Epoxy Technology Electrically Conductive, Silver Epoxy for Die Stamping EPO-TEK® H20S

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Electrically Conductive, Silver Epoxy for Die Stamping - EPO-TEK® H20S - Epoxy Technology
Billerica, MA, United States
Electrically Conductive, Silver Epoxy for Die Stamping
EPO-TEK® H20S
Electrically Conductive, Silver Epoxy for Die Stamping EPO-TEK® H20S
EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966. Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials are used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices. Our EPO-TEK® ECAs are also known for being high reliability (HI-REL) die attachment adhesives and are commonly used in military applications (MIL-STD).

EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and mechanical characteristics. We are the pioneer of Electrically Conductive Adhesives (ECA) since 1966.

Electrically conductive adhesives (ECAs) are typically based on silver-filled epoxy formulations; however, our product lines also include gold, platinum , nickel and copper. These materials are used as conductive interconnects instead of soldering. Processing at much lower temperatures while being lead-free and less brittle, ECAs are most commonly used for semiconductor packaging, microwave and RF (radio frequency) hermetic enclosures, photonics, PCB assembly and medical devices. Our EPO-TEK® ECAs are also known for being high reliability (HI-REL) die attachment adhesives and are commonly used in military applications (MIL-STD).

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Technical Specifications

  Epoxy Technology
Product Category Polymers and Plastic Resins
Product Number EPO-TEK® H20S
Product Name Electrically Conductive, Silver Epoxy for Die Stamping
Industry Electronics; Electrical Power or High Voltage; Optoelectronics or Photonics; Semiconductors or IC Packaging
Viscosity 1800 to 2800 cP
Type CastingResin; Thermally cured
Use Temperature 572 F (300 C)
CTE 17 to 67 µin/in-F (31 to 120 µm/m-C)
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