Accuris Datasheets for Standards and Technical Documents
Standards and technical documents includes standards, codes, regulation, handbooks, manuals, comprehensive guides and other formal publications. Standards, codes, and regulation establish uniform specifications, procedures or technical criteria.
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| Product Name | Notes |
|---|---|
| Adhesives \x97 Installation of floor coverings, wood flooring, levelling compounds and tiles \x97 Specification of trowel notch sizes | |
| Aluminium Alloy Electrical Conductor Wires Used in Polyolefin Insulated Telecommunication Cables | |
| Aluminum Electrical Conductor Wires Used in Polyolefin Insulated Telecommunication Cables | |
| AMENDMENT 1 - Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 501: Mechanical tests \x96 Tests for determining the mechanical properties of insulating and sheathing... | |
| Amendment 1 Common test methods for insulatin 9 and sheathin 9 materials of electric cables Part 3: Methods specific to PVC compounds Section Two - loss of mass test -... | |
| Amendment 1 Common test methods for insulating and sheathing materials of electric cables Part 1 : Methods for general application Section Four - Tests at low temperature | |
| Amendment 1 Common Test Methods for Insulating and Sheathing Materials of Electric Cables Part 1: Methods for General Application Section Two - Thermal Ageing Methods | |
| Amendment 1 Common test methods for insulating and sheathing materials of electric cables Part 3: Methods specific to PVC compounds Section One - Pressure test at high temperature - Tests... | |
| AMENDMENT 1 Electric and optical fibre cables - Test methods for non-metallic materials \x96 Part 410: Miscellaneous tests \x96 Test method for copper-catalyzed oxidative degradation of polyolefin insulated conductors | |
| AMENDMENT 1 Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 201: General tests \x96 Measurement of insulation thickness | |
| AMENDMENT 1 Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 202: General tests \x96 Measurement of thickness of non-metallic sheath | |
| AMENDMENT 1 Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 401: Miscellaneous tests \x96 Thermal ageing methods \x96 Ageing in an air oven | |
| AMENDMENT 1 Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 503: Mechanical tests \x96 Shrinkage test for sheaths | |
| AMENDMENT 1 Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 508: Mechanical tests \x96 Pressure test at high temperature for insulation and sheaths | |
| AMENDMENT 1 Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 509: Mechanical tests \x96 Test for resistance of insulations and sheaths to cracking (heat shock... | |
| AMENDMENT 1 Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 511: Mechanical tests \x96 Measurement of the melt flow index of polyethylene and polypropylene compounds... | |
| AMENDMENT 1 Electrical accessories \x96 Cord sets and interconnection cord sets | |
| Amendment 1 Filament Lamps for Road Vehicles - Dimensional, Electrical and Luminous Requirements | |
| AMENDMENT 1 Lamps for road vehicles \x96 Performance requirements | |
| AMENDMENT 1 Optical fibre cables \x96 Part 1-21: Generic specification \x96 Basic optical cable test procedures \x96 Mechanical test methods | |
| AMENDMENT 1 Optical fibre cables \x96 Part 2-11: Indoor cables \x96 Detailed specification for simplex and duplex cables for use in premises cabling | |
| AMENDMENT 1 Optical fibre cables \x96 Part 2-21: Indoor cables \x96 Detailed specification for multi-fibre optical distribution cables for use in premises cabling | |
| AMENDMENT 1 Optical fibre cables \x96 Part 2-31: Indoor cables \x96 Detailed specification for optical fibre ribbon cables for use in premises cabling | |
| Amendment 1 Optical Fibres - Part 1: Generic Specification - Section 4: Measuring Methods for Transmission and Optical Characteristics | |
| AMENDMENT 1 Optical fibres \x96 Part 2-10: Product specifications \x96 Sectional specification for category A1 multimode fibres | |
| Amendment 1 Rectangular Connectors for Frequencies Below 3 MHz - Part 2: Detail Specification for a Range of Connectors, with Assessed Quality, with Trapezoidal Shaped Metal Shells and Round Contacts... | |
| AMENDMENT 1 Semiconductor devices \x96 Discrete devices \x96 Part 5-5: Optoelectronic devices \x96 Photocouplers | |
| AMENDMENT 1 Semiconductor devices \x96 Discrete devices \x96 Part 7: Bipolar transistors | |
| AMENDMENT 1 Semiconductor devices \x96 Discrete devices \x96 Part 8: Field-effect transistors | |
| AMENDMENT 1 Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 19: Die shear strength | |
| AMENDMENT 1 Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 23: High temperature operating life | |
| AMENDMENT 1 Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 27: Electrostatic discharge (ESD) sensitivity testing \x96 Machine model (MM) | |
| AMENDMENT 1 Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing | |
| AMENDMENT 1 Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 32: Flammability of plastic-encapsulated devices (externally induced) | |
| AMENDMENT 1 Semiconductor devices \x96 Part 5-4: Optoelectronic devices \x96 Semiconductor lasers | |
| Amendment 1 Semiconductor devices Integrated circuits Part 3: Analogue integrated circuits | |
| AMENDMENT 1 Specification for laminated pressboard \x96 Part 2: Methods of test | |
| Amendment 1 Standard Test Procedures for Semiconductor X-Ray Energy Spectrometers | |
| AMENDMENT 1 Test on gases evolved during combustion of materials from cables \x96 Part 1: Determination of the halogen acid gas content | |
| AMENDMENT 1 Test on gases evolved during combustion of materials from cables \x96 Part 2: Determination of acidity (by pH measurement) and conductivity | |
| Amendment 2 Common test methods for insulating and sheathing materials of electric and optical cables \x96 Part 3-1: Methods specific to PVC compounds \x96 Pressure test at high temperature \x96... | |
| Amendment 2 Common test methods for insulating and sheathing materials of electric and optical cables Part 1-4 : Methods for general application - Tests at low temperature | |
| AMENDMENT 2 Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 201: General tests \x96 Measurement of insulation thickness | |
| AMENDMENT 2 Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 202: General tests \x96 Measurement of thickness of non-metallic sheath | |
| AMENDMENT 2 Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 501: Mechanical tests \x96 Tests for determining the mechanical properties of insulating and sheathing compounds... | |
| AMENDMENT 2 Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 508: Mechanical tests \x96 Pressure test at high temperature for insulation and sheaths | |
| Amendment 2 Insulating and sheathing materials of electric and optical cables \x96 Common test methods \x96 Part 3-2: Methods specific to PVC compounds \x96 Loss of mass test \x96 Thermal... | |
| AMENDMENT 2 Lamps for road vehicles \x96 Dimensional, electrical and luminous requirements | |
| AMENDMENT 2 Lamps for road vehicles \x96 Performance requirements | |
| Amendment 2 Optical Fibres - Part 1: Generic Specification - Section 4: Measuring Methods for Transmission and Optical Characteristics | |
| Amendment 2 Semiconductor devices Integrated circuits Part 3: Analogue integrated circuits | |
| AMENDMENT 4 Lamps for road vehicles \x96 Dimensional, electrical and luminous requirements | |
| AMENDMENT 5 Lamps for road vehicles \x96 Dimensional, electrical and luminous requirements | |
| Application Guide for Calculation of Short-Circuit Currents in Low-Voltage Radial Systems | |
| Application Guide for the Selection of Fuse-Links of High-Voltage Fuses for Transformer Circuit Applications | |
| Audio-Frequency Calibration Tape for Transverse Track Recorders | |
| Black Tea - Vocabulary | |
| Calculation of Maximum Overall Diameter of Cables and Specification of Minimum Tensile Strength of Suspension Strand for Low-Frequency Cables with Polyolefin Insulation and Moisture Barrier Polyolefin Sheath | |
| Characteristics and Test Conditions of Radionuclide Imaging Devices; Anger Type Gamma Cameras | |
| Code for Designation of Colours First Edition | |
| Common test methods for insulatin 9 and sheathin 9 materials of electric cables Part 3: Methods specific to PVC compounds Section Two - loss of mass test - Thermal stability... | |
| COMMON TEST METHODS FOR INSULATING AND SHEATHING MATERIALS OF ELECTRIC AND OPTICAL CABLES - PART 2-1: METHODS SPECIFIC TO ELASTOMERIC COMPOUNDS - OZONE RESISTANCE, HOT SET AND MINERAL OIL IMMERSION... | |
| Common Test Methods for Insulating and Sheathing Materials of Electric and Optical Cables - Part 3-1: Methods Specific to PVC Compounds - Pressure Test At High Temperature - Tests for... | |
| Common test methods for Insulating and sheathing materials of electric and optical cables Part 4-1: Methods specific to polyethylene and polypropylene compounds \x96 Resistance to environmental stress cracking \x96 Measurement... | |
| COMMON TEST METHODS FOR INSULATING AND SHEATHING MATERIALS OF ELECTRIC CABLES - PART 1: GENERAL APPLICATION - SECTION 3: METHODSFOR DETERMINING THE DENSITY - WATER ABSORPTION TESTS - SHRINKAGE TEST... | |
| COMMON TEST METHODS FOR INSULATING AND SHEATHING MATERIALS OF ELECTRIC CABLES AND OPTICAL CABLES - PART 1-1: METHODS FOR GENERALAPPLICATION - SECTION 1: MEASUREMENT OF THICKNESS AND OVERALL DIMENSIONS -... | |
| Common test methods for insulating and sheathing materials of electric cables Part 1 : Methods for general application Section Four - Tests at low temperature | |
| Common Test Methods for Insulating and Sheathing Materials of Electric Cables Part 1-2: Methods for General Application - Thermal Ageing Methods | |
| Common Test Methods for Insulating and Sheathing Materials of Electric Cables Part 1: Methods for General Application Section Four - Tests at Low Temperature | |
| Common Test Methods for Insulating and Sheathing Materials of Electric Cables Part 1: Methods for General Application Section Two - Thermal Ageing Methods | |
| Common test methods for insulating and sheathing materials of electric cables Part 3: Methods specific to PVC compounds Section One - Pressure test at high temperature - Tests for resistance... | |
| Common Test Methods for Insulating and Sheathing Materials of Electric Cables Part 3: Methods Specific to PVC Compounds Section Two - Loss of Mass Test - Thermal Stability Test | |
| Common Test Methods for Insulating and Sheathing Materials of Electric Cables Part 4: Methods Specific to Polyethylene and Polypropylene Compounds Section Two - Elongation at Break After Pre-Conditioning - Wrapping... | |
| Common Test Methods for Insulating and Sheathing Materials of Electric Cables Part 5: Methods Specific to Filling Compounds Section One - Drop-Point - Separation of Oil - Lower Temperature Brittleness... | |
| Common Test Methods for Insulating and Sheathing Materials of Electric Cables | |
| Complementary Instrumentation for Counting Ratemeters Characteristics and Test Methods | |
| Copper Alloy Used for Equipment Wires | |
| CORRIGENDUM 1 Heating cables with a rated voltage of 300/500 V for comfort heating and prevention of ice formation | |
| CORRIGENDUM 1 Industrial electroheat equipment \x96 Test methods for electroslag remelting furnaces | |
| Determination of the Maximum Symmetrical Radiation Field from a Rotating Anode X-Ray Tube for Medical Diagnosis | |
| Discrete Semiconductor Devices and Integrated Circuits - Part 5-2: Optoelectronic Devices - Essential Ratings and Characteristics | |
| Discrete Semiconductor Devices and Integrated Circuits - Part 5-3: Optoelectronic Devices - Measuring Methods | |
| Discrete semiconductor devices Part 8-4: Metal-oxide-semicond uctor field-effect transistors (MOSFETs) for power switching applications | |
| Electric and optical fibre cables - Test methods for non-metallic materials \x96 Part 410: Miscellaneous tests \x96 Test method for copper-catalyzed oxidative degradation of polyolefin insulated conductors | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 100: General | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 201: General tests \x96 Measurement of insulation thickness | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 202: General tests \x96 Measurement of thickness of non-metallic sheath | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 203: General tests \x96 Measurement of overall dimensions | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 301: Electrical tests \x96 Measurement of the permittivity at 23 \xb0C of filling compounds | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 302: Electrical tests \x96 Measurement of the d.c. resistivity at 23 \xb0C and 100 \xb0C of filling... | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 401: Miscellaneous tests \x96 Thermal ageing methods \x96 Ageing in an air oven | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 402: Miscellaneous tests \x96 Water absorption tests | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 403: Miscellaneous tests \x96 Ozone resistance test on cross-linked compounds | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 404: Miscellaneous tests \x96 Mineral oil immersion tests for sheaths | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 405: Miscellaneous tests \x96 Thermal stability test for PVC insulations and PVC sheaths | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 406: Miscellaneous tests \x96 Resistance to stress cracking of polyethylene and polypropylene compounds | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 407: Miscellaneous tests \x96 Measurement of mass increase of polyethylene and polypropylene compounds | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 408: Miscellaneous tests \x96 Long-term stability test of polyethylene and polypropylene compounds | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 409: Miscellaneous tests \x96 Loss of mass test for thermoplastic insulations and sheaths | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 411: Miscellaneous tests \x96 Low-temperature brittleness of filling compounds | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 412: Miscellaneous tests \x96 Thermal ageing methods \x96 Ageing in an air bomb | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 501: Mechanical tests \x96 Tests for determining the mechanical properties of insulating and sheathing compounds | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 502: Mechanical tests \x96 Shrinkage test for insulations | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 503: Mechanical tests \x96 Shrinkage test for sheaths | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 504: Mechanical tests \x96 Bending tests at low temperature for insulation and sheaths | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 505: Mechanical tests \x96 Elongation at low temperature for insulations and sheaths | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 506: Mechanical tests \x96 Impact test at low temperature for insulations and sheaths | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 507: Mechanical tests \x96 Hot set test for cross-linked materials | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 508: Mechanical tests \x96 Pressure test at high temperature for insulation and sheaths | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 509: Mechanical tests \x96 Test for resistance of insulations and sheaths to cracking (heat shock test) | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 510: Mechanical tests \x96 Methods specific to polyethylene and polypropylene compounds \x96 Wrapping test after thermal ageing... | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 511: Mechanical tests \x96 Measurement of the melt flow index of polyethylene compounds | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 512: Mechanical tests \x96 Methods specific to polyethylene and polypropylene compounds \x96 Tensile strength and elongation at... | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 513: Mechanical tests \x96 Methods specific to polyethylene and polypropylene compounds \x96 Wrapping test after conditioning | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 601: Physical tests \x96 Measurement of the drop point of filling compounds | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 602: Physical tests \x96 Separation of oil in filling compounds | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 603: Physical tests \x96 Measurement of total acid number of filling compounds | |
| Electric and optical fibre cables \x96 Test methods for non-metallic materials \x96 Part 604: Physical tests \x96 Measurement of absence of corrosive components in filling compounds | |
| ELECTRICAL ACCESSORIES - CORD SETS AND INTERCONNECTION CORD SETS | |
| Electrical accessories \x96 Cord sets and interconnection cord sets | |
| Electrical Penetration Assemblies in Containment Structures for Nuclear Power Generating Stations | |
| Electromagnetic Compatibility for Industrial-Process Measurement and Control Equipment Part 1: General Introduction | |
| Electromagnetic Compatibility for Industrial-Process Measurement and Control Equipment Part 2: Electrostatic Discharge Requirements | |
| Electromagnetic Compatibility for Industrial-Process Measurement and Control Equipment Part 3: Radiated Electromagnetic Field Requirements | |
| Electromagnetic Compatibility for Industrial-Process Measurement and Control Equipment Part 4: Electrical Fast Transient/Burst Requirements | |
| Equipment for Continuously Monitoring Radioactivity in Gaseous Effluents Part 1: General Requirements | |
| Equipment for Continuously Monitoring Radioactivity in Gaseous Effluents Part 2: Specific Requirements for Aerosol Effluent Monitors | |
| Equipment for Continuously Monitoring Radioactivity in Gaseous Effluents Part 3: Specific Requirements for Noble Gas Effluent Monitors | |
| Equipment for Continuously Monitoring Radioactivity in Gaseous Effluents Part 4: Specific Requirements for Iodine Monitors | |
| Equipment for Continuously Monitoring Radioactivity in Gaseous Effluents Part 5: Specific Requirements for Tritium Effluent Monitors | |
| Equipment for Continuously Monitoring Radioactivity in Gaseous Effluents Part 6: Specific Requirements for Transuranic Aerosol Effluent Monitors | |
| Expression of the Properties of Logic Analyzers First Edition | |
| Flat, Quick-Connect Terminations Second Edition; (Amendment 1-1993) | |
| General safety requirements for residual current operated protected devices \x96 Part 1: Residual current operated protective devices for DC systems | |
| General safety requirements for residual current operated protective devices | |
| Guide for Commissioning, Operation and Maintenance of Storage Pumps and of Pump- Turbines Operating as Pumps | |
| HEATING CABLES WITH A RATED VOLTAGE UP TO AND INCLUDING 300/500 V FOR COMFORT HEATING AND PREVENTION OF ICE FORMATION | |
| Helical-Scan Video Tape Cassette System Using 12,65 mm (0,5 in) Magnetic Tape on Type VHS - Part 4: S-VHS Video Cassette System - ET Mode | |
| Helical-Scan Video Tape Cassette System Using 12,65 mm (0,5 in) Magnetic Tape on Type VHS Part 1: VHS and Compact VHS Video Cassette System | |
| Helical-Scan Video Tape Cassette System Using 12,65 mm (0,5 in) Magnetic Tape on Type VHS Part 3: S-VHS | |
| Helical-scan video tape cassette system using 12,65 mm (0,5 in) magnetic tape on type VHS Part 5: D-VHS | |
| Helical-Scan Video Tape Cassette System Using 12.65 mm (0.5 in) Magnetic Tape on Type Beta Format First Edition | |
| Helical-Scan Video-Recording Cartridge and Reel-to-Reel System (EIAJ-Type 1) Using 12.70 mm (0.5 in) Magnetic Tape | |
| Helican-Scan Video Tape Cassette System Using 12,65 mm (0,5 in) Magnetic Tape on Type VHS - Part 2: FM Audio Recording | |
| INDUSTRIAL PLATINUM RESISTANCE THERMOMETERS AND PLATINUM TEMPERATURE SENSORS | |
| Instantizing Systems | |
| Integrating-Averagin g Sound Level Meters | |
| Ionizing Radiation Measurement Systems with Analogue or Digital Signal Processing for Thickness Measurements First Edition | |
| Item Designation in Electrotechnology | |
| LAMPS AND LIGHT SOURCES FOR ROAD VEHICLES - DIMENSIONAL, ELECTRICAL AND LUMINOUS REQUIREMENTS | |
| LAMPS FOR ROAD VEHICLES - DIMENSIONAL, ELECTRICAL AND LUMINOUS REQUIREMENTS | |
| Lamps for road vehicles \x96 Dimensional, electrical and luminous requirements Amendment 3 | |
| LAMPS, LIGHT SOURCES AND LED PACKAGES FOR ROAD VEHICLES - PERFORMANCE REQUIREMENTS | |
| Lamps, light sources and led packages for road vehicles \x96 Performance requirements | |
| Medical electrical equipment \x96 Characteristics and test conditions of radionuclide imaging devices \x96 Anger type gamma cameras | |
| Medical Radiology - Terminology | |
| Methods of Evaluating the Performance of Transmitters for Use in Industrial-Process Control Systems | |
| Microprocessor system bus - 8-Bit and 16-Bit data (MULTIBUS I) Part 1: Functional description with electrical and timing specifications | |
| Microprocessor system bus - 8-bit and 16-bit data (MULTIBUS I) Part 2: Mechanical and pin descriptions for the system bus configuration, with edge connectors (direct) | |
| Microprocessor System BUS I, 8-Bit and 16-Bit Data Part 3: Mechanical and Pin Descriptions for the Eurocard Configuration with pin and socket (indirect) connectors | |
| Multi-Factor Functional Testing of Electrical Insulation Systems Part 1: Test Procedures | |
| Multi-Factor Functional Testing of Electrical Insulation Systems Part 2: Bibliography | |
| Non-Broadcast Video Tape Recorders - Time Base Stability | |
| Nuclear facilities \x96 Electrical equipment important to safety \x96 Qualification | |
| Optical fibre cables - Part 1-107: Generic specification - Basic optical cable test procedures - Mechanical test methods - Torsion, method E7 | |
| Optical fibre cables - Part 1-110: Generic specification - Basic optical cable test procedures - Mechanical tests methods - Kink, Method E10 | |
| Optical fibre cables - Part 1-119: Generic specification - Basic optical cable test procedures - Mechanical tests methods - Aeolian vibration, Method E19 | |
| Optical fibre cables - Part 1-130: Generic specification - Basic optical cable test procedures - Mechanical tests methods - Coefficient of friction between cables, Methods E30 | |
| Optical fibre cables - Part 1-133: Generic specifications - Basic optical cable test procedures - Mechanical test methods - Multiple cable coiling and uncoiling performance, Method E33 | |
| OPTICAL FIBRE CABLES - PART 1-1: GENERIC SPECIFICATION - GENERAL | |
| Optical fibre cables - Part 1-214: Generic specification - Basic optical cable test procedures - Environmental test methods - Cable UV resistance test, Method F14 | |
| Optical fibre cables - Part 1-218: Generic specification - Basic optical cable test procedures - Environmental test methods - Mid-span temperature cycling test for exposed optical units, Method F18 | |
| Optical fibre cables - Part 1-21: Generic specification - Basic optical cable test procedures - Mechanical test methods | |
| Optical Fibre Cables - Part 1-2: Generic Specification - Basic Optical Cable Test Procedures | |
| Optical fibre cables - Part 1-3: Generic specification - Optical cable elements | |
| Optical Fibre Cables - Part 1: Generic Specification | |
| Optical fibre cables - Part 2-42: Indoor optical fibre cables - Product specification for simplex and duplex cables with A4 fibres | |
| OPTICAL FIBRE CABLES - PART 2: INDOOR CABLES - SECTIONAL SPECIFICATION | |
| Optical Fibre Cables - Part 3-10: Outdoor Cables - Family Specification for Duct and Directly Buried Optical Telecommunication Cables | |
| Optical Fibre Cables - Part 3-20: Outdoor Cables - Family Specification for Optical Self-Supporting Aerial Telecommunication Cables | |
| Optical Fibre Cables - Part 3: Telecommunication Cables - Sectional Specification | |
| Optical Fibre Cables - Part 4-1: Aerial Optical Cables for High-Voltage Power Lines | |
| Optical fibre cables - Part 4-20: Sectional specification - Aerial optical cables along electrical power lines - Family specification for ADSS (all dielectric self-supported) optical cables | |
| Optical fibre cables \x96 Part 1-101: Generic specification \x96 Basic optical cable test procedures \x96 Mechanical tests methods \x96 Tensile, method E1 | |
| Optical fibre cables \x96 Part 1-104: Generic specification \x96 Basic optical cable test procedures \x96 Mechanical tests method \x96 Impact, method E4 | |
| Optical fibre cables \x96 Part 1-111: Generic specification \x96 Basic optical cable test procedures \x96 Mechanical tests methods \x96 Bend, method E11 | |
| Optical fibre cables \x96 Part 1-124: Generic specification \x96 Basic optical cable test procedures \x96 Mechanical tests methods \x96 Installation test for microduct cabling, Method E24 | |
| Optical fibre cables \x96 Part 1-1: Generic specification \x96 General (Commented Version) | |
| Optical fibre cables \x96 Part 1-1: Generic specification \x96 General | |
| Optical fibre cables \x96 Part 1-201: Generic specification \x96 Basic optical cable test procedures \x96 Environmental test methods \x96 Temperature cycling, method F1 | |
| Optical fibre cables \x96 Part 1-208: Generic specification \x96 Basic optical cable test procedures \x96 Environmental test methods \x96 Pneumatic resistance, Method F8 | |
| Optical fibre cables \x96 Part 1-209: Generic specification \x96 Basic optical cable test procedures \x96 Environmental test methods \x96 Ageing, method F9 | |
| Optical fibre cables \x96 Part 1-20: Generic specification \x96 Basic optical cable test procedures \x96 General and definitions | |
| Optical fibre cables \x96 Part 1-211: Generic specification \x96 Basic optical cable test procedures \x96 Environmental test methods \x96 Sheath shrinkage, method F11 | |
| Optical fibre cables \x96 Part 1-212: Generic specification \x96 Basic optical cable test procedures \x96 Environmental test methods \x96 Temperature cycling with cable elements fixed at both ends, Method F12... | |
| Optical fibre cables \x96 Part 1-213: Generic specification \x96 Basic optical cable test procedures \x96 Environmental test methods \x96 Microduct pressure withstand, method F13 | |
| Optical fibre cables \x96 Part 1-215: Generic specification \x96 Basic optical cable test procedures \x96 Environmental test methods \x96 Cable external freezing test, Method F15 | |
| Optical fibre cables \x96 Part 1-216: Generic specification \x96 Basic optical cable test procedures \x96 Environmental test methods \x96 Compound flow (drip), Method F16 | |
| Optical fibre cables \x96 Part 1-217: Generic specification \x96 Basic optical cable test procedures \x96 Environmental test methods \x96 Cable shrinkage (fibre protrusion), Method F17 | |
| Optical fibre cables \x96 Part 1-219: Generic specification \x96 Basic optical cable test procedures \x96 Material compatibility test, method F19 | |
| Optical fibre cables \x96 Part 1-220: Generic specification \x96 Basic optical cable test procedures \x96 Environmental test methods \x96 Salt spray corrosion test, method F20 | |
| Optical fibre cables \x96 Part 1-22: Generic specification \x96 Basic optical cable test procedures \x96 Environmental test methods | |
| Optical fibre cables \x96 Part 1-23: Generic specification \x96 Basic optical cable test procedures \x96 Cable element test methods | |
| Optical fibre cables \x96 Part 1-24: Generic specification \x96 Basic optical cable test procedures \x96 Electrical test methods | |
| Optical fibre cables \x96 Part 1-2: Generic specification \x96 Basic optical cable test procedures \x96 General guidance | |
| Optical fibre cables \x96 Part 1-301: Generic specification \x96 Basic optical cable test procedures \x96 Cable elements test methods \x96 Bend test, method G1 | |
| Optical fibre cables \x96 Part 1-303: Generic specification \x96 Basic optical cable test procedures \x96 Ribbon dimensions \x96 Aperture gauge, method G3 | |
| Optical fibre cables \x96 Part 1-305: Generic specification \x96 Basic optical cable test procedures \x96 Cable element test methods \x96 Ribbon tear (separability), Method G5 | |
| Optical fibre cables \x96 Part 1-306: Generic specification \x96 Basic optical cable test procedures \x96 Cable element test methods \x96 Ribbon torsion, Method G6 | |
| Optical fibre cables \x96 Part 1-307: Generic specification \x96 Basic optical cable test procedures \x96 Cable element test methods \x96 Tube kinking, method G7 | |
| Optical fibre cables \x96 Part 1-308: Generic specification \x96 Basic optical cable test procedures \x96 Cable element test methods \x96 Ribbon residual twist test, method G8 | |
| Optical fibre cables \x96 Part 1-309: Generic specification \x96 Basic optical cable test procedures \x96 Cable element test methods \x96 Bleeding and evaporation of filling or flooding compounds, Method G9... | |
| Optical fibre cables \x96 Part 1-310: Generic specification \x96 Basic optical cable test procedures \x96 Cable element test methods \x96 Strippability, method G10 | |
| Optical fibre cables \x96 Part 1-311: Generic specification \x96 Basic optical cable test procedures \x96 Cable element test methods \x96 Tensile strength and elongation test for cable elements, Method G11A... | |
| Optical fibre cables \x96 Part 1-312: Generic specification \x96 Basic optical cable test procedures \x96 Cable element test methods \x96 Elongation test for buffer tubes at low temperature, Method G11B... | |
| Optical fibre cables \x96 Part 1-31: Generic specification \x96 Optical cable elements \x96 Optical fibre ribbon | |
| Optical fibre cables \x96 Part 1-401: Generic specification \x96 Basic optical cable test procedures \x96 Electrical test methods \x96 Short-circuit test (for OPGW, OPPC and OPAC), Method H1 | |
| Optical fibre cables \x96 Part 1-402: Generic specification \x96 Basic optical cable test procedures \x96 Electrical test methods \x96 Lightning test (for OPGW, OPPC and OPAC), Method H2 | |
| Optical fibre cables \x96 Part 1-403: Generic specification \x96 Basic optical cable test procedures \x96 Electrical test methods \x96 Electrical continuity test of cable metallic elements, method H3 | |
| Optical fibre cables \x96 Part 1-404: Generic specification \x96 Basic optical cable test procedures \x96 Electrical test methods \x96 Current-temperature test, method H4 | |
| Optical fibre cables \x96 Part 2-10: Indoor optical fibre cables \x96 Family specification for simplex and duplex cables | |
| Optical fibre cables \x96 Part 2-11: Indoor cables \x96 Detailed specification for simplex and duplex cables for use in premises cabling | |
| Optical fibre cables \x96 Part 2-20: Indoor cables \x96 Family specification for multi-fibre optical cables | |
| Optical fibre cables \x96 Part 2-21: Indoor cables \x96 Detailed specification for multi-fibre optical distribution cables for use in premises cabling | |
| Optical fibre cables \x96 Part 2-22: Indoor cables \x96 Detail specification for multi-simplex breakout optical cables for use in terminated breakout cable assemblies | |
| Optical fibre cables \x96 Part 2-22: Indoor cables \x96 Detail specification for multi-simplex breakout optical cables to be terminated with connectors | |
| Optical fibre cables \x96 Part 2-23: Indoor cables \x96 Detail specification for multi-fibre cables for use in MPO connector terminated cable assemblies | |
| Optical fibre cables \x96 Part 2-24: Indoor cables \x96 Detail specification for multiple multi-fibre unit cables for use in MPO connector terminated breakout cable assemblies | |
| Optical fibre cables \x96 Part 2-30: Indoor cables \x96 Family specification for optical fibre ribbon cables for use in terminated cable assemblies | |
| Optical fibre cables \x96 Part 2-31: Indoor cables \x96 Detailed specification for optical fibre ribbon cables for use in premises cabling | |
| Optical fibre cables \x96 Part 2-40: Indoor cables \x96 Family specification for simplex and duplex cables with buffered A4 fibres CORRIGENDUM 1 | |
| Optical fibre cables \x96 Part 2-41: Indoor cables \x96 Product specification for simplex and duplex buffered A4 fibres | |
| Optical fibre cables \x96 Part 2-50: Indoor cables \x96 Family specification for simplex and duplex cables for use in terminated cable assemblies | |
| Optical fibre cables \x96 Part 2-51: Indoor cables \x96 Detail specification for simplex and duplex cables for use in cords for controlled environment | |
| Optical fibre cables \x96 Part 3-11: Outdoor cables \x96 Detailed specification for duct and directly buried single-mode optical fibre telecommunication cables | |
| Optical fibre cables \x96 Part 3-12: Outdoor cables \x96 Detailed specification for duct and directly buried optical telecommunication cables for use in premises cabling | |
| Optical fibre cables \x96 Part 3-21: Outdoor cables - Detailed specification for optical self-supporting aerial telecommunication cables for use in premises cabling | |
| Optical fibre cables \x96 Part 3-40: Outdoor cables \x96 Family specification for sewer cables and conduits for installation by blowing and/or pulling in non-man accessible storm and sanitary sewers | |
| Optical fibre cables \x96 Part 3-50: Outdoor cables \x96 Family specification for gas pipe cables and subducts for installation by blowing and/or pulling/dragging in gas pipes | |
| Optical fibre cables \x96 Part 3-60: Outdoor cables \x96 Family specification for drinking water pipe cables and subducts for installation by blowing and/or pulling/dragging/flo ating in drinking water pipes | |
| Optical fibre cables \x96 Part 3-70: Outdoor cables \x96 Family specification for outdoor optical fibre cables for rapid/multiple deployment | |
| Optical fibre cables \x96 Part 3: Outdoor cables \x96 Sectional specification | |
| Optical fibre cables \x96 Part 4-10: Aerial optical cables along electrical power lines \x96 Family specification for OPGW (Optical Ground Wires) | |
| Optical fibre cables \x96 Part 4-20: Aerial optical cables along electrical power lines \x96 Family specification for ADSS (All Dielectric Self Supported) optical cables | |
| Optical fibre cables \x96 Part 4-30: Aerial optical cables along electrical power lines \x96 Family specification for optical phase conductor (OPPC) optical cables | |
| Optical fibre cables \x96 Part 4: Sectional specification \x96 Aerial optical cables along electrical power lines | |
| Optical fibre cables \x96 Part 5-20: Family specification \x96 Outdoor microduct fibre units, microducts and protected microducts for installation by blowing | |
| Optical fibre cables \x96 Part 5: Sectional specification \x96 Microduct cabling for installation by blowing | |
| Optical fibre cables \x96 Part 5\x9610: Family specification \x96 Outdoor microduct optical fibre cables, microducts and protected microducts for installation by blowing | |
| Optical fibre cables \x96 Part 6-10: Indoor-outdoor cables \x96 Family specification for universal indoor-outdoor cables | |
| Optical fibre cables \x96 Part 6-20: Indoor-outdoor cables \x96 Family specification for flame retardant outdoor cables | |
| Optical fibre cables \x96 Part 6-30: Indoor-outdoor cables \x96 Family specification for weatherised indoor cables | |
| Optical fibre cables \x96 Part 6: Indoor-outdoor cables \x96 Sectional specification for indoor-outdoor cables | |
| Optical fibre cables Part 2-10: Indoor cables Family specification for simplex and duplex cables | |
| Optical fibre cables Part 2-11: Indoor cables Detailed specification for simplex and duplex cables for use in premises cabling | |
| Optical fibre cables Part 2-20: Indoor cables Family specification for multi-fibre optical distribution cables | |
| Optical fibre cables Part 2-30: Indoor cables Family specification for optical fibre ribbon cables | |
| Optical fibre cables Part 2-31: Indoor cables Detailed specification for optical fibre ribbon cables for use in premises cabling | |
| Optical fibre cables Part 3-12: Outdoor cables - Detailed specification for duct and directly buried optical telecommunication cables for use in premises cabling | |
| Optical fibre cables Part 3-30: Outdoor cables Family specification for optical telecommunication cables for lake and river crossings | |
| Optical fibre cables Part 4: Sectional specification Aerial optical cables along electrical power lines | |
| Optical Fibres - Part 1-1: Generic Specification - General | |
| Optical fibres - Part 1-1: Measurement methods and test procedures - General and guidance | |
| Optical Fibres - Part 1-20: Measurement Methods and Test Procedures - Fibre Geometry | |
| Optical Fibres - Part 1-21: Measurement Methods and Test Procedures - Coating Geometry | |
| Optical Fibres - Part 1-22: Measurement Methods and Test Procedures - Length Measurement | |
| Optical Fibres - Part 1-2: Generic Specification Measuring Methods for Dimensions | |
| Optical Fibres - Part 1-30: Measurement Methods and Test Procedures - Fibre Proof Test | |
| Optical Fibres - Part 1-31: Measurement Methods and Test Procedures - Tensile Strength | |
| Optical Fibres - Part 1-32: Measurement Methods and Test Procedures - Coating Strippability | |
| Optical Fibres - Part 1-33: Measurement Methods and Test Procedures - Stress Corrosion Susceptibility | |
| Optical Fibres - Part 1-34: Measurement Methods and Test Procedures - Fibre Curl | |
| Optical Fibres - Part 1-3: Generic Specification - Measuring Methods for Mechanical Characteristics | |
| Optical Fibres - Part 1-40: Measurement and Test Procedures - Attenuation | |
| Optical Fibres - Part 1-41: Measurement Methods and Test Procedures - Bandwidth | |
| Optical Fibres - Part 1-42: Measurement Methods and Test Procedures - Chromatic Dispersion | |
| Optical Fibres - Part 1-43: Measurement Methods and Test Procedures - Numerical Aperture | |
| Optical Fibres - Part 1-44: Measurement Methods and Test Procedures - Cut-Off Wavelength | |
| Optical Fibres - Part 1-45: Measurement Methods and Test Procedures - Mode Field Diameter | |
| Optical Fibres - Part 1-46: Mesurement Methods and Test Procedures - Monitoring of Changes in Optical Transmittance | |
| Optical Fibres - Part 1-47: Measurement Methods and Test Procedures - Macrobending Loss | |
| Optical Fibres - Part 1-50: Measurement Methods and Test Procedures - Damp Heat (Steady State) | |
| Optical Fibres - Part 1-51: Measurement Methods and Test Procedures - Dry Heat | |
| Optical Fibres - Part 1-52: Measurement Methods and Test Procedures - Change of Temperature | |
| Optical Fibres - Part 1-53: Measurement Methods and Test Procedures - Water Immersion | |
| Optical fibres - Part 1-60: Measurement methods and test procedures - Beat length | |
| Optical fibres - Part 1-61: Measurement methods and test procedures - Polarization crosstalk | |
| Optical Fibres - Part 1: Generic Specification - Section 4: Measuring Methods for Transmission and Optical Characteristics | |
| Optical Fibres - Part 1: Generic Specification - Section 5: Measuring Methods for Environmental Characteristics | |
| Optical Fibres - Part 2-10: Product Specifications - Sectional Specification for Category A1 Multimode Fibres | |
| Optical Fibres - Part 2-20: Product Specifications - Sectional Specification for Category A2 Multmode Fibres | |
| Optical Fibres - Part 2-30: Product Specifications - Sectional Specification for Category A3 Multmode Fibres | |
| Optical Fibres - Part 2-40: Product Specifications - Sectional Specification for Category A4 Multmode Fibres | |
| Optical fibres - Part 2-60: Product specifications - Sectional specification for class C single-mode interconnection fibres | |
| Optical fibres - Part 2-70: Product specifications - Sectional specification for polarizationmaintain ing fibres | |
| OPTICAL FIBRES - PART 2: PRODUCT SPECIFICATIONS - GENERAL | |
| Optical fibres \x96 Part 1-20: Measurement methods and test procedures \x96 Fibre geometry | |
| Optical fibres \x96 Part 1-22: Measurement methods and test procedures \x96 Length measurement (Commented Version) | |
| Optical fibres \x96 Part 1-34: Measurement methods and test procedures \x96 Fibre curl | |
| Optical fibres \x96 Part 1-40: Attenuation measurement methods | |
| Optical fibres \x96 Part 1-41: Measurement methods and test procedures \x96 Bandwidth | |
| Optical fibres \x96 Part 1-42: Measurement methods and test procedures \x96 Chromatic dispersion CORRIGENDUM 1 | |
| Optical fibres \x96 Part 1-44: Measurement methods and test procedures \x96 Cut-off wavelength (Commented Version) | |
| Optical fibres \x96 Part 1-45: Measurement methods and test procedures \x96 Mode field diameter | |
| Optical fibres \x96 Part 1-46: Measurement methods and test procedures \x96 Monitoring of changes in attenuation (Commented Version) | |
| Optical fibres \x96 Part 1-47: Measurement methods and test procedures \x96 Macrobending loss | |
| Optical fibres \x96 Part 1-49: Measurement methods and test procedures \x96 Differential mode delay | |
| Optical fibres \x96 Part 1-54: Measurement methods and test procedures \x96 Gamma irradiation | |
| Optical fibres \x96 Part 2-10: Product specifications \x96 Sectional specification for category A1 multimode fibres | |
| Optical fibres \x96 Part 2-40: Product specifications \x96 Sectional specification for category A4 multimode fibres | |
| Optical fibres \x96 Part 2-50: Product specifications \x96 Sectional specification for class B single-mode fibres (Commented Version) | |
| Optical fibres \x96 Part 2-50: Product specifications \x96 Sectional specification for class B single-mode fibres | |
| Optical fibres \x96 Part 2-50: Product specifications \x96 Sectional specification for class B singlemode fibres | |
| Optical fibres \x96 Part 2-60: Product specifications \x96 Sectional specification for category C singlemode intraconnection fibres | |
| Optical fibres \x96 Part 2: Product specifications \x96 General | |
| Optical fibres cables \x96 Part 2-40: Indoor cables \x96 Family specification for simplex and duplex cables with buffered A4 fibres | |
| Optical fibres Part 1-48: Measurement methods and test procedures - Polarization mode dispersion | |
| Optical fibres Part 1-54: Measurement methods and test procedures Gamma irradiation | |
| Optical Fibres Part 1: Generic Specification | |
| Oscilloscopes and Peak Voltmeters for Impulse Tests | |
| Performance Evaluation of Insulation Systems Based on Service Experience and Functional Tests | |
| Photography - Photographic Films and Papers - Wedge Test for Brittleness | |
| Process Stream Radiation Monitoring Equipment in Light Water Nuclear Reactors for Normal Operating and Incident Conditions | |
| QUALIFICATION OF ELECTRICAL ITEMS OF THE SAFETY SYSTEM FOR NUCLEARPOWER GENERATING STATIONS | |
| Real-Time BASIC for CAMAC | |
| RECOMMENDED DIMENSIONS FOR HEXAGONAL AND SQUARE CRIMPING-DIE CAVITIES, INDENTORS, GAUGES, OUTER CONDUCTOR CRIMP SLEEVES AND CENTRE CONTACT CRIPM BARRELS FOR R.F. CABLES AND CONNECTORS | |
| Rectangular Connectors for Frequencies Below 3 MHz - Part 2: Detail Specification for a Range of Connectors, with Assessed Quality, with Trapezoidal Shaped Metal Shells and Round Contacts - Fixed... | |
| Rectangular connectors for frequencies below 3 MHz - Part 7: Detail specification for a range of connectors with polarized guides or jackscrews and size 16 (13 A) round contacts -... | |
| Rectangular connectors for frequencies below 3 MHz - Part 8: Detail specification for connectors, four-signal contacts and earthing contacts for cable screen | |
| Rectangular connectors for frequencies below 3 MHz - Part 9: Detail specification for a range of peritelevision connectors | |
| Rectangular Connectors for Frequencies Below 3 MHz Part 1: Generic Specification - General Requirements and Guide for the Preparation of Detail Specifications for Connectors with Assessed Quality | |
| Rectangular connectors for frequencies below 3 MHz. Part 3: Detail specification for a range of connectors with trapezoidal shaped metal shells and round contacts - Removable crimp contact types with... | |
| Rectangular connectors for frequencies below 3 MHz. Part 6: Detail specification for a range of rectangular connectors with size 20 (7.5 A) round contacts having polarized guides - Fixed solder... | |
| Semiconductor Devices - Discrete Devices - Part 8: Field-Effect Transistors - Section 3: Blank Detail Specification for Case-Rated Field-Effect Transistors for Switching Applications | |
| SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 8: FIELD-EFFECT TRANSISTORS | |
| Semiconductor Devices - Discrete Devices Part 7: Bipolar Transistors Section One - Blank Detail Specification for Ambient-Rated Bipolar Transistors for Low and High-Frequency Amplification | |
| Semiconductor Devices - Discrete Devices Part 7: Bipolar Transistors Section Two - Blank Detail Specification for Case-Rated Bipolar Transistors for Low-Frequency Amplification | |
| Semiconductor Devices - Discrete Devices Part 8: Field-Effect Transistors Section One - Blank Detail Specification for Single-Gate Field-Effect Transistors, up to 5 W and 1 GHz | |
| SEMICONDUCTOR DEVICES - INTEGRATED CIRCUITS - PART 11: SECTIONAL SPECIFICATIONS FOR SEMICONDUCTOR INTEGRATED CIRCUITS EXCLUDING HYBRID CIRCUITS | |
| Semiconductor Devices - Integrated Circuits - Part 1: General | |
| Semiconductor Devices - Integrated Circuits - Part 2-11: Digital Integrated Circuits - Blank Detail Specification for Single Supply Integrated Circuit, Electrically Erasable, and Programmable Read-Only Memory | |
| Semiconductor Devices - Integrated Circuits - Part 2-12: Digital Integrated Circuits - Blank Detail Specification for Programmable Logic Devices (PLDs) | |
| Semiconductor Devices - Integrated Circuits - Part 2-20: Digital Integrated Circuits - Family Specification - Low Voltage Integrated Circuits | |
| Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits - Section 1: Requirements for Internal Visual Examination | |
| Semiconductor Devices - Integrated Circuits - Part 20: Generic Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits | |
| Semiconductor Devices - Integrated Circuits - Part 23-1: Hybrid Integrated Circuits and Film Structures - Manufacturing Line Certification - Generic Specification | |
| Semiconductor Devices - Integrated Circuits - Part 23-2: Hybrid Integrated Circuits and Film Structures - Manufacturing Line Certification - Internal Visual Inspection and Special Tests | |
| Semiconductor Devices - Integrated Circuits - Part 23-3: Hybrid Integrated Circuits and Film Structures - Manufacturing Line Certification - Manufacturers\xb4 Self-Audit Checklist and Report | |
| Semiconductor Devices - Integrated Circuits - Part 23-4: Hybrid Integrated Circuits and Film Structures - Manufacturing Line Certification - Blank Detail Specification | |
| Semiconductor Devices - Integrated Circuits - Part 2: Digital Integrated Circuits - Section 10: Blank Detail Specification for Integrated Circuit Dynamic Read/Write Memories | |
| Semiconductor Devices - Integrated Circuits - Part 2: Digital Integrated Circuits - Section 9: Blank Detail Specification for MOS Ultraviolet Light Erasable Electrically Programmable Read-Only Memories | |
| Semiconductor Devices - Integrated Circuits - Part 2: Digital Integrated Circuits | |
| Semiconductor Devices - Integrated Circuits - Part 4: Interface Integrated Circuits - Section 2: Blank Detail Specification for Linear Analogue-to-Digital Converters (ADC) | |
| Semiconductor Devices - Integrated Circuits - Part 4: Interface Integrated Circuits | |
| Semiconductor Devices - Integrated Circuits - Part 5: Semicustom Integrated Circuits | |
| Semiconductor Devices - Integrated Circuits Part 21: Section One: Blank Detail Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of Qualification Approval Procedure (IECQ QC... | |
| Semiconductor devices - Integrated circuits Part 3: Analogue integrated circuits | |
| Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock CORRIGENDUM 1 | |
| Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock | |
| Semiconductor Devices - Mechanical and Climatic Test Methods - Part 11: Rapid Change of Temperature - Two-Fluid-Bath Method CORRIGENDUM 1 | |
| Semiconductor Devices - Mechanical and Climatic Test Methods - Part 11: Rapid Change of Temperature - Two-Fluid-Bath Method CORRIGENDUM 2 | |
| Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method | |
| Semiconductor Devices - Mechanical and Climatic Test Methods - Part 12: Vibration, Variable Frequency | |
| Semiconductor Devices - Mechanical and Climatic Test Methods - Part 13: Salt Atmosphere CORRIGENDUM 1 | |
| Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere | |
| Semiconductor Devices - Mechanical and Climatic Test Methods - Part 16: Particle Impact Noise Detection (PIND) | |
| Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) | |
| Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST | |
| Semiconductor Devices - Mechanical and Climatic Test Methods - Part 2: Low Air Pressure CORRIGENDUM 1 | |
| Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure | |
| Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave | |
| Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module | |
| Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling | |
| Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination | |
| Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans | |
| Semiconductor Devices - Mechanical and Climatic Test Methods - Part 4: Damp Heat, Steady State, Highly Accelerated Stress Test (HAST) CORRIGENDUM 1 | |
| Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) | |
| Semiconductor Devices - Mechanical and Climatic Test Methods - Part 5: Steady-State Temperature Humidity Bias Life Test | |
| Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature | |
| Semiconductor Devices - Mechanical and Climatic Test Methods - Part 7: Internal Moisture Content Measurement and the Analysis of Other Residual Gases CORRIGENDUM 1 | |
| Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases | |
| Semiconductor Devices - Mechanical and Climatic Test Methods - Part 9: Permanence of Marking CORRIGENDUM 1 | |
| Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking | |
| Semiconductor Devices - Mechanical and Climatic Test Methods | |
| Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes | |
| Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors | |
| Semiconductor Devices - Part 6: Thyristors | |
| Semiconductor Devices - Part 7: Bipolar Transistors | |
| Semiconductor devices \x96 Discrete devices \x96 Part 5-4: Optoelectronic devices \x96 Semiconductor lasers | |
| Semiconductor devices \x96 Discrete devices \x96 Part 5-5: Optoelectronic devices \x96 Photocouplers | |
| Semiconductor devices \x96 Integrated circuits \x96 Part 4-3: Interface integrated circuits \x96 Dynamic criteria for analogue-digital converters (ADC) | |
| SEMICONDUCTOR DEVICES \x96 MECHANICAL AND CLIMATIC TEST METHODS \x96 Part 12: Vibration, variable frequency CORRIGENDUM 1 | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 15: Resistance to soldering temperature for through-hole mounted devices | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 18: Ionizing radiation (total dose) | |
| SEMICONDUCTOR DEVICES \x96 MECHANICAL AND CLIMATIC TEST METHODS \x96 Part 1: General CORRIGENDUM 1 | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 1: General | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat | |
| SEMICONDUCTOR DEVICES \x96 MECHANICAL AND CLIMATIC TEST METHODS \x96 Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat CORRIGENDUM 1 | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat | |
| SEMICONDUCTOR DEVICES \x96 MECHANICAL AND CLIMATIC TEST METHODS \x96 Part 22: Bond strength CORRIGENDUM 1 | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 22: Bond strength | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 26: Electrostatic discharge (ESD) sensitivity testing \x96 Human body model (HBM) | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 27: Electrostatic discharge (ESD) sensitivity testing \x96 Machine model (MM) | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 28: Electrostatic discharge (ESD) sensitivity testing \x96 Charged device model (CDM) \x96 device level | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing | |
| SEMICONDUCTOR DEVICES \x96 MECHANICAL AND CLIMATIC TEST METHODS \x96 Part 31: Flammability of plastic-encapsulated devices (internally induced) CORRIGENDUM 1 | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 31: Flammability of plastic-encapsulated devices (internally induced) | |
| SEMICONDUCTOR DEVICES \x96 MECHANICAL AND CLIMATIC TEST METHODS \x96 Part 32: Flammability of plastic-encapsulated devices (externally induced) CORRIGENDUM 1 | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 32: Flammability of plastic-encapsulated devices (externally induced) | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 35: Acoustic microscopy for plastic encapsulated electronic components | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 37: Board level drop test method using an accelerometer | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 38: Soft error test method for semiconductor devices with memory | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components | |
| SEMICONDUCTOR DEVICES \x96 MECHANICAL AND CLIMATIC TEST METHODS \x96 Part 3: External visual examination CORRIGENDUM 1 | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 40: Board level drop test method using a strain gauge | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 41: Standard reliability testing methods of non-volatile memory devices | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 42: Temperature and humidity storage | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 5: Steady-state temperature humidity bias life test | |
| SEMICONDUCTOR DEVICES \x96 MECHANICAL AND CLIMATIC TEST METHODS \x96 Part 6: Storage at high temperature CORRIGENDUM 1 | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 8: Sealing CORRIGENDUM 1 | |
| SEMICONDUCTOR DEVICES \x96 MECHANICAL AND CLIMATIC TEST METHODS \x96 Part 8: Sealing CORRIGENDUM 2 | |
| Semiconductor devices \x96 Mechanical and climatic test methods \x96 Part 8: Sealing | |
| Semiconductor devices \x96 Part 5-6: Optoelectronic devices \x96 Light emitting diodes | |
| Semiconductor devices \x96 Part 5-8: Optoelectronic devices \x96 Light emitting diodes \x96 Test method of optoelectronic efficiencies of light emitting diodes | |
| Semiconductor devices \x96 Part 5-9: Optoelectronic devices \x96 Light emitting diodes \x96 Test method of the internal quantum efficiency based on the temperature-dependen t electroluminescence | |
| Semiconductor Devices Discrete Devices Part 6: Thyristors Section One - Blank Detail Specification for Reverse Blocking Triode Thyristors, Ambient and Case-Rated, up to 100 A | |
| Semiconductor Devices Discrete Devices Part 6: Thyristors Section Three - Blank Detail Specification for Reverse Blocking Triode Thyristors, Ambient and Case-Rated, for Currents Greater Than 100 A | |
| Semiconductor Devices Discrete Devices Part 6: Thyristors Section Two - Blank Detail Specification for Bidirectional Triode Thyristors (Triacs), Ambient or Case-Rated, up to 100 A | |
| Semiconductor devices Discrete devices Part 7-5: Bipolar transistors for power switching applications | |
| Semiconductor Devices Discrete Devices Part 7: Bipolar Transistors Section Four - Blank Detail Specification for Case-Rated Bipolar Transistors for High-Frequency Amplification | |
| Semiconductor Devices Discrete Devices Part 7: Bipolar Transistors Section Three - Blank Detail Specification for Bipolar Transistors for Switching Applications | |
| Semiconductor Devices Discrete Devices Part 8: Field-Effect Transistors Section Two - Blank Detail Specification for Field-Effect Transistors for Case-Rated Power Amplifier Applications | |
| Semiconductor Devices Integrated Circuits - Part 2: Digital Integrated Circuits - Section Eight - Blank Detail Specification for Integrated Circuit Static Read/Write Memories | |
| Semiconductor Devices Integrated Circuits Part 11: Section 1: Internal Visual Examination for Semiconductor Integrated Circuits Excluding Hybrid Circuits | |
| Semiconductor Devices Integrated Circuits Part 21: Sectional Specification for Film Integrated Circuits and Hybrid Film Intergrated Circuits on the Basis of Qualification Approval Procedure (IECQ QC 760100) | |
| Semiconductor Devices Integrated Circuits Part 22: Section One: Blank Detail Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures (IECQ QC... | |
| Semiconductor Devices Integrated Circuits Part 22: Sectional Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures (IECQ QC 760200) | |
| Semiconductor devices Integrated circuits Part 23-5: Hybrid integrated circuits and film structures Manufacturing line certification Procedure for qualification approval | |
| Semiconductor devices Integrated circuits Part 2: Digital integrated circuits Section five - Blank detail specification for complementary MOS digital integrated circuits (series 4 O00 B and 4 O00 UB) | |
| Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section Four - Family Specification for Complementary MOS Digital Integrated Circuits, Series 4 000 B and 4 000 UB | |
| Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section One - Blank Detail Specification for Bipolar Monolithic Digital Integrated Circuit Gates (Excluding Uncommitted Logic Arrays) | |
| Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section Seven - Blank Detail Specification for Integrated Circuit Fusible-Link Programmable Bipolar Read-Only Memories | |
| Semiconductor devices Integrated circuits Part 2: Digital integrated circuits Section six - Blank detail specification for microprocessor integrated circuits | |
| Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section Three - Blank Detail Specification for HCMOS Digital Integrated Circuits (Series 54/74 HC, 54/74 HCT, 54/74 HCU) | |
| Semiconductor Devices Integrated Circuits Part 2: Digital Integrated Circuits Section Two - Family Specification for HCMOS Digital Integrated Circuits, Series 54/74 HC, 54/74 HCT, 54/74 HCU | |
| Semiconductor Devices Integrated Circuits Part 3: Analogue Integrated Circuits Section One - Blank Detail Specification for Monolithic Integrated Operational Amplifiers | |
| Semiconductor devices Integrated circuits Part 3: Analogue integrated circuits | |
| Semiconductor devices Mechanical and climatic test methods Part 14: Robustness of terminations (lead integrity) | |
| Semiconductor devices Mechanical and climatic test methods Part 15: Resistance to soldering temperature for through-hole mounted devices | |
| Semiconductor devices Mechanical and climatic test methods Part 17: Neutron irradiation | |
| Semiconductor devices Mechanical and climatic test methods Part 19: Die shear strength | |
| Semiconductor devices Mechanical and climatic test methods Part 21: Solderability | |
| Semiconductor devices Mechanical and climatic test methods Part 23: High temperature operating life | |
| Semiconductor devices Mechanical and climatic test methods Part 25: Temperature cycling | |
| Semiconductor devices Mechanical and climatic test methods Part 29:Latch-up test | |
| Semiconductor devices Mechanical and climatic test methods Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing | |
| Semiconductor devices Mechanical and climatic test methods Part 36: Acceleration, steady state | |
| Semicondutor Devices - Integrated Circuits - Part 4: Interface Integrated Circuits - Section 1: Blank Detail Specification for Linear Digital-to-Analogue Converters (DAC) | |
| Sound Transmission Using Infra-Red Radiation | |
| Specification for Laminated Pressboard Part 1: Definitions, Classification and General Requirements | |
| Specification for Laminated Pressboard Part 2: Methods of Test | |
| Specification for Laminated Pressboard Part 3: Specifications for Individual Materials Sheet 1: Specifications for Laminated Precompressed Board Types LB 3.1.1, 3.1.2, 3.3.1 and 3.3.2 | |
| Standard Modular Avionics Repair and Test System SMART | |
| Standard Test Procedures for Semiconductor X-Ray Energy Spectrometers | |
| Surface Mounting Technology - Discrete Devices - Part 9: Insulated-Gate Bipolar Transistors (IGBTs) | |
| Synthetic Quartz Crystal - Specifications and Guide to the Use | |
| SYNTHETIC QUARTZ CRYSTAL - SPECIFICATIONS AND GUIDELINES FOR USE | |
| Terminology, Quantities and Units Concerning Radiation Protection First Edition | |
| Test Method for Evaluating Thermal Endurance of Flexible Sheet Materials Using the Wrapped Tube Method | |
| Test Methods and Apparatus for the Measurement of the Operational Characteristics of Brushes First Edition | |
| Test Methods for Electro-Slag Remelting Furnaces | |
| TEST ON GASES EVOLVED DURING COMBUSTION OF MATERIALS FROM CABLES - PART 1: DETERMINATION OF THE HALOGEN ACID GAS CONTENT | |
| TEST ON GASES EVOLVED DURING COMBUSTION OF MATERIALS FROM CABLES - PART 2: DETERMINATION OF ACIDITY (BY PH MEASUREMENT) AND CONDUCTIVITY | |
| Test on gases evolved during combustion of materials from cables - Part 3: Measurement of low level of halogen content by ion chromatography | |
| Test on gases evolved during combustion of materials from cables \x96 Part 1: Determination of the halogen acid gas content | |
| Th\xe9 soluble sous forme solide - Sp\xe9cifications | |
| Tobacco heating systems \x97 Vocabulary | |
| Transmitters for Use in Industrial-Process Control Systems - Part 1: Methods for Performance Evaluation | |
| Transmitters for use in industrial-process control systems \x96 Part 3: Methods for performance evaluation of intelligent transmitters | |
| Transmitters for Use in Industrial-Process Control Systems Part 2: Guidance for Inspection and Routine Testing First Edition | |
| Type C helical video tape recorders | |
| UL Standard for Safety Burglary Resistant Vault Doors and Modular Panels |
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