Heat Sinks Datasheets

Heat sinks are thermally conductive, usually metallic components or devices that absorb and dissipate heat generated by electronic components such as computers. Common heat sink materials include aluminum, copper, and steel.
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Heat Sinks Datasheets From:
Headquarters
DigiKey
United States
Heilind Electronics, Inc.
United States
New Yorker Electronics Co., Inc.
Northvale, NJ
Rego Electronics Inc.
Taiwan
Richardson RFPD
United States
RS Components, Ltd.
United Kingdom
Sensata Technologies
United States
TE Connectivity
United States
Tempco Electric Heater Corporation
United States
ToneCooling Technology Co., Ltd
China
TPS Elektronik GmbH
Germany
USUSTK LIMITED
China
Win Source Electronics
United States
Amphenol Communications Solutions
United States
TDK-Lambda Americas Inc.
United States
Airflow/Y.S. Tech, Inc.
Garden Grove, CA
Applied Diamond, Inc.
Wilmington, DE
ArKco Sales, Inc.
Mahtomedi, MN
Boyd
United States
Broadband TelCom Power, Inc.
Santa Ana, CA
Cooliance
Warwick, RI
CoorsTek
Golden, CO
Corsair Memory
Fremont, CA
Dynatron Corp.
Fremont, CA
Ecopower Inc.
Canada
Fairview Microwave Inc.
United States
Galco Industrial Electronics
United States
LCSC Electronics Technology (HK) Limited
China
Littelfuse, Inc.
United States
Mi-Tech Metals
Indianapolis, IN
Ohmite Manufacturing Co.
United States
Plansee SE
Austria
PUI - Projections Unlimited, Inc.
United States
Qnnect, formerly Hermetic Solutions Group
United States
Sanyo Denki America, Inc.
Torrance, CA
SECO
Italy
TONGYU Technology Co., Ltd.
China
Tucker Engineering, Inc.
Peabody, MA
Utmel Electronic Limited
China
Wanbang Technology (Guangdong Dongguan) Co., LTD.
China
Xoxide
Malvern, PA
Adafruit Industries
United States
Advanced Thermal Solutions, Inc.
United States
AMEC Thermasol
United Kingdom
ASSMANN WSW Components GmbH
Germany
Brainboxes Limited
United Kingdom
C&H Technology, Inc.
United States
CARLO GAVAZZI Automation Components
Buffalo Grove, IL
Carlo Gavazzi Automation SpA
Italy
COMAIR ROTRON (Shanghai) Fan Company Ltd.
China
Crydom Corporation
United States
CTS Corporation
United States
CUI Inc.
Tualatin, OR
Delta Electronics (Americas)
Research Triangle Park, NC
DFRobot
China
ebm-papst Inc.
United States
EDA Tec
China
Enclustra GmbH
Switzerland
Essentra Components
Erie, PA
Fischer Electronik
Germany
HS Marston Aerospace Limited
United Kingdom
JARO Thermal, Inc.
United States
KYOCERA AVX Components Corporation
Fountain Inn, SC
Malico, Inc.
Taiwan
Microchip Technology, Inc.
United States
Molex
United States
multicomp PRO
Chicago, IL
Murata Power Solutions
Mansfield, MA
Newark, An Avnet Company
United States
Nidec America Corporation
United States
NTE Electronics, Inc.
United States
NXP Semiconductors
United States
OMRON Automation and Safety
Schaumburg, IL
PHOENIX CONTACT USA
Middletown, PA
Picker Components
United States
Priatherm
Italy
Same Sky
United States
Seeed Studio
China
Semikron, Inc.
Hudson, NH
SIE Computing Solutions, Inc.
Brockton, MA
Solar Electric Power Association (SEPA)
United States
SSAC
United States
Sunon, Inc.
Brea, CA
T-Global Technology Co., Ltd.
Taiwan
TDK-Lambda Americas Inc., High Power Division
United States
TE Connectivity ™
Berwyn, PA
TRACO Power North America, Inc.
United States
Trenz Electronic GmbH
Germany
Wakefield Thermal, Inc.
Nashua, NH
Wakefield-Vette, Inc.
United States
Watterott Electronic GmbH
Germany
Wieland MicroCool
Decatur, AL
Z-LASER Optoelektronik GmbH
Germany