EPO-TEK¬Æ 323LP is a two-component optical epoxy designed for high-temperature applications in semiconductor, hybrid, fiber, and optical fields. It features a recommended cure temperature of 150¬8C for one hour, with a mix ratio of 10:1 by weight. The product has a pot life of 24 hours and a shelf life of one year at room temperature for bulk and one year at -40¬8C for syringe packaging. The epoxy exhibits a glass transition temperature of ,â 100¬8C and a degradation temperature of 413¬8C. It has a low weight loss percentage at elevated temperatures, making it suitable for applications requiring thermal stability. The optical properties include a spectral transmission of ,â 94% at 820-1,620 nm and a refractive index of 1.5704 at 589 nm. EPO-TEK¬Æ 323LP is particularly useful for wafer bonding in semiconductor applications, providing hermetic seals in hybrid devices, and is effective in fiber optic applications, including sealing fibers into ferrules. It is also applicable in electronic assembly as a dielectric layer and for insulating copper coil windings. The product's characteristics make it a viable option for engineers seeking reliable performance in demanding optical and electronic applications.
We have served the optical market since 301 was introduced in 1969. Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs. More recently, solar cells require our UV curing resin for harvesting sunlight, while providing watertight protection. EPO-TEK®
They are commonly used in:
| Epoxy Technology | |
|---|---|
| Product Category | Polymers and Plastic Resins |
| Product Number | EPO-TEK® 323LP |
| Product Name | Optical Epoxy |
| Type | CastingResin; Optical; Thermally cured |
| Form / Shape | Liquid |
| Chemical System | Epoxy |
| Filler | Unfilled |
| Industry | Optoelectronics or Photonics; Semiconductors or IC Packaging |
