Epoxy Technology Electrically Conductive Epoxy EPO-TEK® EJ2189-LV

Description
EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials are used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices. Our EPO-TEK® ECAs are also known for being high reliability (HI-REL) die attachment adhesives and are commonly used in military applications (MIL-STD).
Description
EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials are used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices. Our EPO-TEK® ECAs are also known for being high reliability (HI-REL) die attachment adhesives and are commonly used in military applications (MIL-STD).
Datasheet
Datasheet Summary
Powered by GS/AI

EPO-TEK¬Æ EJ2189-LV is a two-component, electrically conductive epoxy that is silver-filled and designed for low-temperature curing. It has a recommended cure temperature of 150¬8C for one hour, with alternative curing options available at lower temperatures. The mix ratio by weight is 10:1, and it has a pot life of four hours at room temperature. The product exhibits a specific gravity of 3.07 for Part A and 0.94 for Part B, and it is characterized by a smooth flowing paste consistency. Its viscosity at 23¬8C ranges from 25,000 to 45,000 cPs, with a thixotropic index of 3.3. The epoxy has a glass transition temperature of at least 40¬8C and a degradation temperature of 340¬8C. It demonstrates a volume resistivity of ,â§ 0.0005 Ohm-cm when cured at 150¬8C for one hour. EJ2189-LV adheres well to various substrates, including metals, ceramics, glass, and engineering plastics. It is suitable for applications such as EMI and RF shielding, ITO interconnections in LCDs, and low-temperature die-attach in hybrids and IC packages. The product is packaged with a shelf life of one year at room temperature for bulk and six months at -40¬8C for syringe packaging.

Datasheet Summary
Powered by GS/AI

EPO-TEK¬Æ EJ2189-LV is a two-component, electrically conductive epoxy that is silver-filled and designed for low-temperature curing. It has a recommended cure temperature of 150¬8C for one hour, with alternative curing options available at lower temperatures. The mix ratio by weight is 10:1, and it has a pot life of four hours at room temperature. The product exhibits a specific gravity of 3.07 for Part A and 0.94 for Part B, and it is characterized by a smooth flowing paste consistency. Its viscosity at 23¬8C ranges from 25,000 to 45,000 cPs, with a thixotropic index of 3.3. The epoxy has a glass transition temperature of at least 40¬8C and a degradation temperature of 340¬8C. It demonstrates a volume resistivity of ,â§ 0.0005 Ohm-cm when cured at 150¬8C for one hour. EJ2189-LV adheres well to various substrates, including metals, ceramics, glass, and engineering plastics. It is suitable for applications such as EMI and RF shielding, ITO interconnections in LCDs, and low-temperature die-attach in hybrids and IC packages. The product is packaged with a shelf life of one year at room temperature for bulk and six months at -40¬8C for syringe packaging.

Suppliers

Company
Product
Description
Supplier Links
Electrically Conductive Epoxy - EPO-TEK® EJ2189-LV - Epoxy Technology
Billerica, MA, United States
Electrically Conductive Epoxy
EPO-TEK® EJ2189-LV
Electrically Conductive Epoxy EPO-TEK® EJ2189-LV
EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials are used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices. Our EPO-TEK® ECAs are also known for being high reliability (HI-REL) die attachment adhesives and are commonly used in military applications (MIL-STD).

EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966.

Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials are used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices. Our EPO-TEK® ECAs are also known for being high reliability (HI-REL) die attachment adhesives and are commonly used in military applications (MIL-STD).

Supplier's Site Datasheet

Technical Specifications

  Epoxy Technology
Product Category Polymers and Plastic Resins
Product Number EPO-TEK® EJ2189-LV
Product Name Electrically Conductive Epoxy
Type CastingResin; Thermally cured
Form / Shape Liquid
Chemical System Epoxy
Filler Metal or MIM; Silver
Industry Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging
Unlock Full Specs
to access all available technical data

Similar Products

Low Viscosity, Flexibilized Two Component Epoxy - EP30FL - Master Bond, Inc.
Specs
Type CastingResin; Optical; Thermally cured
Form / Shape Liquid
Chemical System Epoxy
View Details
Exact™ Plastomer Resins for Film Packaging - Exact™ 3139 - ExxonMobil - Polyethylene Products
Specs
Type FilmGrade; Thermoplastic
Tensile (Break) 8300 psi (57227 KPa)
Elongation 530.0 %
View Details
Rigid and Castable Absorbers -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Type CastingResin; Thermally cured
Chemical System Epoxy; Silicone
Features EMI / RFI Shielding Material
View Details
HIGH DENSITY POLYETHYLENE (HDPE-FDA) - NATURAL PELLETS H5234 (2 LBS) - APSX, LLC
Specs
Type MoldingCompound; Thermoplastic
Form / Shape Pellets
Chemical System Polyethylene
View Details