IEC - International Electrotechnical Commission Datasheets for Standards and Technical Documents
Standards and technical documents includes standards, codes, regulation, handbooks, manuals, comprehensive guides and other formal publications. Standards, codes, and regulation establish uniform specifications, procedures or technical criteria.
Standards and Technical Documents: Learn more
| Product Name | Notes |
|---|---|
| A sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for RF coaxial connectors of type 9,52. | |
| A sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for RF coaxial connectors with screw coupling, typically for use in 75 . cable distribution... | |
| Applicable to the test equipment used for dielectric tests on low-voltage equipment. It covers tests with direct, alternating or impulse voltage, impulse current, and tests with a combination of impulse... | |
| applies to coaxial communication cables. It specifies a test method for determining the eccentricity of the dielectric, outer conductor or sheath of coaxial communications cables. | |
| Applies to coaxial communication cables. It specifies test methods for determining the insulation resistance of coaxial cables. | |
| applies to coaxial communication cables. It specifies test methods for determining the ovality of dielectric, outer conductor(s) and overall jacket(s) or sheath(s) of coaxial cables. | |
| applies to coaxial communication cables. It specifies test methods for determining the withstand voltage of the dielectric of coaxial cables | |
| Applies to coaxial communication cables. It specifies test methods for tensile strength and elongation at fracture for copper clad metals of coaxial cables with low elongation of about 1%. | |
| applies to coaxial communications cables. It specifies a test method for determining the cross-talk between coaxial cables for use in communications systems. This method is applicable for the measurement of... | |
| applies to coaxial communications cables. It specifies a test method for determining the stability of the phase constant of coaxial communication cables | |
| applies to coaxial communications cables. It specifies a test method to determine the microphony charge level (mechanically induced noise), which is generated in a cable when the cable is subjected... | |
| applies to coaxial communications cables. It specifies test methods for determining the capacitance stability of the cable when subjected to temperature change. | |
| applies to coaxial communications cables. It specifies test methods for determining the capacitance. | |
| applies to coaxial communications cables. It specifies test methods for determining the characteristic impedance, phase and group delay, electrical length and propagation velocity of coaxial cables for use in telecommunications... | |
| applies to coaxial communications cables. It specifies test methods for determining the conductor d.c. resistance of coaxial cables | |
| applies to coaxial communications cables. It specifies test methods for determining the regularity of impedance of coaxial cables for use in communications systems in the time domain. | |
| applies to coaxial communications cables. It specifies test methods for determining the return loss (uniformity of impedance). | |
| Applies to coaxial communications cables. It specifies test methods for torsion characteristics of copper-clad metals of coaxial cables. | |
| applies to coaxial communications cables. It specifies test methods to determine the ability of a cable used in communications cabled systems to limit water migration along a specified path. | |
| Applies to equipment intended for transportable or installed use for monitoring, as a function of time, airborne radioactive iodines in the environment of a nuclear facility during normal operations, during... | |
| Applies to hand-held electrically operated circular saws, intended for household and similar use both indoors and outdoors. Defines the principal performance characteristics of circular saws that are of interest to... | |
| Applies to quartz crystal units manufactured as custom-built products or as standard catalogue items and whose quality is assessed on the basis of capability approval. Prescribes the preferred ratings and... | |
| Applies to quartz crystal units the quality of which is assessed on the basis of qualification approval. Prescribes the preferred ratings and characteristics, with the appropriate tests and measuring methods... | |
| Applies to the inspection of electronic components, packages, and also modules (referred to as "products in this standard) for use in electronic and electric equipment. It specifies sampling plans for... | |
| Applies to the technical documentaion to be supplied with electrical and electronic measuring equipment for use in laboratories and for testing and servicing. Replaces IEC 60278 and IEC 60278A. | |
| Applies to transportable or installed equipment for continuous monitoring of radioactive aerosols in the environment for both normal and accident conditions. | |
| Applies to: -dielectric tests with direct voltage -dielectric tests with alternating voltage -dielectric tests with impulse voltage -tests with impulse current -tests with combinations of the above. It has the... | |
| Contains the requirements for data communication between maritime electronic instruments, navigation and radiocommunication equipment when interconnected via an apppropriate system. | |
| Contains the requirements for data communication between maritime electronic instruments, navigation and radiocommunication equipment when interconnected via an appropriate system. Is intended to support one-way serial data transmission from a... | |
| Covers safety requirements for bayonet lampholders and includes references to IEC 61 for the control of interchangeability and safety of the cap and holder fit. | |
| Defines methods of registration and analysis of defects on soldered printed board assemblies. These methods are described to allow effective comparison of performance between products, processes and production locations, and... | |
| Defines the general requirements of the T-profile and three implementations of the T-profile over the Internet V4 (IPV4) protocol suite. | |
| Defines the major electrical, mechanical and environmental parameters for the description and performance analysis of stand-alone photovoltaic systems. | |
| Describes a free-field calibration method for determining random-incidence sensitivity levels of sound level meters. Additionally, the standard describes a diffuse-field calibration method for determining diffuse-field sensitivity levels. | |
| Describes the application profile of the communication protocol which is the basis for the communication system. Relies on the realization of layers 1 to 4 (the T-profile) as described in... | |
| describes the method of test to determine the stability of transmission performance of a finished cable used in analogue and digital communication systems when submitted to temperature changes which may... | |
| Describes those factors which control the flatness of rigid printed boards and their assemblies. This standard incorporates advice regarding design, base material, unassembled printed boards, and printed board assemblies. | |
| Gives an overview of the specific problems and requirements for electric power utility telecommunication systems. This publication has the status of a technical report. | |
| Gives guidance on the protection of overvoltage issues for both stand-alone and grid-connected photovoltaic power generating systems. | |
| Gives rules for the composition of designations and names which allow for identification of signals and connections in electrotechnical and related fields. | |
| gives the general requirements and conditions for electrical tests to be performed on coaxial communication cables and applies to the IEC 61196-1-1XX series which specifies electrical test methods for coaxial... | |
| IEC 61158-4-3:2007 specifies the procedures for the timely transfer of data and control information from one data-link user entity to a peer user entity, and among the data-link entities forming... | |
| IEC 61158-4-3:2010 describes the protocol that provides communication opportunities to a pre-selected "master" subset of data-link entities in a cyclic asynchronous manner, sequentially to each of those data-link entities. Other... | |
| IEC 61158-4-3:2014 specifies procedures for the timely transfer of data and control information from one data-link user entity to a peer user entity, and among the data-link entities forming the... | |
| IEC 61158-4-3:2019 specifies procedures for the timely transfer of data and control information from one data-link user entity to a peer user entity, and among the data-link entities forming the... | |
| IEC 61158-4-4:2007 specifies procedures for the timely transfer of data and control information from one data-link user entity to a peer user entity, and among the data-link entities forming the... | |
| IEC 61158-4-4:2014 specifies procedures for the timely transfer of data and control information from one data-link user entity to a peer user entity, and among the data-link entities forming the... | |
| IEC 61158-4-4:2019 specifies procedures for the timely transfer of data and control information from one data-link user entity to a peer user entity, and among the data-link entities forming the... | |
| IEC 61158-4-4:2023 specifies - procedures for the timely transfer of data and control information from one data-link user entity to a peer user entity, and among the data-link entities forming... | |
| IEC 61158-4-7:2007 describes the data-link layer which provides basic time-critical messaging communications between devices in an automation environment. It specifies the procedures for the timely transfer of data and control... | |
| IEC 61158-4-8:2007 provides a highly-optimized means of interchanging fixed-length input/output data and variable-length segmented messages between a single master device and a set of slave devices interconnected in a loop... | |
| IEC 61158-5-10:2010(E) specifies the structure and services of the type 10 IEC fieldbus Application Layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498) and the OSI Application Layer... | |
| IEC 61158-5-10:2014 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-10:2019 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-10:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 10 fieldbus. The term "time-critical" is... | |
| IEC 61158-5-11:2007 It provides user programs with a means to access the fieldbus communication environment. In this respect, the FAL can be viewed as a "window between corresponding application programs."... | |
| IEC 61158-5-12:2010(E) specifies the structure and services of the type 12 IEC fieldbus Application Layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498) and the OSI Application Layer... | |
| IEC 61158-5-12:2014 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-12:2019 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-13:2007 defines the services provided to the FAL user at the boundary between the user and the Application Layer of the Fieldbus Reference Model, and SystemsManagement at the boundary... | |
| IEC 61158-5-13:2014 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-14:2010 specifies the structure and services of the type 14 IEC fieldbus Application Layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498) and the OSI Application Layer... | |
| IEC 61158-5-14:2014 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-14:2207 provides user programs with a means to access the fieldbus communication environment. In this respect, the FAL can be viewed as a "window between corresponding application programs." This... | |
| IEC 61158-5-15:2007 provides user programs with a means to access the fieldbus communication environment. In this respect, the FAL can be viewed as a "window between corresponding application programs." This... | |
| IEC 61158-5-15:2010 specifies the structure and services of the type 15 IEC fieldbus Application Layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498) and the OSI Application Layer... | |
| IEC 61158-5-16:2007 provides user programs with a means to access the fieldbus communication environment. In this respect, the FAL can be viewed as a "window between corresponding application programs." This... | |
| IEC 61158-5-17:2007 provides user programs with a means to access the fieldbus communication environment. In this respect, the FAL can be viewed as a "window between corresponding application programs." This... | |
| IEC 61158-5-18:2007 defines the services provided to the FAL user at the boundary between the user and the Application Layer of the Fieldbus Reference Model, and SystemsManagement at the boundary... | |
| IEC 61158-5-18:2010 specifies the structure and services of the type 18 IEC fieldbus Application Layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498) and the OSI Application Layer... | |
| IEC 61158-5-19:2007 provides user programs with a means to access the fieldbus communication environment. In this respect, the FAL can be viewed as a "window between corresponding application programs." This... | |
| IEC 61158-5-19:2010 specifies the structure and services of the type 19 IEC fieldbus Application Layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498) and the OSI Application Layer... | |
| IEC 61158-5-19:2014 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-19:2019 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-20:2007 provides user programs with a means to access the fieldbus communication environment. In this respect, the FAL can be viewed as a "window between corresponding application programs." This... | |
| IEC 61158-5-20:2010 specifies the structure and services of the type 20 IEC fieldbus Application Layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498) and the OSI Application Layer... | |
| IEC 61158-5-20:2014 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-21:2010 specifies the structure and services of the type 21 IEC fieldbus Application Layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498) and the OSI Application Layer... | |
| IEC 61158-5-21:2019 specifies the structure and services of the type 21 IEC fieldbus Application Layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498) and the OSI Application Layer... | |
| IEC 61158-5-22:2010 specifies the structure and services of the type 22 IEC fieldbus Application Layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498) and the OSI Application Layer... | |
| IEC 61158-5-22:2014 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-23:2014 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-23:2019 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-24:2014 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-24:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 24 fieldbus. The term "time-critical" is... | |
| IEC 61158-5-25:2019 specifies the structure and services of the IEC fieldbus Application Layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498-1) and the OSI ApplicationLayer Structure (ISO/IEC 9545).FAL... | |
| IEC 61158-5-25:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 23 fieldbus. The term "time-critical" is... | |
| IEC 61158-5-26:2019 specifies the structure and services of the IEC fieldbus Application Layer, in conformance with the OSI Basic Reference Model (see ISO/IEC 7498-1) and the OSI Application Layer Structure... | |
| IEC 61158-5-26:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 26 fieldbus. The term "time-critical" is... | |
| IEC 61158-5-27:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 27 fieldbus. The term "time-critical" is... | |
| IEC 61158-5-2:2010(E) defines in an abstract way the externally visible service provided by the Type 2 fieldbus application layer in terms of an abstract model for defining application resources (objects)... | |
| IEC 61158-5-2:2014 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-2:2019 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-2:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 2 fieldbus. The term "time-critical" is... | |
| IEC 61158-5-3:2010(E) defines in an abstract way the externally visible service provided by Type 3 fieldbus Applicatio Layer in terms of an abstract model for defining application resources (objects) capable... | |
| IEC 61158-5-3:2014 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-4:2007 It provides user programs with a means to access the fieldbus communication environment. In this respect, the FAL can be viewed as a "window between corresponding application programs."... | |
| IEC 61158-5-4:2007 specifies the structure and services of the Type 4 fieldbus application layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498) and the OSI application layer structure... | |
| IEC 61158-5-4:2014 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-4:2019 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-4:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 4 fieldbus. The term "time-critical" is... | |
| IEC 61158-5-5:2014 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-5-7:2007 defines the services provided to the FAL user at the boundary between the user and the Application Layer of the Fieldbus Reference Model, and SystemsManagement at the boundary... | |
| IEC 61158-5-8:2007 specifies the structure and services of the Type 8 fieldbus application layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498) and the OSI application layer structure... | |
| IEC 61158-5-9:2007 defines the services provided to the FAL user at the boundary between the user and the Application Layer of the Fieldbus Reference Model, and SystemsManagement at the boundary... | |
| IEC 61158-5-9:2014 defines the services provided to the FAL user at the boundary between the user and the application layer of the fieldbus reference model, and Systems Management at the... | |
| IEC 61158-6-10:2010(E) specifies the protocol of the Type 10 fieldbus application layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498-1) and the OSI application layer structure (ISO/IEC 9545). | |
| IEC 61158-6-10:2014 defines the protocol provided to define the wire-representation of the service primitives defined in IEC 61158-5-10, and define the externally visible behavior associated with their transfer. This standard... | |
| IEC 61158-6-10:2019 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 2 fieldbus. The term “time-critical” is... | |
| IEC 61158-6-10:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 10 fieldbus. The term “time-critical” is... | |
| IEC 61158-6-11:2007 describes the fieldbus application layer (FAL) which provides user programs with a means to access the fieldbus communication environment. In this respect, the FAL can be viewed as... | |
| IEC 61158-6-12:2010 specifies the protocol of the Type 12 fieldbus application layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498-1) and the OSI application layer structure (ISO/IEC 9545). | |
| IEC 61158-6-12:2014 defines the protocol provided to define the wire-representation of the service primitives defined in IEC 61158-5-12, and define the externally visible behavior associated with their transfer. This standard... | |
| IEC 61158-6-12:2019 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 2 fieldbus. The term “time-critical” is... | |
| IEC 61158-6-13:2014 defines the protocol provided to define the wire-representation of the service primitives defined in IEC 61158-5-13, and define the externally visible behavior associated with their transfer. This standard... | |
| IEC 61158-6-14:2010(E) specifies the protocol of the Type 14 fieldbus application layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498-1) and the OSI application layer structure (ISO/IEC 9545). | |
| IEC 61158-6-14:2014 defines the protocol provided to define the wire-representation of the service primitives defined in IEC 61158-5-14, and define the externally visible behavior associated with their transfer. This standard... | |
| IEC 61158-6-15:2007 defines the protocol provided to define the wire-representation of the service primitives defined in IEC 61158-5-15, and define the externally visible behaviour associated with their transfer. This standard... | |
| IEC 61158-6-15:2010 specifies the protocol of the Type 15 fieldbus application layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498-1) and the OSI application layer structure (ISO/IEC 9545). | |
| IEC 61158-6-16:2007 describes the fieldbus application layer (FAL) which provides user programs with a means to access the fieldbus communication environment. In this respect, the FAL can be viewed as... | |
| IEC 61158-6-17:2007 describes the fieldbus application layer (FAL) which provides user programs with a means to access the fieldbus communication environment. In this respect, the FAL can be viewed as... | |
| IEC 61158-6-18:2007 specifies the protocol of the Type 18 fieldbus application layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498) and the OSI application layer structure (ISO/IEC 9545). | |
| IEC 61158-6-18:2010 specifies the protocol of the Type 18 fieldbus application layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498-1) and the OSI application layer structure (ISO/IEC 9545). | |
| IEC 61158-6-19:2010(E) specifies the protocol of the Type 19 fieldbus application layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498-1) and the OSI application layer structure (ISO/IEC 9545). | |
| IEC 61158-6-19:2014 defines the protocol provided to define the FAL user at the boundary between the user and the Application Layer of the Fieldbus Reference Model, and Systems Management at... | |
| IEC 61158-6-19:2019 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 2 fieldbus. The term “time-critical” is... | |
| IEC 61158-6-20:2010(E) specifies the protocol of the Type 20 fieldbus application layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498-1) and the OSI application layer structure (ISO/IEC 9545). | |
| IEC 61158-6-20:2014 defines the protocol provided to define the wire-representation of the service primitives defined in IEC 61158-5-20, and define the externally visible behavior associated with their transfer. This standard... | |
| IEC 61158-6-21:2010(E) specifies the protocol of the Type 21 fieldbus application layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498-1) and the OSI application layer structure (ISO/IEC 9545). | |
| IEC 61158-6-21:2019 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 2 fieldbus. The term “time-critical” is... | |
| IEC 61158-6-22:2010 defines in an abstract way the externally visible behavior provided by the different Types of the fieldbus Application Layer. It specifies the protocol provided to: - define the... | |
| IEC 61158-6-22:2014 defines the protocol provided to define the wire-representation of the service primitives defined in IEC 61158-5-22, and define the externally visible behavior associated with their transfer. This standard... | |
| IEC 61158-6-23:2014 defines the protocol provided to define the wire-representation of the service primitives defined in IEC 61158-5-23, and define the externally visible behaviour associated with their transfer. This standard... | |
| IEC 61158-6-23:2019 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 2 fieldbus. The term “time-critical” is... | |
| IEC 61158-6-23:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 23 fieldbus. The term "time-critical" is... | |
| IEC 61158-6-24:2014 defines the protocol provided to define the wire-representation of the service primitives defined in IEC 61158-5-24, and define the externally visible behaviour associated with their transfer. This standard... | |
| IEC 61158-6-24:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 24 fieldbus. The term "time-critical" is... | |
| IEC 61158-6-25:2019 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 2 fieldbus. The term “time-critical” is... | |
| IEC 61158-6-26:2019 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 2 fieldbus. The term “time-critical” is... | |
| IEC 61158-6-26:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 26 fieldbus. The term "time-critical" is... | |
| IEC 61158-6-27:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 27 fieldbus. The term "time-critical" is... | |
| IEC 61158-6-28:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 28 fieldbus. The term "time-critical" is... | |
| IEC 61158-6-2:2010 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 2 fieldbus. The term "time-critical" is... | |
| IEC 61158-6-2:2014 defines the protocol provided to define the wire-representation of the service primitives defined in IEC 61158-5-2, and define the externally visible behavior associated with their transfer. This standard... | |
| IEC 61158-6-2:2019 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 2 fieldbus. The term “time-critical” is... | |
| IEC 61158-6-2:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 2 fieldbus. The term "time-critical" is... | |
| IEC 61158-6-3:2010 defines in an abstract way the externally visible behaviour provided by the Type 3 fieldbus application layer. It specifies the protocol provided to: define the wire-representation of the... | |
| IEC 61158-6-3:2014 defines the protocol provided to define the wire-representation of the service primitives defined in IEC 61158-5-3, and define the externally visible behavior associated with their transfer. This standard... | |
| IEC 61158-6-3:2019 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 2 fieldbus. The term “time-critical” is... | |
| IEC 61158-6-4-:2014 defines the protocol provided to define the wire-representation of the service primitives defined in IEC 61158-5-4, and define the externally visible behavior associated with their transfer. This standard... | |
| IEC 61158-6-4:2007 defines the protocol provided to define the wire-representation of the service primitives defined in IEC 61158-5-4, and define the externally visible behaviour associated with their transfer. This standard... | |
| IEC 61158-6-4:2019 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 2 fieldbus. The term “time-critical” is... | |
| IEC 61158-6-4:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 4 fieldbus. The term “time-critical” is... | |
| IEC 61158-6-5:2007 defines the protocol provided to define the wire-representation of the service primitives defined in IEC 61158-5-5, and define the externally visible behaviour associated with their transfer. This standard... | |
| IEC 61158-6-5:2014 defines the protocol provided to define the wire-representation of the service primitives defined in IEC 61158-5-5, and define the externally visible behavior associated with their transfer. This standard... | |
| IEC 61158-6-7:2007 describes the fieldbus application layer (FAL) which provides user programs with a means to access the fieldbus communication environment. In this respect, the FAL can be viewed as... | |
| IEC 61158-6-8:2007 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 8 fieldbus. It specifies interactions between... | |
| IEC 61158-6-9:2010(E) specifies the protocol of the Type 9 fieldbus application layer, in conformance with the OSI Basic Reference Model (ISO/IEC 7498-1) and the OSI application layer structure (ISO/IEC 9545). | |
| IEC 61158-6-9:2014 defines the protocol provided to define the wire-representation of the service primitives defined in IEC 61158-5-9, and define the externally visible behavior associated with their transfer. This standard... | |
| IEC 61161:2013 specifies a method of determining the total emitted acoustic power of ultrasonic transducers based on the use of a radiation force balance; establishes general principles for the use... | |
| IEC 61162-1:2010 contains the requirements for data communication between maritime electronic instruments, navigation and radiocommunication equipment when interconnected via an appropriate system. Is intended to support one-way serial data transmission... | |
| IEC 61162-1:2016 contains the requirements for data communication between maritime electronic instruments, navigation and radiocommunication equipment when interconnected via an appropriate system. This part of IEC 61162 is intended to... | |
| IEC 61162-1:2016 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy... | |
| IEC 61162-1:2024 CMV contains both the official standard and its commented version. The commented version provides you with a quick and easy way to compare all the changes between IEC... | |
| IEC 61162-1:2024 contains the requirements for data communication between maritime electronic instruments, navigation and radiocommunication equipment when interconnected via an appropriate system. This document is intended to support one-way serial... | |
| IEC 61162-2:1998 Contains the requirements for data communication between maritime electronic instruments, navigation and radiocommunication equipment when interconnected via an appropriate interface. Supports one-way serial data transmission from a single... | |
| IEC 61162-2:2024 CMV contains both the official standard and its commented version. The commented version provides you with a quick and easy way to compare all the changes between IEC... | |
| IEC 61162-2:2024 contains the requirements for data communication between maritime electronic instruments, navigation and radiocommunication equipment when interconnected via an appropriate interface. This document is intended to support one-way serial... | |
| IEC 61162-3:2008 provides information for the application of NMEA 2000 aboard SOLAS vessels. Exceptions, additions and specific requirements for implementation upon SOLAS vessels are contained in the document. The NMEA... | |
| IEC 61162-3:2008+A1:2010 provides information for the application of NMEA 2000 aboard SOLAS vessels. Exceptions, additions and specific requirements for implementation upon SOLAS vessels are contained in the document. The NMEA... | |
| IEC 61162-3:2008+A1:2010 +A2:2014 provides information for the application of NMEA 2000 aboard SOLAS vessels. Exceptions, additions and specific requirements for implementation upon SOLAS vessels are contained in the document. The... | |
| IEC 61162-450:2011(E) specifies interface requirements and methods of test for high speed communication between shipboard navigation and radiocommunication equipment as well as between such systems and other ship systems that... | |
| IEC 61162-450:2011+A1:20 16(E) specifies interface requirements and methods of test for high speed communication between shipboard navigation and radiocommunication equipment as well as between such systems and other ship systems... | |
| IEC 61162-450:2018 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy... | |
| IEC 61162-450:2018 specifies interface requirements and methods of test for high speed communication between shipboard navigation and radiocommunication equipment as well as between such systems and other ship systems that... | |
| IEC 61162-450:2024 CMV contains both the official standard and its commented version. The commented version provides you with a quick and easy way to compare all the changes between IEC... | |
| IEC 61162-450:2024 specifies interface requirements and methods of test for high speed communication between shipboard navigation and radiocommunication equipment as well as between such systems and other ship systems that... | |
| IEC 61162-460:2015(E) is an add-on to the IEC 61162-450 standard where higher safety and security standards are needed, e.g. due to higher exposure to external threats or to improve network... | |
| IEC 61162-460:2018 is an add-on to IEC 61162-450 where higher safety and security standards are needed, for example due to higher exposure to external threats or to improve network integrity. | |
| IEC 61162-460:2018 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy... | |
| IEC 61162-460:2018+A1:20 20 is an add-on to IEC 61162-450 where higher safety and security standards are needed, for example due to higher exposure to external threats or to improve network... | |
| IEC 61162-460:2024 CMV contains both the official standard and its commented version. The commented version provides you with a quick and easy way to compare all the changes between IEC... | |
| IEC 61162-460:2024 is an add-on to IEC 61162-450 where higher safety and security standards are needed, for example due to higher exposure to external threats or to improve network integrity. | |
| IEC 61163-2:2020 provides guidance on RSS techniques and procedures for electrical, electronic, and mechanical components. This document is procedural in nature and is not, and cannot be, exhaustive with respect... | |
| IEC 61164:2004 gives models and numerical methods for reliability growth assessments based on failure data, which were generated in a reliability improvement programme. These procedures deal with growth, estimation, confidence... | |
| IEC 61167:2011 specifies the performance requirements for metal halide lamps for general lighting purposes. This second edition replaces the first edition published in 1992 and its Amendments 1 (1995), 2... | |
| IEC 61167:2015 specifies the performance requirements for metal halide lamps for general lighting purposes. This third edition replaces the second edition published in 2011. This third edition constitutes a technical... | |
| IEC 61167:2018 specifies the performance requirements for metal halide lamps for general lighting purposes. This fourth edition cancels and replaces the third edition published in 2015. This edition constitutes a... | |
| IEC 61167:2018+A1:2018 specifies the performance requirements for metal halide lamps for general lighting purposes. This fourth edition cancels and replaces the third edition published in 2015. This edition constitutes a... | |
| IEC 61169-1-2:2019 provides test methods for the insertion loss of radio-frequency (RF) connectors. This document is applicable to cable RF connectors, microstrip RF connectors and RF connector adapters. It is... | |
| IEC 61169-1-4:2020 provides test methods for the voltage standing wave ratio, return loss and reflection coefficient of RF connectors, including frequency domain method, time domain method, and gating. This document... | |
| IEC 61169-1-5:2022 provides test methods for the rise time degradation of radio frequency (RF) connector. This document is applicable to triaxial and other radio frequency connectors. | |
| IEC 61169-1-6:2022 provides test methods for RF power rating and power handling of RF connectors at specified frequency, temperature and altitude. This document is applicable to cabled RF connectors, microstrip... | |
| IEC 61169-10:2024, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for series SMB RF coaxial connectors with snap-on coupling with a... | |
| IEC 61169-11:2007 It is a Sectional Specification (SS), provides information and rules for the preparation of Detail Specifications (DS) for type STWX8 R.F. coaxial connectors with push-pull self-lock coupling. It... | |
| IEC 61169-11:2010 concerns RF coaxial connectors for use with RF cables both flexible and semi-rigid, where air dielectric interface and high mechanical stability is required for severe environmental exposure. The... | |
| IEC 61169-11:2017, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for RF coaxial connectors with threaded coupling, typically for use in... | |
| IEC 61169-15:2021 provides information and rules for the preparation of detail specifications (DS) for RF coaxial connectors with inner diameter of outer conductor 4,13 mm (0,163 in) with threaded coupling... | |
| IEC 61169-16:2006 Provides information and rules for the preparation of Detail Specifications (DS) for pin and socket R.F. coaxial connectors, with screw coupling mechanism, for low to medium power applications. | |
| IEC 61169-17:2022, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for series TNC RF coaxial connectors with threaded coupling with a... | |
| IEC 61169-18:2011 is a sectional specification and provides information and rules for preparation of detail specification of SSMA series RF connectors together with the pro-forma blank detail specification. It also... | |
| IEC 61169-19:2011 is a sectional specification. It provides information and rules for preparation of detail specification of SSMB series R.F connectors together with the pro forma blank detail specification The... | |
| IEC 61169-1:2013, which is a generic specification, relates to radio frequency connectors for r.f. transmission lines for use in telecommunications, electronics and similar equipment. It provides the basis for the... | |
| IEC 61169-21:2022 which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for type SC threaded RF coaxial connectors with 50 Ω characteristic... | |
| IEC 61169-24:2009, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for RF coaxial connectors with screw coupling, typically for use in... | |
| IEC 61169-24:2019 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy... | |
| IEC 61169-24:2019, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for RF coaxial connectors with screw coupling, typically for use in... | |
| IEC 61169-26:2013 is a sectional specification (SS), it provides information and rules for the preparation of detail specifications (DS) for TNCA series RF coaxial connectors, with characteristic impedance of 50... | |
| IEC 61169-2:2007 provides information and rules for the preparation of detail specifications (DS) for RF coaxial connectors of type 9,52. It describes the interface dimensions for general purpose grade 2... | |
| IEC 61169-35:2011 provides information and rules for preparation of detail specification of 2,92 series RF coaxial connectors together with the pro-forma blank detail specification. It also prescribes mating face dimensions... | |
| IEC 61169-38:2008 which is a sectional specification, provides information and rules for the preparation of detail specifications for series TMA r.f. connectors together with the pro forma blank detail specification. | |
| IEC 61169-39:2009 is a sectional specification. It provides information and rules for the preparation of detail specifications for CQM series quick lock RF connectors together with the pro forma blank... | |
| IEC 61169-40:2010 provides information and rules for preparation of detail specification of 2.4 series R.F connectors together with the pro-forma blank detail specification. It also prescribes mating face dimensions for... | |
| IEC 61169-41:2011 provides information and rules for preparation of detail specification of CQA series quick lock R.F. coaxial connectors together with the pro-forma blank detail specification. It also prescribes mating... | |
| IEC 61169-42:2013 provides information and rules for the preparation of detail specifications (DS) for CQN series RF coaxial connectors, with characteristic impedance of 50 Ohms, with threaded coupling and operating... | |
| IEC 61169-43:2013, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for RBMA series RF coaxial connectors, with characteristic impedance of 50... | |
| IEC 61169-44:2012 is a sectional specification (SS), it provides information and rules for preparation of detail specification of SMP series push-on RF coaxial connectors together with the pro-forma blank detail... | |
| IEC 61169-45:2014, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for type SQMA quick lock RF coaxial connectors. The connectors are... | |
| IEC 61169-47:2012(E) is part of the IEC 61169 series, and provides information and rules for the preparation of detail specifications (DS) for RF coaxial connectors with clamp coupling, typically for... | |
| IEC 61169-47:2015, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for RF coaxial connectors with clamp coupling, typically for use in... | |
| IEC 61169-48:2014, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for series BMP RF coaxial connectors with blind mating, typically for... | |
| IEC 61169-49:2014 which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for type SMAA series thread mated coaxial connectors. The connectors are... | |
| IEC 61169-4:2008 provides information and rules for the preparation of detail specifications (DS) for type 7-16 R.F. coaxial connectors with screw lock. It describes the interface dimensions for general purpose... | |
| IEC 61169-50:2014, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for type QMA R.F. coaxial connectors with quick lock. The connectors... | |
| IEC 61169-51:2015 provides information and rules for the preparation of detail specifications (DS) for type QLI R.F. coaxial connectors with quick lock. The connectors are normally used with 50 Ohms... | |
| IEC 61169-52:2015, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for RF coaxial connectors with snap-on coupling, typically for use in... | |
| IEC 61169-53:2015 is a sectional specification which provides information and rules for the preparation of detail specifications (DS) for RF coaxial connectors with threaded coupling, typically for use in 50... | |
| IEC 61169-54:2016 is a sectional specification which provides information and rules for the preparation of detail specifications (DS) for coaxial connectors with 10 mm inner diameter of outer conductor, characteristic... | |
| IEC 61169-54:2021 provides information and rules for the preparation of detail specifications (DS) for coaxial connectors with 10 mm inner diameter of outer conductor, characteristic impedance 50 Ω, series 4,3-10... | |
| IEC 61169-54:2021 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy... | |
| IEC 61169-58:2016, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for SBMA series coaxial connectors with blind-mate coupling. The connectors are... | |
| IEC 61169-59:2017, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for type L32-4 and L32-5 threaded multi-pin radio frequency connectors with... | |
| IEC 61169-60:2021 provides information and rules for the preparation of detail specifications (DS) for RF coaxial connectors with push-on coupling, typically for use in 50 Ω RF cables or micro-strips... | |
| IEC 61169-61:2020, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for coaxial connectors with a 9,5 mm inner diameter of the... | |
| IEC 61169-63:2020 which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for RF coaxial connectors which can preferably be used with RF... | |
| IEC 61169-64:2019, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for IEC 61169 (all parts) coaxial connectors with 0,8 mm coupling. | |
| IEC 61169-65:2021 provides information and rules for the preparation of detail specifications (DS) for series 1,35 mm RF coaxial connectors with screw coupling, characteristic impedance 50 Ω, for operating frequencies... | |
| IEC 61169-66:2021 provides information and rules for the preparation of detail specifications (DS) for series 2,2-5 RF coaxial connectors with quick-lock- or screw coupling, characteristic impedance 50 Ω, for operating... | |
| IEC 61169-67:2022, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for series TRL threaded triaxial connectors. Series TRL threaded triaxial connectors... | |
| IEC 61169-68:2022 which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for series TRK bayonet coupling triaxial connectors. The series TRK bayonet... | |
| IEC 61169-69:2024, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for RF coaxial connectors with push-on coupling, typically for use in... | |
| IEC 61169-70:2024, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) of HD-BNC series RF coaxial connectors together with the pro forma... | |
| IEC 61169-71:2022, which is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for RF coaxial connector, typically for use in 50 Ω radio... | |
| IEC 61169-8:2007 It is a sectional specification (SS), provides information and rules for the preparation of detail specifications (DS) for RF coaxial connectors which may preferably be used with RF... | |
| IEC 61174: 2008 specifies the performance requirements, methods of testing and required test results of equipment conforming to performance standards not inferior to those adopted by IMO in resolution MSC.232(82). | |
| IEC 61174:2015 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy... | |
| IEC 61174:2015 specifies the performance requirements, methods of testing and required test results of equipment conforming to performance standards not inferior to those adopted by the IMO in resolution MSC.232(82). | |
| IEC 61175-1:2015 provides rules for the composition of designations for the identification of signals and signal connections. This includes the designation of power supply. This part of IEC 61175 is... | |
| IEC 61180:2016 is applicable to dielectric tests with direct voltage; dielectric tests with alternating voltage; dielectric tests with impulse voltage and test equipment used for dielectric tests on low-voltage equipment. | |
| IEC 61181:2007+A1:2012 Specifies oil-sampling procedures, analysis requirements and procedures, and recommends sensitivity, repeatability and accuracy criteria for the application of dissolved gas analysis (DGA) to factory testing of new power... | |
| IEC 61182-2-2:2012 provides the information on the manufacturing requirements used for fabricating printed boards. This standard determines the XML schema details, defined in the generic standard IEC 61182-2 and some... | |
| IEC 61184:2008 applies to bayonet lampholders B15d and B22d for connection of lamps and semi-luminaires to a supply voltage of 250 V. This standard also covers lampholders which are integral... | |
| IEC 61184:2008+A1:2011 applies to bayonet lampholders B15d and B22d for connection of lamps and semi-luminaires to a supply voltage of 250 V. This standard also covers lampholders which are integral... | |
| IEC 61184:2017 This document applies to bayonet lampholders B15d and B22d for connection of lamps and semi-luminaires to a supply voltage of 250 V. This document also covers lampholders which... | |
| IEC 61184:2017+A1:2019 This document applies to bayonet lampholders B15d and B22d for connection of lamps and semi-luminaires to a supply voltage of 250 V. This document also covers lampholders which... | |
| IEC 61184:2017+AMD1:2019 +AMD2:2024 CSV This document applies to bayonet lampholders B15d and B22d for connection of lamps and semi-luminaires to a supply voltage of 250 V. This document also covers... | |
| IEC 61185:2005 specifies the dimensions that are of importance for mechanical interchangeability for ETD-cores made of ferrite, the essential dimensions of coil formers to be used with them, and the... | |
| IEC 61188-5-3:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is... | |
| IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction... | |
| IEC 61188-5-5:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is... | |
| IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective... | |
| IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. | |
| IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are... | |
| IEC 61188-6-3:2024 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC... | |
| IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design. The purpose of this document is to prevent land pattern design issues caused... | |
| IEC 61188-7:2009 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries. This facilitates and encourages a common data capture and transfer methodology amongst... | |
| IEC 61188-7:2017 establishes a consistent technique for the description of electronic component orientation, and their land pattern geometries. This facilitates and encourages a common data capture and transfer methodology amongst... | |
| IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus,... | |
| IEC 61189-2-501:2022 establishes a method suitable for testing the softness of FCCL (Flexible Copper Clad Laminate) products and related materials. This method determines the resilience under specified conditions. The test... | |
| IEC 61189-2-630:2018 specifies a test method to determine the amount of water absorbed by metal-clad laminates after conditioning in a pressure vessel for 1 h, 2 h, 3 h, 4... | |
| IEC 61189-2-719:2016 specifies a test method of relative permittivity and loss tangent of printed board and assembly materials, expected to be determined 2 to 10 of relative permittivity and 0,001... | |
| IEC 61189-2-720:2024 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison... | |
| IEC 61189-2-721:2015 outlines a way to determine the relative permittivity and loss tangent (also called dielectric constant and dissipation factor) of copper clad laminates at microwave frequencies (from 1,1 GHz... | |
| IEC 61189-2-801:2023 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal... | |
| IEC 61189-2-803:2023 specifies a test method to determine the Z-axis expansion of base materials and printed boards using a thermomechanical analyser (TMA). | |
| IEC 61189-2-804:2023 specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyser (TMA). Temperatures used for this evaluation are typically... | |
| IEC 61189-2-805:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of thin electrical insulating materials via the use of a thermomechanical analyser... | |
| IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA). | |
| IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a... | |
| IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA). | |
| IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by... | |
| IEC 61189-3-913:2016 specifies the test methods for thermal conductivity specific to printed circuit boards for high-brightness LEDs. The test applies to printed circuit boards for high-brightness LEDs with surface mounted... | |
| IEC 61189-3:2007 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major... | |
| IEC 61189-5-1:2016 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 contains the types of... | |
| IEC 61189-5-2:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods... | |
| IEC 61189-5-301:2021 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste). This document is applicable to the solder paste using... | |
| IEC 61189-5-3:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods... | |
| IEC 61189-5-4:2015 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods... | |
| IEC 61189-5-501:2021 is used to quantify the deleterious effects of flux residues on surface insulation resistance (SIR) in the presence of moisture. | |
| IEC 61189-5-502:2021 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coupon and quantifies the deleterious effects of improperly... | |
| IEC 61189-5-503:2017 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperature-humidity cyclic test and an... | |
| IEC 61189-5-504:2020 is a test method designed to determine the proportion of soluble ionic residues present upon a circuit board, electronic component or assembly. The conductivity of the solution used... | |
| IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the... | |
| IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. | |
| IEC 61189-6:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies. | |
| IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document... | |
| IEC 61190-1-2:2014-02(en -fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control... | |
| IEC 61190-1-3:2007 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for... | |
| IEC 61190-1-3:2007+A1:20 10 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and... | |
| IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for... | |
| IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. It also includes recommendations for good... | |
| IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also... | |
| IEC 61191-1:2018 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy... | |
| IEC 61191-2:2013 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies... | |
| IEC 61191-2:2017 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies... | |
| IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies... | |
| IEC 61191-4:2017 prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are entirely terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include... | |
| IEC 61191-6:2010 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191... | |
| IEC 61192-5:2007 provides information and requirements that are applicable to modification, rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic... | |
| IEC 61193-3:2013 establishes sampling plans for inspection by attributes, including sample plan selection criteria and implementation procedures for printed board and laminate end-product and in-process auditing. The principles established herein... | |
| IEC 61195:1999+A1:2012 specifies the safety requirements for double-capped fluorescent lamps for general lighting purposes of all groups having Fa6, Fa8, G5, G13 and R17d caps. Also specifies the method a... | |
| IEC 61195:1999+A1:2012+A 2:2014 specifies the safety requirements fordouble-capped fluorescent lamps for general lighting purposes of all groups having Fa6, Fa8, G5, G13 and R17d caps. Also specifies the method a... | |
| IEC 61196-1-100:2015 gives the general requirements and conditions for electrical tests to be performed on coaxial communication cables and applies to the IEC 61196-1-1xx series, which specifies electrical test methods... | |
| IEC 61196-1-100:2022 gives the general requirements and conditions for electrical tests to be performed on coaxial communication cables and applies to IEC 61196-1-1xx (all parts), which specifies electrical test methods... | |
| IEC 61196-1-100:2022 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy... | |
| IEC 61196-1-103:2015(E) applies to coaxial communications cables. It specifies test methods for determining the capacitance. This edition constitutes a technical revision. This edition includes the following significant technical change with... | |
| IEC 61196-1-104:2015(E) applies to coaxial communications cables. It specifies test methods for determining the capacitance stability of the cable when subjected to temperature change. This edition includes the following significant... | |
| IEC 61196-1-105:2024 applies to coaxial communication cables. It specifies test methods for determining the withstand voltage of the dielectric of coaxial cables. It is intended to detect the flaws in... | |
| IEC 61196-1-105:2024 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy... | |
| IEC 61196-1-108:2011(E) applies to coaxial communications cables. It specifies test methods for determining the characteristic impedance, phase and group delay, electrical length and propagation velocity of coaxial cables for use... | |
| IEC 61196-1-108:2025 applies to coaxial communications cables. It specifies test methods for determining the phase, phase constant, phase and group delay, propagation velocity, electrical length, and mean characteristic impedance of... | |
| IEC 61196-1-110:2016 specifies the test for electrical continuity of coaxial cables used in analogue and digital communication systems. This publication is to be read in conjunction with IEC 61196-1:2005. | |
| IEC 61196-1-111:2014 applies to coaxial communication cables. It specifies methods for determining the stability of phase of coaxial communication cables. - phase variation with temperature; - phase constant variation with... | |
| IEC 61196-1-111:2024 provides test methods to determine the stability of phase of coaxial communication cables. This document is applicable to RF coaxial cables. RF coaxial cable assemblies can also use... | |
| IEC 61196-1-111:2024 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy... | |
| IEC 61196-1-112:2025 applies to coaxial communications cables. It specifies test methods for determining return loss (RL) and voltage standing wave ratio (VSWR) of coaxial cables for use in communications systems. | |
| IEC 61196-1-113:2009(E) applies to coaxial communications cables. It specifies a test method for determining the attenuation constant of coaxial cables for use in communications systems. The test is applicable preferably... | |
| IEC 61196-1-113:2018(E) applies to coaxial communications cables. It specifies a test method for determining the attenuation constant of coaxial cables for use in communications systems. The test is applicable preferably... | |
| IEC 61196-1-113:2024 applies to coaxial communications cables. It specifies a test method for determining the attenuation constant of coaxial cables for use in communications systems. The test is applicable preferably... | |
| IEC 61196-1-114:2015 specifies the test methods to determine the inductance characteristics of coaxial cables used in analogue and digital communication systems. | |
| IEC 61196-1-116:2015 applies to coaxial communications cables. It specifies test methods for determining the impedance of coaxial communications cables with time domain reflectometry (TDR). This publication is to be read... | |
| IEC 61196-1-119:2012(E) defines the requirements to determine the average power handling capability of a coaxial cable at specified frequencies at ambient temperatures. | |
| IEC 61196-1-119:2020 defines the requirements to determine the average power handling capability of a coaxial cable at specified frequencies at ambient temperatures. This second edition cancels and replaces the first... | |
| IEC 61196-1-119:2020 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy... | |
| IEC 61196-1-119:2023 provides test methods for RF power rating and power withstanding of RF coaxial cables and cable assemblies at specified frequency, temperature and altitude. This document is applicable to... | |
| IEC 61196-1-123:2023 defines the test method to determine the attenuation constant of radiating coaxial communication cables that are intended for use in wireless communication systems such as tunnels, railways, highways,... | |
| IEC 61196-1-124:2022 defines the test method to determine the coupling loss of radiating coaxial communication cables that are intended for use in wireless communication systems such as tunnels, railways, highways,... | |
| IEC 61196-1-125:2022 specifies the test method to determine the equivalent relative permittivity and dissipation factor of dielectric for coaxial cables. It is intended to provide the dielectric properties of finished... | |
| IEC 61196-1-126:2022 provides the test method for the corona (partial discharge) extinction voltage of coaxial communication cables under specified environmental conditions. | |
| IEC 61196-1-127:2024 applies to radiating cables. It specifies a test method for determining the link loss of radiating cables for use in communication systems. | |
| IEC 61196-1-200:2014 gives the general requirements and conditions for environmental tests to be performed on coaxial communication cables and applies to the IEC 61196-1-2xx series, which specifies environmental test methods... | |
| IEC 61196-1-200:2022 gives the general requirements and conditions for environmental tests to be performed on coaxial communication cables and applies to the IEC 61196-1-2xx series, which specifies environmental test methods... | |
| IEC 61196-1-200:2022 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy... | |
| IEC 61196-1-201:2009(E) applies to CATV and telecommunications cables. It specifies test methods for determining the cold bend performance of coaxial cables for use in cabled distribution telecommunications networks. | |
| IEC 61196-1-206:2017 specifies the method of test to determine the stability of transmission performance of a finished RF coaxial cable when subjected to a set of temperatures, temperature changes, and... | |
| IEC 61196-1-208:2009(E) details a method of test to determine the longitudinal pneumatic resistance of coaxial communication cables protected by gas pressurisation. | |
| IEC 61196-1-209:2016(E) specifies a test method to determine the ability of a coaxial cable to withstand the effects of temperature cycling on its transmission performance. The purpose of this procedure... | |
| IEC 61196-1-212:2021 describes three methods to determine the UV resistance of sheath materials for electric and optical fibre cables. These tests apply for outdoor and indoor cable applications according to... | |
| IEC 61196-1-215:2016(E) defines a thermal ageing test to evaluate the transmission performance of coaxial cables under the effects of material temperature ageing. This procedure specifies a qualitative thermal ageing test... | |
| IEC 61196-1-303:2018(E) defines the requirements for measuring the plating thickness for silver and tin conductors for coaxial cables used in analogue and digital communication systems. This test method uses a... | |
| IEC 61196-1-304:2011(E) details the method of test to determine the impact resistance of coaxial communication cables. | |
| IEC 61196-1-305:2015(E) applies to coaxial communication cables. It specifies the test methods to determine solderability and the resistance to soldering of inner and outer conductors of cables used in analogue... | |
| IEC 61196-1-308:2012(E) applies to coaxial communication cables. It specifies test methods for tensile strength and percentage elongation at fracture for annealed and hard-drawn solid copper clad metals to be used... | |
| IEC 61196-10-1:2014 applies to coaxial communication cables described in IEC 61196-10. It specifies the requirements for semi-rigid radio frequency and coaxial cables with solid dielectric and semi-airspace dielectric. These cables... | |
| IEC 61196-10-1:2022 applies to coaxial communication cables described in IEC 61196-10, which specifies the requirements of semi-rigid coaxial communication cables with fluoropolymer dielectric and tubular outer conductors. Semi-rigid coaxial communication... | |
| IEC 61196-10:2014 applies to semi-rigid coaxial communication cables with polytetrafluoroethyl ene (PTFE) dielectric and tubular outer conductor. These cables are intended for use in microwave and wireless equipments or other... | |
| IEC 61196-10:2022 specifies the materials and cable construction for semi-rigid coaxial communication cables with fluoropolymer dielectric, IEC type designation, identification, marking and labelling, standard rating and characteristics, requirements of finished... | |
| IEC 61196-11-1:2016 applies to semi-rigid coaxial communication cables with polyethylene (PE) dielectric and tubular outer conductor. These cables are intended for use in microwave and wireless equipments or other signal... | |
| IEC 61196-11-1:2022 applies to coaxial communication cables described in IEC 61196-11. It specifies the layout and style for detail specifications for semi-rigid coaxial communication cables with polyethylene (PE) dielectric. Semi-rigid... | |
| IEC 61196-11:2016 applies to semi-rigid coaxial communication cables with polyethylene (PE) dielectric and tubular outer conductor. These cables are intended for use in microwave and wireless equipments or other signal... | |
| IEC 61196-11:2022 specifies the general requirements of semi-rigid coaxial communication cables with polyethylene (PE) dielectric, including material and construction, IEC type designation, identification, marking and labelling, standard ratings and characteristics,... | |
| IEC 61196-12:2024 defines general requirements for spacer clamps for radiating cables, including terms and definitions, design and construction, IEC type designation, requirements and test procedures and type tests. The contents... | |
| IEC 61196-13-1:2024 applies to coaxial communication cables described in IEC 61196-13. It specifies the requirements of semi-rigid coaxial communication cables with silicon dioxide dielectric and tubular outer conductor. These cables... | |
| IEC 61558-4-28:2023 provides a means of connecting devices through a partial mesh network, such that most failures of an interconnection between two devices can be circumvented. In common practice, the... | |
| IEC 61558-5-28:2023 provides common elements for basic time-critical and non-time-critical messaging communications between application programs in an automation environment and material specific to Type 28 fieldbus. The term "time-critical" is... | |
| Is a sectional specification (SS) and provides information and rules for the preparation of detail specifications (DS) for RF coaxial connectors with screw, snap-on, push-pull or quick-lock, slide-in coupling (rack... | |
| It applies to coaxial communication cables. It specifies test methods for determining the withstand voltage of the dielectric of coaxial cables. | |
| It applies to coaxial communication cables. It specifies test methods to determine the ability to withstand solvents and contaminating fluids. | |
| It is one of a series produced to facilitate the interconnection of automation system components. It is related to other standards in the set as defined by the "three-layer" fieldbus... | |
| It provides user programs with a means to access the fieldbus communication environment. In this respect, the FAL can be viewed as a "window between corresponding application programs." This standard... | |
| It specifies the requirements for a manufacturer seeking approval of his capability to design (if applicable), manufacture, inspect, test and release coaxial communication cables as defined in his capability manual... | |
| L'IEC 61158-5-11:2007 defines the services provided to the FAL user at the boundary between the user and the Application Layer of the Fieldbus Reference Model, and Systems Management at the... | |
| Not only are Markov analysis methods suited to the modelling of maintenance strategies, but such methods also enable the failure restoration events to be modelled in a pictorial way which... | |
| Please note that this part is also available as part of a special CD-ROM containing IEC 61158-2 (with 2 amendments), IEC 61158-3, IEC 61158-4, IEC 61158-5 and IEC 61158-6 for... | |
| Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those... | |
| Prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mounted and related assembly technologies. Also included are recommendations for good manufacturing processes. | |
| Prescribes requirements for terminal soldered assemblies. The requirements pertain to those assemblies that are totally terminal/wire interconnecting structures or to the terminal/wire portions of those assemblies that include other related... | |
| Prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, and powder solders, other than solder paste, for electronic soldering applications as well... | |
| Prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include... | |
| Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical,... | |
| Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical... | |
| Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. | |
| Provides guidance on reliability stress screening techniques and procedures for electronic components. Is intended for use of a) component manufacturers as a guideline, b) component users as a guideline to... | |
| Provides information and rules for the preparation of detail specifications for series BMA r.f. connectors together with the pro forma blank detail specification (BDS). Prescribes mating face dimensions for general... | |
| Provides information and rules for the preparation of detailspecifications for series BMA r.f. connectors together with the pro forma blank detail specification (BDS). Prescribes mating face dimensions for general purpose... | |
| Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient... | |
| Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount... | |
| Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance... | |
| Provides rules for the composition of designations and names for the identification of signals and signal connections. Includes the designation of power supply circuits. | |
| Relates to connectors for r.f. transmission lines and serves as a generic specification providing the basis for the sectional standards which apply to individual connector types. Establishes uniform concepts and... | |
| Specifies a method of determining the total radiated acoustic power of ultrasonic transducters based on the use of a radiation force balance. Provides general principles for the use of radiation... | |
| Specifies a minimum set of tests to be done, test results to be achieved and documents that shall be available for all implementations of general protocol software and applications that... | |
| Specifies analysis requirements and procedures, and recommends sensitivity and precision criteria for factory testing of power transformers, reactors and instrument transformers. | |
| Specifies data file formats used to describe printed boards and printed board assembly products for tooling, manufacturing, assembly, and testing requirements. Useful when the manufacturing cycle includes computer-aided processes and... | |
| specifies environmental test methods for coaxial communication cables.Further test details (e.g. temperature, duration) and/or test requirements may be given in the relevant sectional or detail specification. | |
| Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate... | |
| Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder... | |
| Specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. Defines requirements and guidelines for good workmanship... | |
| Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies... | |
| Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to... | |
| Specifies oil-sampling procedures, analysis requirements and procedures, and recommends sensitivity, repeatability and accuracy criteria for the application of dissolved gas analysis (DGA) to factory testing of new power transformers, reactors... | |
| Specifies record formats used to describe printed board products with detail sufficient for tooling, manufacturing and testing requirements. These formats may be used for transmitting information between a printed board... | |
| Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies... | |
| Specifies seismic severity levels and gives a choice of methods that can be applied to demonstrate the performance of HV circuit-breakers for which seismic qualification is required. | |
| Specifies the content, format and recording method of the data blocks forming the helical records of the tape containing video, audio and associated data using the 19 mm type D-2... | |
| Specifies the definitions and requirements for radio-frequency coaxial and screened twin conductor cables. Specifies the reference test methods for radio-frequency coaxial and twin conductor cables. This publication supersedes IEC 61196-1-1. | |
| Specifies the general requirements, the definitions and the requirements for the design and test methods of coaxial communication cables. | |
| Specifies the methods of test and general requirements for quartz crystal units of assessed quality using either capability approval or qualification approval procedures according to clause 11 of IECQ 001002. | |
| Specifies the performance requirements, methods of testing and required test results of equipment conforming to performance standards not inferior to those adopted by the IMO in resolution A.817. | |
| Specifies the requirement for and basic components of the IEC 61162-4 series companion standards. These components are referred to as a) PCS (PISCES companion standards); b) PCSDL (PCS description language); | |
| Specifies the safety requirements for double-capped fluorescent lamps for general lighting purposes of all groups having Fa6, Fa8, G5, G13 and R17d caps. Also specifies the method a manufacturer should... | |
| Specifies the XML Schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection... | |
| Specifies type tests to be performed by the manufacturer at the design and construction stages of a radiotherapy simulator but does not specify site tests to be performed after installation... | |
| Specifies unique designations for cores and assemblies for transformers and inductors made from laminations. | |
| Standard | |
| Supplement to IEC 61182-1, specifically in the area of describing bare board electrical test information. Intended to convey additional requirements, guidelines, and examples necessary to provide the data structures and... | |
| Supplementary document to the sectional specification and contains requirements for style and layout and minimum content of detail specification. | |
| Supplementary document to the sectional specification. Contains requirements for style, layout and minimum content of detail specifications. | |
| Supplementary document to the sectional specification. Contains requirements for the minimum content of detail specifications. | |
| The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the... | |
| The contents of the corrigendum of December 2012 have been included in this copy. | |
| These connectors are recommended for use with semi-rigid and flexible cable and in microwave applications requiring high performance. Have an operating frequency of up to 65 GHz. | |
| These connectors are recommended for use with semi-rigid and flexible cable and in microwave applications requiring high performance. These connectors have an operating frequency range of up to 110 GHz. | |
| These processes are applicable for lots of repairable hardware items, in cases where the items have an unacceptably low reliability in the early failure period, and when other methods, like... | |
| This International Standard - specifies a method of determining the total emitted acoustic power of ultrasonic transducers based on the use of a radiation force balance; - establishes general principles... | |
| This International Standard makes recommendations for the implementation of design review as a means of verifying that the design input requirements have been met and stimulating the improvement of the... | |
| This International Standard provides guidance on the application of Markov techniques to model and analyze a system and estimate reliability, availability, maintainability and safety measures. This standard is applicable to... | |
| This part of IEC 61158 is one of a series produced to facilitate the interconnection of automation system components. It is related to other standards in the set as defined... | |
| This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an unacceptably... | |
| This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains... | |
| This standard gives models and numerical methods for reliability growth assessments based on failure data from a single system which were generated in a reliability improvement programme. | |
| This standard series, IEC 61162-400 and upwards, specifies a communication protocol for use in interconnected maritime systems. Specifies an interface description language for use together with the protocol, a set... |
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