EPO-TEK¬Æ H73 is a two-component thermally conductive epoxy that offers electrical insulation and high viscosity, making it suitable for various applications. It requires a recommended cure of 150¬8C for one hour, with alternative curing options available at lower temperatures, although performance may vary. The epoxy has a specific gravity of 2.03 for Part A and 1.02 for Part B, and a pot life of 2.5 hours at room temperature. The product exhibits a thermal conductivity of 0.8 W/mK and a volume resistivity of at least 3 x 10^13 Ohm-cm at 23¬8C. It has a glass transition temperature of ,â 100¬8C and a degradation temperature of 428¬8C. The epoxy is noted for its excellent resistance to solvents, chemicals, and moisture, as well as its ability to provide a near-hermetic seal. It is also NASA-approved for low outgassing applications. EPO-TEK¬Æ H73 is characterized by its thixotropic paste consistency, allowing for easy application through dispensing or manual methods. The product changes color upon curing, providing a visual indicator of completion. It is suitable for use in demanding environments, including aerospace, automotive, and electronics industries.
Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments, including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers.
EPO-TEK® Thermally Conductive Adhesives are used in the following industries:
| Epoxy Technology | |
|---|---|
| Product Category | Polymers and Plastic Resins |
| Product Number | EPO-TEK® H73 |
| Product Name | Thermally Conductive Epoxy |
| Type | CastingResin; Thermally cured |
| Form / Shape | Liquid |
| Chemical System | Epoxy |
| Filler | Unfilled |
| Industry | Aerospace; Electronics; Electrical Power or High Voltage; Semiconductors or IC Packaging |
