Plansee SE Datasheets for Heat Sinks
Heat sinks are thermally conductive, usually metallic components or devices that absorb and dissipate heat generated by electronic components such as computers. Common heat sink materials include aluminum, copper, and steel.
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|Heat Spreaders||Greater power densities in ever smaller electronic components represent a major challenge for thermal management of high power electronics. Inadequate cooling impacts on the reliability and service life of semiconductor...|
|Wafer Substrates for LED Chips||Wafer substrates are bonded to the semiconductor layers of LED chips. With molybdenum and molybdenum-copper wafer substrates, PLANSEE offers the optimum material for a reliable heat dissipation in LED chips.|
|Base Plates for Power Electronics||With our molybdenum and tungsten, we make sure that power diodes, thyristors and transistors keep their cool. With their outstanding thermal conductivity, electrical conductivity and material purity, our base plates...|