EPO-TEK¬Æ H20E-PFC is a two-component, semiconductor-grade electrically conductive silver epoxy adhesive designed for flip chip interconnects. It features a recommended cure condition of 150¬8C for one hour, with alternative curing options available at lower temperatures. The adhesive has a mix ratio of 1:1 by weight and a pot life of three days, making it suitable for various applications. The product exhibits a smooth thixotropic paste consistency and has a viscosity of 3,000 to 4,000 cPs at 23¬8C. It demonstrates a glass transition temperature of ,â 80¬8C and a degradation temperature of 407¬8C. The adhesive is compatible with various metallizations, including gold, copper, and silver, and is recommended for use with chips or wafers that have an under-bump metallization layer. EPO-TEK¬Æ H20E-PFC is suitable for applications in memory devices, RFID tags, smart cards, and medical devices. It passes NASA's low outgassing standard ASTM E595 when properly cured and can be applied using automated dispensing equipment. The adhesive's thermal conductivity is rated at 3.2 W/mK, and its volume resistivity is ,⧠0.0004 Ohm-cm at 23¬8C.
EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966.
Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials are used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices. Our EPO-TEK® ECAs are also known for being high reliability (HI-REL) die attachment adhesives and are commonly used in military applications (MIL-STD).
| Epoxy Technology | |
|---|---|
| Product Category | Polymers and Plastic Resins |
| Product Number | EPO-TEK® H20E-PFC |
| Product Name | Electrically Conductive, Silver Epoxy Adhesive |
| Type | CastingResin; Thermally cured |
| Form / Shape | Liquid |
| Chemical System | Epoxy |
| Filler | Metal or MIM; Silver |
| Industry | Aerospace; Electronics; Electrical Power or High Voltage; Military; Semiconductors or IC Packaging |
