Epoxy Technology Thermally Conductive Epoxy for Die Stamping EPO-TEK® H70S

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Thermally Conductive Epoxy for Die Stamping - EPO-TEK® H70S - Epoxy Technology
Billerica, MA, United States
Thermally Conductive Epoxy for Die Stamping EPO-TEK® H70S
Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments, including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following industries: Aerospace & Defense Automotive Electronics Optical Telecom Industrial Medical Oil & Gas

Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments, including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers.

EPO-TEK® Thermally Conductive Adhesives are used in the following industries:

  • Aerospace & Defense
  • Automotive
  • Electronics
  • Optical
  • Telecom
  • Industrial
  • Medical
  • Oil & Gas
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Technical Specifications

  Epoxy Technology
Product Category Polymers and Plastic Resins
Product Number EPO-TEK® H70S
Product Name Thermally Conductive Epoxy for Die Stamping
Industry Electronics; Electrical Power or High Voltage; Optoelectronics or Photonics
Viscosity 1300 to 1800 cP
Type CastingResin; Thermally cured
Use Temperature 572 F (300 C)
CTE 22 to 106 µin/in-F (40 to 190 µm/m-C)
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