ENAMEL- COATED, ROUND | |
| WIRE, MAGNET, ELECTRICAL, CLASS 105, TYPE T, POLYVINYL-FORMAL-COA TED, RECTANGULAR | |
| WIRE, MAGNET, ELECTRICAL, CLASS 155, TYPE DGV, POLYESTER-GLASS-FIBE R-COVERED, RECTANGULAR | |
| WIRE, MAGNET, ELECTRICAL, CLASS 155, TYPE DGV, POLYESTER-GLASS-FIBE R-COVERED, ROUND | |
| WIRE, MAGNET, ELECTRICAL, CLASS 155, TYPE GV, GLASS-FIBER-COVERED, RECTANGULAR | |
| WIRE, MAGNET, ELECTRICAL, CLASS 155, TYPE GV, GLASS-FIBER-COVERED, ROUND | |
| WIRE, MAGNET, ELECTRICAL, CLASS 155, TYPE L, POLYESTER COATED, ROUND | |
| WIRE, MAGNET, ELECTRICAL, CLASS 155, TYPE LN, POLYESTER OR POLYESTER-IMIDE OVERCOATED WITH POLYAMIDE, ROUND | |
| WIRE, MAGNET, ELECTRICAL, CLASS 155, TYPE SPE, SOLDERABLE POLYESTER-IMIDE, ROUND | |
| WIRE, MAGNET, ELECTRICAL, CLASS 180, TYPE DGH, POLYESTER-GLASS-FIBE R, SILICONE TREATED, RECTANGULAR | |
| WIRE, MAGNET, ELECTRICAL, CLASS 180, TYPE DGH, POLYESTER-GLASS-FIBE R-COVERED, SILICONE TREATED ROUND | |
| WIRE, MAGNET, ELECTRICAL, CLASS 180, TYPE H, POLYESTER-IMIDE OR POLYESTER-AMIDE-IMID E, ROUND | |
| WIRE, MAGNET, ELECTRICAL, CLASS 200, TYPE GK, GLASS-FIBER-COVERED, SILICONE TREATED RECTANGULAR | |
| WIRE, MAGNET, ELECTRICAL, CLASS 200, TYPE K, POLYESTER, POLYESTER-IMIDE OR POLYESTER-AMIDE-IMID E OVERCOATED WITH POLYAMIDE-IMIDE, RECTANGULAR | |
| WIRE, MAGNET, ELECTRICAL, CLASS 200, TYPE K, POLYESTER, POLYESTER-IMIDE OR POLYESTER-AMIDE-IMID E OVERCOATED WITH POLYAMIDE-IMIDE, ROUND | |
| WIRE, MAGNET, ELECTRICAL, CLASS 220, TYPE M, POLYIMIDE COATED, RECTANGULAR | |
| WIRE, MAGNET, ELECTRICAL, CLASS 220, TYPE M, POLYIMIDE, COATED, ROUND | |
| WIRE, MAGNET, ELECTRICAL, CLASS 220, TYPE M2DGGM, POLYESTER-GLASS AND GLASS-FIBER, POLYIMIDE TREATED, RECTANGULAR | |
| WIRE, MAGNETIC, ELECTRICAL, CLASS 200, TYPE GK, GLASS-FIBER-COVERED, SILICONE TREATED, ROUND | |
| Wireless Enhanced Emergency Services |
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