AENOR Datasheets for Standards and Technical Documents
Standards and technical documents includes standards, codes, regulation, handbooks, manuals, comprehensive guides and other formal publications. Standards, codes, and regulation establish uniform specifications, procedures or technical criteria.
Standards and Technical Documents: Learn more
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| Product Name | Notes |
|---|---|
| Adaptors for fibre optic connectors -- Part 1-1: Blank detail specification (IEC 61274-1-1:2006). (Endorsed by AENOR in March of 2007.) | |
| Adaptors for fibre optic connectors -- Part 1: Generic specification (Endorsed by AENOR in May of 2008.) | |
| Aerospace series - Blind bolt, 100° flush head, high strength (Endorsed by Asociación Española de Normalización in November of 2017.) | |
| Aerospace series - Blind bolt, protruding head, high strength, pulltype (Endorsed by AENOR in October of 2016.) | |
| Aerospace series - Blind bolt, protruding head, high strength, pulltype (Endorsed by Asociación Española de Normalización in February of 2017.) | |
| Aerospace series - Fitting end, 24° internal cone, external thread, flareless type - Extra fine thread pitch - Inch series - Design standard (Endorsed by AENOR in May of 2016.)... | |
| Aerospace series - Fitting end, 24° internal cone, external thread, flareless type, size -32 tube diameter D=2 inches (D=50,8 mm) extra fine thread pitch inch series - Inch series -... | |
| ALTERNATING CURRENT STATIC VAR-HOUR METERS FOR REACTIVE ENERGY (CLASSES 2 AND 3). | |
| Aluminium-clad steel wires for electrical purposes. | |
| Aluminium-clad steel wires for electrical purposes | |
| ANALOGUE AUDIO RECORDING ON VIDEO TAPE. POLARITY OF MAGNETIZATION. (Endorsed by AENOR in December of 1995.) | |
| Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (Endorsed by AENOR in July of 2014.) | |
| Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly | |
| Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications | |
| Attachment materials for electronic assembly -- Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (Endorsed by AENOR in November of 2002.) | |
| Attachment materials for electronic assembly -- Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly (Endorsed by AENOR in November of 2002.) | |
| Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (IEC 61190-1-3:2002). (Endorsed by AENOR in... | |
| Bayonet lampholders (Endorsed by Asociación Española de Normalización in December of 2024.) | |
| Bayonet lampholders (Endorsed by Asociación Española de Normalización in November of 2017.) | |
| Bayonet lampholders (Endorsed by Asociación Española de Normalización in November of 2022.) | |
| BAYONET LAMPHOLDERS. | |
| Bayonet lampholders | |
| BROADCAST VIDEO TAPE RECORDERS. METHODS OF MEASUREMENT. PART 1: MECHANICAL MEASUREMENTS. | |
| BROADCAST VIDEO TAPE RECORDERS. METHODS OF MEASUREMENT. PART 2: ELECTRICAL MEASUREMENTS OF ANALOGUE. | |
| BROADCAST VIDEO TAPE RECORDERS. METHODS OF MEASUREMENT. PART 4: ANALOGUE AUDIO PERFORMANCE MEASUREMENTS. (Endorsed by AENOR in November of 2001.) | |
| CAPACITORS FOR MICROWAVE OVENS. PART 1: GENERAL. | |
| CERAMIC PRESSURISED INSULATORS FOR HIGH-VOLTAGE SWITCHGEAR AND CONTROLGEAR | |
| Ceramic pressurized hollow insulators for high-voltage switchgear and controlgear. | |
| Characteristic parameters of stand-alone photovoltaic (PV) systems | |
| Coaxial communication cables - Part 10-1: Blank detail specification for semi-rigid cables with polytetrafluoroethyl ene (PTFE) dielectric | |
| Coaxial communication cables - Part 10: Sectional specification for semi-rigid cables with polytetrafluoroethyl ene (PTFE) dielectric | |
| Coaxial communication cables - Part 4: Sectional specification for radiating cables | |
| Compression and mechanical connectors for power cables for rated voltages up to 36 kV (Um = 42 kV) - Part 1: Test methods and requirements | |
| Connecting devices - Flat quick-connect terminations for electrical copper conductors - Safety requirements | |
| CONNECTING DEVICES. FLAT QUICK-CONNECT TERMINATIONS FOR ELECTRICAL COPPER CONDUCTORS. SAFETY REQUIREMENTS. | |
| CRYSTALINE SILICON TERRESTRIAL PHOTOVOLTAIC (PV) MODULES. DESIGN QUALIFICATION AND TYPE APPROVAL. | |
| Crystalline silicon terrestrial photovoltaic (PV) modules - Design qualification and type approval | |
| CRYSTALLINE SILICON TERRESTRIAL PHOTOVOLTAIC (PV) MODULES. DESIGN QUALIFICATION AND TYPE APPROVAL. (Endorsed by AENOR in November of 1995.) | |
| Double-capped fluorescent lamps - Safety specifications. | |
| Double-capped fluorescent lamps - Safety specifications | |
| DOUBLE-CAPPED FLUORESCENT LAMPS. SAFETY SPECIFICATIONS. | |
| DOUBLE-CAPPED FLUSRESCENT LAMPS. SAFETY SPECIFICATIONS | |
| EAVES GUTTERS AND RAINWATER DOWN-PIPES OF METAL SHEET. DEFINITIONS, CLASSIFICATIONS AND REQUIREMENTS. | |
| EAVES GUTTERS AND RAINWATER DOWN-PIPES OF METAL SHEETS. DEFINITIONS, CLASSIFICATIONS AND REQUIREMENTS. | |
| Eaves gutters with bead stiffened fronts and rainwater pipes with seamed joints made of metal sheet | |
| ELECTRIC SHAVERS FOR HOUSEHOLD USE. METHODS FOR MEASURING THE PERFORMANCE. | |
| Electrical accessories - Cable reels for household and similar purposes | |
| ELECTRICAL ACCESSORIES. CABLE REELS FOR HOUSEHOLD AND SIMILAR PURPOSES. | |
| ELECTRICAL AND ELECTRONIC MEASURING EQUIPMENT. DOCUMENTATION. | |
| Electrical apparatus for use in the presence of combustible dust - Part 2: Test methods - Section 2: Method for determining the electrical resistivity of dust in layers | |
| Electrical apparatus for use in the presence of combustible dust - Part 4: Type of protection "pD" | |
| Electrical apparatus for use in the presence of combustible dust -- Part 0: General requirements (IEC 61241-0:2004+Corrige ndum 1:2005, modified). | |
| Electrical apparatus for use in the presence of combustible dust -- Part 10: Classification of areas where combustible dusts are or may be present | |
| Electrical apparatus for use in the presence of combustible dust -- Part 11: Protection by intrinsic safety "iD" | |
| Electrical apparatus for use in the presence of combustible dust -- Part 14: Selection and installation. | |
| Electrical apparatus for use in the presence of combustible dust -- Part 17: Inspection and maintenance of electrical installations in hazardous areas (other than mines) | |
| Electrical apparatus for use in the presence of combustible dust -- Part 18: Protection by encapsulation "mD" | |
| Electrical apparatus for use in the presence of combustible dust -- Part 1: Protection by enclosures "tD" | |
| Electrical insulating materials and systems - A.C. voltage endurance evaluation (Endorsed by AENOR in April of 2016.) | |
| ELECTRICAL INSULATING MATERIALS. METHODS OF TEST FOR THE HYDROLYTIC STABILITY. PART 2: MOULDED THERMOSETS. (Endorsed by AENOR in July of 1998.) | |
| Electroacoustics - Instruments for measurement of aircraft noise - Performance requirements for systems to measure one-third-octave band sound pressure levels in noise certification of transport-category aeroplanes | |
| Electroacoustics - Octave-band and fractional-octave-ba nd filters - Part 1: Specifications (Endorsed by AENOR in August of 2014.) | |
| Electroacoustics - Octave-band and fractional-octave-ba nd filters - Part 2: Pattern-evaluation tests (Endorsed by AENOR in July of 2016.) | |
| Electroacoustics - Octave-band and fractional-octave-ba nd filters - Part 2: Pattern-evaluation tests (Endorsed by Asociación Española de Normalización in August of 2017.) | |
| Electroacoustics - Octave-band and fractional-octave-ba nd filters - Part 3: Periodic tests (Endorsed by AENOR in July of 2016.) | |
| Electroacoustics - Octave-band and fractional-octave-ba nd filters. | |
| Electroacoustics - Octave-band and fractional-octave-ba nd filters | |
| Electroacoustics - Specifications for personal sound exposure meters (Endorsed by Asociación Española de Normalización in August of 2017.) | |
| Electroacoustics - Specifications for personal sound exposure meters | |
| ELECTROACOUSTICS. RANDOM-INCIDENCE AND DIFFUSE-FIELD CALIBRATION OF SOUND LEVEL METERS. | |
| ELECTROACOUSTICS. SPECIFICATIONS FOR PERSONAL SOUND EXPOSURE METERS. | |
| Evaluation and routine testing in medical imaging departments - Part 2-4: Constancy tests - Hard copy cameras | |
| Evaluation and routine testing in medical imaging departments - Part 2-5: Constancy tests - Image display devices | |
| Evaluation and routine testing in medical imaging departments - Part 2-6: Constancy tests - Imaging performance of computed tomography X-ray equipment | |
| Evaluation and routine testing in medical imaging departments - Part 3-3: Acceptance tests - Imaging performance of X-ray equipment for digital subtraction angiography (DSA) | |
| Evaluation and routine testing in medical imaging departments -- Part 3-1: Acceptance tests - Imaging performance of X-ray equipment for radiographic and radioscopic systems. | |
| Evaluation and routine testing in medical imaging departments -- Part 3-2: Acceptance tests - Imaging performance of mammographic X-ray equipment | |
| Evaluation and routine testing in medical imaging departments -- Part 3-4: Acceptance tests - Imaging performance of dental X-ray equipment. | |
| Evaluation and routine testing in medical imaging departments -- Part 3-5: Acceptance tests - Imaging performance of computed tomography X-ray equipment | |
| EVALUATION AND ROUTINE TESTING IN MEDICAL IMAGING DEPARTMENTS. PART 2-6. CONSTANCY TESTS. X-RAY EQUIPMENT FOR COMPUTED TOMOGRAPY. | |
| EVALUATION AND ROUTINE TESTING IN MEDICAL IMAGING DEPARTMENTS. PART 2-6: CONSTANCY TESTS. X-RAY EQUIPMENT FOR COMPUTED TOMOGRAPHY. (Endorsed by AENOR in December of 1995.) | |
| EVALUATION AND ROUTINE TESTING IN MEDICAL IMAGING DEPARTMENTS. PART 3-2: ACCEPTANCE TESTS. IMAGING PERFORMANCE OF MAMMOGRAPHIC X-RAY EQUIPMENT. | |
| Expression of performance of gas analyzers - Part 2: Oxygen in gas (utilizing high-temperature electrochemical sensors) | |
| Expression of performance of gas analyzers - Part 6: Photometric analyzers | |
| Expression of performance of gas analyzers - Part 6:Photometric analyzers (Endorsed by AENOR in February of 2015.) | |
| Expression of performance of gas analyzers - Part 7: Tuneable semiconductor laser gas analyzers (Endorsed by AENOR in January of 2014.) | |
| Expression of performance of gas analyzers - Part 7: Tuneable semiconductor laser gas analyzers (Endorsed by AENOR in September of 2015.) | |
| Expression of performance of gas analyzers -- Part 1: General (Endorsed by AENOR in November of 2010.) | |
| Expression of performance of gas analyzers -- Part 1: General. | |
| EXPRESSION OF PERFORMANCE OF GAS ANALYZERS. PART 1: GENERAL. (Endorsed by AENOR in May of 1996.) | |
| EXPRESSION OF PERFORMANCE OF GAS ANALYZERS. PART 6: PHOTOMETRIC ANALYZERS. (Endorsed by AENOR in May of 1996.) | |
| Ferrite cores (ETD-cores) intended for use in power supply applications - Dimensions (Endorsed by AENOR in September of 2005.) | |
| FIBRE OPTIC ADAPTORS. PART 1-1: BLANK DETAIL SPECIFICATION. (Endorsed by AENOR in November of 1997.) | |
| FIBRE OPTIC ADAPTORS. PART 1: GENERIC SPECIFICATION. (Endorsed by AENOR in November of 1997.) | |
| Fibre optic communication subsystem basic test procedures - Part 1-1: Test procedures for general communication subsystems - Transmitter output optical power measurement for single-mode optical fibre cable (Endorsed by AENOR... | |
| Fibre optic communication subsystem basic test procedures - Part 1-1: Test procedures for general communication subsystems - Transmitter output optical power measurement for single-mode optical fibre cable | |
| Fibre optic communication subsystem basic test procedures - Part 2-3: Test procedures for digital systems - Jitter and wander measurements (Endorsed by AENOR in January of 2010.) | |
| Fibre optic communication subsystem basic test procedures - Part 4-2: Fibre optic cable plant - Single-mode fibre optic cable plant attenuation | |
| FIBRE OPTIC COMMUNICATION SUBSYSTEM BASIC TEST PROCEDURES. PART 1-3: TEST PROCEDURES FOR GENERAL COMMUNICATION SUBSYSTEMS. CENTRAL WAVELENGTH AND SPECTRAL WIDTH MEASUREMENT (Endorsed by AENOR in June of 1999.) | |
| FIBRE OPTIC COMMUNICATION SUBSYSTEM BASIC TEST PROCEDURES. PART 2-1: TEST PROCEDURES FOR DIGITAL SYSTEMS. RECEIVER SENSITIVITY AND OVERLOAD MEASUREMENT (Endorsed by AENOR in June of 1999.) | |
| FIBRE OPTIC COMMUNICATION SUBSYSTEM BASIC TEST PROCEDURES. PART 2-4: TEST PROCEDURES FOR DIGITAL SYSTEMS. BIT-RATE TOLERANCE MEASUREMENT (Endorsed by AENOR in November of 1998.) | |
| FIBRE OPTIC COMMUNICATION SUBSYSTEM BASIC TEST PROCEDURES. PART 2-5: TEST PROCEDURES FOR DIGITAL SYSTEMS. JITTER TRANSFER FUNCTION MEASUREMENT (Endorsed by AENOR in November of 1998.) | |
| Fibre optic communication subsystem test procedures - Digital systems - Part 2-8: Determination of low BER using Q-factor measurements | |
| Fibre optic communication subsystem test procedures - Part 1-3: General communication subsystems - Central wavelength and spectral width measurement | |
| Fibre optic communication subsystem test procedures - Part 1-4: General communication subsystems - Light source encircled flux measurement method (Endorsed by AENOR in May of 2010.) | |
| Fibre optic communication subsystem test procedures - Part 2-12: Digital systems - Measuring eye diagrams and Q-factor using a software triggering technique for transmission signal quality assessment (Endorsed by AENOR... | |
| Fibre optic communication subsystem test procedures - Part 2-2: Digital systems - Optical eye pattern, waveform and extinction ratio measurement (Endorsed by AENOR in February of 2013.) | |
| Fibre optic communication subsystem test procedures - Part 2-2: Digital systems - Optical eye pattern, waveform and extinction ratio measurement (Endorsed by AENOR in June of 2015.) | |
| Fibre optic communication subsystem test procedures - Part 4-1: Installed cable plant - Multimode attenuation measurement | |
| Fibre optic communication subsystem test procedures - Part 4-4: Cable plants and links - Polarization mode dispersion measurement for installed links (Endorsed by Asociación Española de Normalización in September of... | |
| Fibre optic communication subsystem test procedures - Part 4-4: Cable plants and links - Polarization mode dispersion measurement for installed links | |
| Fibre optic communication subsystem test procedures -- Part 1-4: General communication subsystems - Collection and reduction of two-dimensional nearfield data for multimode fibre laser transmitters (Endorsed by AENOR in July... | |
| Fibre optic communication subsystem test procedures -- Part 2-10: Digital systems - Time-resolved chirp and alpha-factor measurement of laser transmitters (Endorsed by AENOR in July of 2009.) | |
| Fibre optic communication subsystem test procedures -- Part 2-11: Digital systems - Averaged Q-factor determination using amplitude histogram evaluation for optical signal quality monitoring (Endorsed by AENOR in June of... | |
| Fibre optic communication subsystem test procedures -- Part 2-1: Digital systems - Receiver sensitivity and overload measurement (Endorsed by AENOR in June of 2010.) | |
| Fibre optic communication subsystem test procedures -- Part 2-2: Digital systems - Optical eye pattern, waveform and extinction ratio measurement (Endorsed by AENOR in December of 2008.) | |
| Fibre optic communication subsystem test procedures -- Part 2-2: Digital systems - Optical eye pattern, waveform and extinction ratio measurement (Endorsed by AENOR in October of 2005.) | |
| Fibre optic communication subsystem test procedures -- Part 2-9: Digital systems - Optical signal-to-noise ratio measurement for dense wavelength-division multiplexed systems (Endorsed by AENOR in July of 2009.) | |
| Fibre optic communication subsystem test procedures -- Part 2-9: Digital systems - Optical signal-to-noise ratio measurement for dense wavelength-division multiplexed systems (Endorsed by AENOR in March of 2003.) | |
| FIBRE OPTIC COMMUNICATION SUBSYSTEM. PART 2-2: TEST PROCEDURES FOR DIGITAL SYSTEMS. OPTICAL EYE PATTERN, WAVEFORM, AND EXTINCTION RATIO. (Endorsed by AENOR in June of 1999.) | |
| Fibre optic communication subsystems - Part 1: Generic specification | |
| FIBRE OPTIC INTERCONNECTING DEVICES AD PASSIVE COMPONENTS - BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-20: TESTS - CLIMATIC SEQUENCE (Endorsed by AENOR in December of 1997.) | |
| Fibre optic interconnecting devices and passive components - Adaptors for fibre optic connectors - Part 1-1: Blank detail specification (Endorsed by AENOR in April of 2012.) | |
| Fibre optic interconnecting devices and passive components - Adaptors for fibre optic connectors - Part 1: Generic specification (Endorsed by AENOR in May of 2012.) | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 1: General and guidance | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-10: Tests - Crush resistance (Endorsed by AENOR in March of 2013.) | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-11: Tests - Axial compression | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-13: Tests - Acceleration | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-14: Tests - High optical power (Endorsed by AENOR in March of 2013.) | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-15: Tests - Torque strength of coupling mechanism | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-18: Tests - Dry heat - High temperature endurance | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-19: Tests - Damp heat (steady state) (Endorsed by AENOR in March of 2013.) | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-19: Tests - Damp heat (steady state) (Endorsed by Asociación Española de Normalización in May... | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-1: Tests - Vibration (sinusoidal) | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures -- Part 1: General and guidance | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures -- Part 2-12: Tests - Impact (Endorsed by AENOR in March of 2010.) | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures -- Part 2-12: Tests - Impact | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures -- Part 2-14: Tests - Optical power handling and damage threshold characterization (IEC 61300-2-14:2005) | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures -- Part 2-16: Tests - Mould growth (IEC 61300-2-16:2006). | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures -- Part 2-17: Tests - Cold | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures -- Part 2-19: Tests - Damp heat (steady state) | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures -- Part 2-1: Tests - Vibration (sinusoidal) | |
| Fibre optic interconnecting devices and passive components - Basic test and measurement procedures -- Part 2-21: Tests - Composite temperature-humidity cyclic test (Endorsed by AENOR in June of 2010.) | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-10: TESTS. CRUSH RESISTANCE. (Endorsed by AENOR in December of 1997.) | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-12: TESTS - IMPACT (Endorsed by AENOR in December of 1997.) | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-15: TESTS - TORQUE STRENGTH OF COUPLING MECHANISM (Endorsed by AENOR in December of 1997.) | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-16: TESTS - MOULD GROWTH (Endorsed by AENOR in December of 1997.) | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-16: TESTS - MOULD GROWTH | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-17: TESTS - COLD (Endorsed by AENOR in December of 1997.) | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-17: TESTS - COLD | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-19: TESTS - DAMP HEAT (STEADY STATE) (Endorsed by AENOR in December of 1997.) | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-19: TESTS - DAMP HEAT (STEADY STATE). | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-1: TESTS. VIBRATION (SINUSOIDAL). (Endorsed by AENOR in December of 1997.) | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-2: TESTS. MATING DURABILITY. (Endorsed by AENOR in December of 1997.) | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS - BASIC TEST AND MESUREMENT PROCEDURES. PART 2-11: TESTS - AXIAL COMPRESSION (Endorsed by AENOR in December of 1997.) | |
| Fibre optic interconnecting devices and passive components - Fibre optic isolators - Part 1: Generic specification (Endorsed by Asociación Española de Normalización in June of 2017.) | |
| Fibre optic interconnecting devices and passive components - Fibre optic isolators - Part 1: Generic specification | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS. BASIC TEST AND MEASUREMENT PROCEDURES. PART 1: GENERAL AND GUIDANCE. (Endorsed by AENOR in December of 1997.) | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS. BASIC TEST AND MEASUREMENT PROCEDURES. PART 1: GENERAL AND GUIDANCE. | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS. BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-10: TESTS. CRUSH RESISTANCE. | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS. BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-11: TESTS. AXIAL COMPRESSION. | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS. BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-12: TEST. IMPACT. | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS. BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-14: TESTS. MAXIMUM IMPUT POWER. (Endorsed by AENOR in November of 1997.) | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS. BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-14: TESTS. MAXIMUM IMPUT POWER. | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS. BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-15: TESTS. TORQUE STRENGTH OF COUPLING MECHANISM. | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS. BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-1: TESTS. VIBRATION (SINUSOIDAL). | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS. BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-20: TESTS. CLIMATIC SEQUENCE. | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS. BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-21: TESTS. COMPOSITE TEMPERATURE-HUMIDITY CYCLIC TEST. (Endorsed by AENOR in December of 1997.) | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS. BASIC TEST AND MEASUREMENT PROCEDURES. PART 2-21: TESTS. COMPOSITE TEMPERATURE-HUMIDITY CYCLIC TEST. | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS. BASIC TESTAND MEASUREMENT PROCEDURES. PART 2-18: TESTS- DRY HEAT - HIGH TEMPERATURE ENDURANCE (Endorsed by AENOR in December of 1997.) | |
| FIBRE OPTIC INTERCONNECTING DEVICES AND PASSIVE COMPONENTS. BASIC TESTAND MEASUREMENT PROCEDURES. PART 2-18: TESTS. DRY HEAT. HIGH TEMPERATURE ENDURANCE. | |
| Fibre optic isolators -- Part 1: Generic specification (Endorsed by AENOR in November of 2000.) | |
| Fibre optic terminus sets - Part 1-1: Blank detail specification | |
| Fibre optic terminus sets - Part 1: Generic specification | |
| Fibre-optic communication subsystem test procedures - Part 4-2: Installed cable plant - Single-mode attenuation and optical return loss measurement (Endorsed by AENOR in November of 2014.) | |
| Fibre-optic communication subsystem test procedures -- Part 4-1: Cable plant and links - Multimode fibre-optic cable plant attenuation measurement (Endorsed by AENOR in September of 2004.) | |
| Fluorescent ultraviolet lamps used for tanning - Measurement and specification method | |
| Gas analyzers - Expression of performance - Part 3: Paramagnetic oxygen analyzers | |
| Gas analyzers - Expression of performance -- Part 3: Paramagnetic oxygen analyzers. (Endorsed by AENOR in May of 2001.) | |
| GAS-INSULATED METAL-ENCLOSED SWITCHGEAR FOR RATED VOLTAGES OF 72,5 KV AND ABOVE. REQUIREMENTS FOR SWITCHING OF BUS-CHARGING CURRENTS BY DISCONNECTORS. | |
| Household electric heating pads - Methods for measuring performance | |
| INDUSTRIAL RIGID ROUND LAMINATED TUBES AND RODS BASED ON THERMOSETTING RESINS FOR ELECTRICAL PURPOSES. PART 1: GENERAL REQUIREMENTS. | |
| INDUSTRIAL RIGID ROUND LAMINATED TUBES AND RODS BASED ON THERMOSETTING RESINS FOR ELECTRICAL PURPOSES. PART 2: METHODS OF TEST. | |
| INDUSTRIAL RIGID ROUND LAMINATED TUBES AND RODS BASED ON THERMOSETTING RESINS FOR ELECTRICAL PURPOSES. PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS. SHEET 1: ROUND LAMINATED ROLLED TUBES. | |
| INDUSTRIAL RIGID ROUND LAMINATED TUBES AND RODS BASED ON THERMOSETTING RESINS FOR ELECTRICAL PURPOSES. PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS. SHEET 2: ROUND LAMINATED MOULDED TUBES. | |
| INDUSTRIAL RIGID ROUND LAMINATED TUBES AND RODS BASED ON THERMOSETTING RESINS FOR ELECTRICAL PURPOSES. PART 3: SPECIFICATIONS FOR INDIVIDUAL MATERIALS. SHEET 3: ROUND LAMINATED MOULDED RODS. | |
| Industrial-process control - Safety of analyser houses (Endorsed by AENOR in April of 2005.) | |
| Industrial-process control - Safety of analyzer houses (Endorsed by AENOR in May of 2015.) | |
| INDUSTRIAL-PROCESS CONTROL SYSTEMS. CLASSIFICATION OF ADAPTIVE CONTROLLERS FOR THE PURPOSE OF EVALUATION. (Endorsed by AENOR in May of 1996.) | |
| INDUSTRIAL-PROCESS CONTROL. SAFETY OF ANALYSER HOUSES. | |
| Information technology - Coded graphic character set for use in the preparation of documents used in electrotechnology and for information interchange | |
| INFORMATION TECHNOLOGY. CODED GRAPHIC CHARACTER SET FOR USE IN THE PREARATION OF DOCUMENTS USED IN ELECTROTECHNOLOGY AND FOR INFORMATION INTERCHANGE. | |
| INSULATING LIQUIDS. LINEAR FLAME PROPAGATION. TEST METHOD USING A GLASS-FIBRE TAPE. | |
| Insulating materials - Industrial rigid round laminated tubes and rods based on thermosetting resins for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: Round laminated rolled... | |
| Insulating materials - Industrial rigid round laminated tubes and rods based on thermosetting resins for electrical purposes - Part 3: Specifications for individual materials - Sheet 2: Round laminated moulded... | |
| Insulating materials - Industrial rigid round laminated tubes and rods based on thermosetting resins for electrical purposes -- Part 2: Methods of test (IEC 61212-2:2006). (Endorsed by AENOR in April... | |
| Insulating materials - Industrial rigid round laminated tubes and rods based on thermosetting resins for electrical purposes -- Part 3: Specifications for individual materials -- Sheet 3: Round laminated moulded... | |
| Insulating materials-Industrial rigid round laminated tubes and rods based on thermosetting resins for electrical purposes-Part1: Definitions, designations and general requirements (IEC 61212-1:2006) (Endorsed by AENOR in November of 2006.) | |
| Insulators of ceramic material or glass for overhead lines with a nominal voltage greater than 1 000 V - Impulse puncture testing in air | |
| International lamp coding system (ILCOS) | |
| Live working - Portable equipment for earthing or earthing and short-circuiting | |
| Live working - Saddles, stick clamps and their accessories | |
| Live working - Voltage detectors - Part 1: Capacitive type to be used for voltages exceeding 1 kV a.c. | |
| Live working - Voltage detectors - Part 3: Two-pole low-voltage type | |
| Live working - Voltage detectors - Part 5: Voltage detecting systems (VDS) | |
| Live working - Voltage detectors -- Part 1: Capacitive type to be used for voltages exceeding 1 kV a.c. and up to 52 kV. | |
| Live working - Voltage detectors -- Part 2: Resistive type to be used for voltages of 1 kV to 36 kV a.c. | |
| Live working - Voltage detectors -- Part 2: Resistive type to be used for voltages of 1 kV to 36 kV a.c | |
| Live working - Voltage detectors -- Part 3: Two-pole low-voltage type. | |
| LIVE WORKING. EARTHING OR EARTHING AND SHORT-CIRCUITING EQUIPMENT USING LANCES AS A SHORT-CIRCUIT DEVICE. LANCE EARTHING. (Endorsed by AENOR in November of 1995.) | |
| LIVE WORKING. EARTHING OR EARTHING AND SHORT-CIRCUITING EQUIPMENT USING LANCES AS A SHORT-CIRCUITING DEVICE. LANCE EARTHING. | |
| LIVE WORKING. INSULATING HOLLOW TUBES FOR ELECTRICAL PURPOSES. | |
| Live working. Portable equipment for earthing or earthing and short-circuiting. | |
| LIVE WORKING. VOLTAGE DETECTORS. PART 1: CAPACITIVE TYPE TO BE USED FOR VOLTAGES EXCEEDING 1 KV A.C. AND UP TO 52 KV. | |
| LIVE WORKING. VOLTAGE DETECTORS. PART 1: CAPACITIVE TYPE TO BE USED FOR VOLTAGES EXCEEDING 1 KV A.C. | |
| LIVE WORKING. VOLTAGE DETECTORS. PART 2: RESISTIVE TYPE TO BE USED FOR VOLTAGES OF 1 kV TO 36 kV A.C. | |
| Low voltage power supplies, d.c. output - Part 3: Electromagnetic compatibility (EMC) | |
| Low voltage power supplies, d.c. output - Part 7: Safety requirements | |
| Low-voltage power supplies, DC output -- Part 6: Requirements for low-voltage power supplies of assessed performance. | |
| Low-voltage power supply devices, d.c. output - Performance characteristics. | |
| LOW-VOLTAGE POWER SUPPLY DEVICES, D.C. OUTPUT. PERFORMANCE CHARACTERISTICS AND SAFETY REQUIREMENTS. | |
| MAGNETIC OXIDE CORES (ETD-CORES) INTENDED FOR USE IN POWER SUPPLY APPLICATIONS. DIMENSIONS. (Endorsed by AENOR in November of 1997.) | |
| MARITIME NAVIGATION AND RADIOCOMUNNICATION EQUIPMENT AND SYSTEMS - INTEGRATED BRIDGE SYSTEMS (IBS) OPERATIONAL AND PERFORMANCE REQUIREMENTS, METHODS OF TESTING AND REQUIRED TEST RESULTS. (Endorsed by AENOR in November of 2001.)... | |
| Marking of electrical equipment with ratings related to electrical supply - Safety requirements. | |
| MARKING OF ELECTRICAL EQUIPMENT WITH RATINGS RELATED TO ELECTRICAL SUPPLY. SAFETY REQUIREMENTS. (Endorsed by AENOR in November of 1995.) | |
| Materials for interconnecting structures -- Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability. (Endorsed by... | |
| Materials for interconnection structures -- Part 8: Sectional specification set for non-conductive films and coatings -- Section 8: Temporary polymer coatings. | |
| MATERIALS FOR INTERCONNECTION STRUCTURES. PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH AND WITHOUT COATINGS. SECTION 1: COPPER FOILS (FOR THE MANUFACTURE OF COPPER-CLAD BASE MATERIALS). | |
| MATERIALS FOR INTERCONNECTION STRUCTURES. PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS. SECTION 4: CONDUCTIVE INKS. | |
| MATERIALS FOR INTERCONNECTION STRUCTURES. PART 7: SECTIONAL SPECIFICATION SET FOR RESTRAINING CORE MATERIALS. SECTION 1: COPPER/INVAR/COPPER. | |
| MATERIALS FOR INTERCONNECTION STRUCTURES. PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS. SECTION 7: MARKING LEGEND INKS. | |
| Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazin e modified with non-halogenated epoxide woven glass laminate sheets of defined... | |
| Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical... | |
| Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability... | |
| Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical... | |
| Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical... | |
| Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning... | |
| Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass... | |
| Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Hich performance non-halogenated epoxide woven... | |
| Materials for printed boards and other interconnecting structures -- Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets... | |
| Materials for printed boards and other interconnecting structures -- Part 2-10: Reinforced base materials, clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets... | |
| Materials for printed boards and other interconnecting structures -- Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of... | |
| Materials for printed boards and other interconnecting structures -- Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad. | |
| Materials for printed boards and other interconnecting structures -- Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability,... | |
| Materials for printed boards and other interconnecting structures -- Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test),... | |
| Materials for printed boards and other interconnecting structures -- Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforce d laminated sheets of defined flammability (vertical burning... | |
| Materials for printed boards and other interconnecting structures -- Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad (Endorsed by AENOR... | |
| Materials for printed boards and other interconnecting structures -- Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning... | |
| Materials for printed boards and other interconnecting structures -- Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning... | |
| Materials for printed boards and other interconnecting structures -- Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad (Endorsed by... | |
| Materials for printed boards and other interconnecting structures -- Part 2-26: Reinforced base materials, clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning... | |
| Materials for printed boards and other interconnecting structures -- Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminate sheets, high electrical grade, copper-clad (Endorsed by... | |
| Materials for printed boards and other interconnecting structures -- Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test),... | |
| Materials for printed boards and other interconnecting structures -- Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad... | |
| Materials for printed boards and other interconnecting structures -- Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning... | |
| Materials for printed boards and other interconnecting structures -- Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test),... | |
| Materials for printed boards and other interconnecting structures -- Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical... | |
| Materials for printed boards and other interconnecting structures -- Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability... | |
| Materials for printed boards and other interconnecting structures -- Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad. | |
| Materials for printed boards and other interconnecting structures -- Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core / woven E-glass reinforced surfaces laminated... | |
| Materials for printed boards and other interconnecting structures -- Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning... | |
| Materials for printed boards and other interconnecting structures -- Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad... | |
| Materials for printed boards and other interconnecting structures -- Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical... | |
| Materials for printed boards and other interconnecting structures -- Part 2-9: Reinforced base materials clad and unclad - Bismaleimide/triazin e, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of... | |
| Materials for printed boards and other interconnecting structures -- Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible... | |
| Materials for printed boards and other interconnecting structures -- Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability (Endorsed by AENOR... | |
| Materials for printed boards and other interconnecting structures -- Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability (Endorsed by... | |
| Materials for printed boards and other interconnecting structures -- Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of... | |
| Materials for printed boards and other interconnecting structures -- Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg... | |
| Materials for printed boards and other interconnecting structures -- Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass... | |
| Materials for printed boards and other interconnecting structures -- Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg... | |
| Materials for printed boards and other interconnecting structures -- Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability (Endorsed by AENOR... | |
| Materials for printed boards and other interconnecting structures -- Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability (Endorsed... | |
| MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-4: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). ADHESIVE COATED FLEXIBLE POLYIMIDE FILM... | |
| MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES. PART 3-5: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS). TRANSFER ADHESIVE FILMS. | |
| Medical diagnostic X-ray equipment - Radiation conditions for use in the determination of characteristics (IEC 61267:2005) | |
| MEDICAL DIAGNOSTIC X-RAY EQUIPMENT. RADIATION CONDITIONS FOR USE IN THE DETERMINATION OF CHARACTERISTICS. | |
| MEDICAL ELECTRICAL EQUIPMENT. CHARACTERISTICS OF ELECTRO-OPTICAL X-RAY IMAGE INTENSIFIERS. PART 1: DETERMINATION OF THE ENTRANCE FIELD SIZE. | |
| MEDICAL ELECTRICAL EQUIPMENT. CHARACTERISTICS OF ELECTRO-OPTICAL X-RAY IMAGE INTENSIFIERS. PART 2: DETERMINATION OF THE CONVERSION FACTOR. | |
| MEDICAL ELECTRICAL EQUIPMENT. CHARACTERISTICS OF ELECTRO-OPTICAL X-RAY IMAGE INTENSIFIERS. PART 3: DETERMINATION OF THE LUMINANCE DISTRIBUTION AND LUMINANCE NON-UNIFORMITY. | |
| MEDICAL ELECTRICAL EQUIPMENT. CHARACTERISTICS OF ELECTRO-OPTICAL X-RAY IMAGE INTENSIFIERS. PART 4: DETERMINATION OF THE IMAGE DISTORTION. | |
| MEDICAL ELECTRICAL EQUIPMENT. CHARACTERISTICS OF ELECTRO-OPTICAL X-RAY IMAGE INTENSIFIERS. PART 5: DETERMINATION OF THE DETECTIVE QUANTUM EFFICIENCY. | |
| MEDICAL ELECTRICAL EQUIPMENT. CHARACTERISTICS OF ELECTRO-OPTICAL X-RAY IMAGE INTENSIFIERS. PART 6: DETERMINATION OF THE CONTRAST RATIO AND VEILING GLARE INDEX. | |
| MEDICAL ELECTRICAL EQUIPMENT. CHARACTERISTICS OF ELECTRO-OPTICAL X-RAY IMAGE INTENSIFIERS. PART 7: DETERMINATION OF THE MODULATION TRANSFER FUNCTION. | |
| METHOD OF MEASURING AND SPECIFYING THE UV-RADIATION OF ULTRAVIOLET LAMPS USED FOR SUN-TANNING (Endorsed by AENOR in November of 1997.) | |
| METHOD OF MEASURING AND SPECIFYING THE UV-RADIATION OF ULTRAVIOLET LAMPS USED FOR SUN-TANNING. (Endorsed by AENOR in May of 1996.) | |
| METHOD OF TEST FOR THE HYDROSTATIC STABILITY OF ELECTRICAL INSULATING MATERIALS. PART 1: PLASTIC FILMS. (Endorsed by AENOR in November of 1995.) | |
| METHODS OF MEASURMENT FOR BROADCAST VIDEO TAPE RECORDERS. PART 3: ELECTRICAL MEASUREMENTS FOR ANALOGUE COMPONENT VIDEO SIGNALS. | |
| MINERAL INSULATING OILS. METHOD FOR THE DETERMINATION OF 2-FURFURAL AND RELATED COMPOUNDS. | |
| Nuclear power plants - Control rooms - Operator controls (Endorsed by AENOR in May of 2016.) | |
| Nuclear power plants - Instrumentation and control important to safety - Classification of instrumentation and control functions (Endorsed by AENOR in June of 2010.) | |
| Optical amplifier specifications -- Part 4: Multichannel applications - Performance specification template (Endorsed by AENOR in February of 2009.) | |
| Optical amplifier test methods -- Part 11-1: Polarization mode dispersion - Jones matrix eigenanalysis method (JME) (Endorsed by AENOR in July of 2003.) | |
| Optical amplifier test methods -- Part 3-2: Noise figure parameters - Electrical spectrum analyzer method (Endorsed by AENOR in February of 2009.) | |
| Optical amplifiers - Part 1: Generic specification (Endorsed by AENOR in October of 2012.) | |
| Optical amplifiers - Part 2: Digital applications - Performance specification template (Endorsed by AENOR in June of 2012.) | |
| Optical amplifiers - Part 2: Single channel applications - Performance specification template (Endorsed by AENOR in July of 2016.) | |
| Optical amplifiers - Part 4: Multichannel applications - Performance specification template (Endorsed by AENOR in May of 2012.) | |
| Optical amplifiers - Part 5-2: Qualification specifications - Reliability qualification for optical fibre amplifiers (Endorsed by Asociación Española de Normalización in August of 2019.) | |
| Optical amplifiers - Part 5-2: Qualification specifications - Reliability qualification for optical fibre amplifiers (Endorsed by Asociación Española de Normalización in July of 2017.) | |
| Optical amplifiers - Part 5-2: Qualification specifications - Reliability qualification for optical fibre amplifiers | |
| Optical amplifiers - Test methods - Part 1-1: Power and gain parameters - Optical spectrum analyzer method (Endorsed by AENOR in August of 2015.) | |
| Optical amplifiers - Test methods - Part 1-1: Power and gain parameters - Optical spectrum analyzer method | |
| Optical amplifiers - Test methods - Part 1-3: Power and gain parameters - Optical power meter method (Endorsed by AENOR in August of 2015.) | |
| Optical amplifiers - Test methods - Part 1-3: Power and gain parameters - Optical power meter method | |
| Optical amplifiers - Test methods - Part 10-2: Multichannel parameters - Pulse method using a gated optical spectrum analyzer (Endorsed by AENOR in May of 2008.) | |
| Optical amplifiers - Test methods - Part 10-5: Multichannel parameters - Distributed Raman amplifier gain and noise figure (Endorsed by AENOR in October of 2014.) | |
| Optical amplifiers - Test methods - Part 1: Power and gain parameters (Endorsed by AENOR in March of 2015.) | |
| Optical amplifiers - Test methods - Part 3-3: Noise figure parameters - Signal power to total ASE power ratio (Endorsed by AENOR in March of 2014.) | |
| Optical amplifiers - Test methods - Part 4-1: Gain transient parameters - Two-wavelength method (Endorsed by AENOR in January of 2012.) | |
| Optical amplifiers - Test methods - Part 4-1: Gain transient parameters - Two-wavelength method (Endorsed by Asociación Española de Normalización in February of 2017.) | |
| Optical amplifiers - Test methods - Part 4-2: Gain transient parameters - Broadband source method (Endorsed by AENOR in January of 2012.) | |
| Optical amplifiers - Test methods - Part 4-3: Power transient parameters - Single channel optical amplifiers in output power control (Endorsed by AENOR in January of 2016.) | |
| Optical amplifiers - Test methods -- Part 1-2: Power and gain parameters - Electrical spectrum analyzer method (Endorsed by AENOR in March of 2006.) | |
| Optical amplifiers - Test methods -- Part 10-1: Multichannel parameters - Pulse method using an optical switch and optical spectrum analyzer (Endorsed by AENOR in July of 2009.) | |
| Optical amplifiers - Test methods -- Part 10-1: Multichannel parameters - Pulse method using an optical switch and optical spectrum analyzer (Endorsed by AENOR in November of 2003.) | |
| Optical amplifiers - Test methods -- Part 10-3: Multichannel parameters - Probe methods (Endorsed by AENOR in November of 2003.) | |
| Optical amplifiers - Test methods -- Part 10-4: Multichannel parameters - Interpolated source subtraction method using an optical spectrum analyzer (IEC 61290-10-4:2007). (Endorsed by AENOR in November of 2007.) | |
| Optical amplifiers - Test methods -- Part 11-1: Polarization mode dispersion parameter - Jones matrix eigenanalysis (JME) (Endorsed by AENOR in December of 2008.) | |
| Optical amplifiers - Test methods -- Part 11-2: Polarization mode dispersion parameter - Poincaré sphere analysis method (Endorsed by AENOR in September of 2005.) | |
| Optical amplifiers - Test methods -- Part 3-1: Noise figure parameters - Optical spectrum analyzer method (Endorsed by AENOR in April of 2004.) | |
| Optical amplifiers - Test methods -- Part 3: Noise figure parameters (Endorsed by AENOR in February of 2009.) | |
| Optical amplifiers - Test methods -- Part 5-1: Reflectance parameters - Optical spectrum analyzer method (IEC 61290-5-1:2006). (Endorsed by AENOR in October of 2006.) | |
| Optical amplifiers - Test methods -- Part 5-2: Reflectance parameters - Electrical spectrum analyser method (Endorsed by AENOR in September of 2004.) | |
| Optical amplifiers - Test methods -- Part 7-1: Out-of-band insertion losses - Filtered optical power meter method (IEC 61290-7-1:2007). (Endorsed by AENOR in October of 2007.) | |
| Optical amplifiers - Test methods. Part 10-2: Multichannel parameters - Pulse mehod using a gated optical spectrum analyzer (Endorsed by AENOR in November of 2003.) | |
| Optical amplifiers -- Part 1: Generic specification (IEC 61291-1:2006). (Endorsed by AENOR in March of 2007.) | |
| Optical amplifiers -- Part 2: Digital applications - Performance specification template (IEC 61291-2:2007). (Endorsed by AENOR in October of 2007.) | |
| Optical amplifiers -- Part 3-2: Test methods for noise figure parameters - Electrical spectrum analyzer method. (Endorsed by AENOR in May of 2003.) | |
| Optical amplifiers -- Part 4: Multichannel applications - Performance specification template (Endorsed by AENOR in September of 2003.) | |
| Optical fibre amplifiers - Basic specification -- Part 3: Test methods for noise figure parameters (Endorsed by AENOR in December of 2000.) | |
| Optical fibre amplifiers - Basic specification -- Part 5-1: Test methods for reflectance parameters - Optical spectrum analyser (Endorsed by AENOR in December of 2000.) | |
| Optical fibre amplifiers - Basic specification -- Part 5-3: Test methods for reflectance parameters - Reflectance tolerance using an electrical spectrum analyser. (Endorsed by AENOR in October of 2002.) | |
| Optical fibre amplifiers -- Part 2: Digital applications - Performance specification template. (Endorsed by AENOR in March of 2001.) | |
| OPTICAL FIBRE AMPLIFIERS. BASIC SPECIFICATION. PART 1-1: TEST METHODS FOR GAIN PARAMETERS. OPTICAL SPECTRUM ANALYZER (Endorsed by AENOR in November of 1998.) | |
| OPTICAL FIBRE AMPLIFIERS. BASIC SPECIFICATION. PART 1-3: TEST METHODS FOR GAIN PARAMETERS. OPTICAL POWER METER (Endorsed by AENOR in November of 1998.) | |
| OPTICAL FIBRE AMPLIFIERS. BASIC SPECIFICATION. PART 2-1: TEST METHODS FOR OPTICAL POWER PARAMETERS. OPTICAL SPECTRUM ANALYZER. (Endorsed by AENOR in November of 1998.) | |
| OPTICAL FIBRE AMPLIFIERS. BASIC SPECIFICATION. PART 2-3: TEST METHODS FOR OPTICAL POWER PARAMETERS. OPTICAL POWER METER (Endorsed by AENOR in November of 1998.) | |
| OPTICAL FIBRE AMPLIFIERS. BASIC SPECIFICATION. PART 6-1: TEST METHODS FOR PUMP LEAKAGE PARAMETERS. OPTICAL DEMULTIPLEXER (Endorsed by AENOR in November of 1998.) | |
| OPTICAL FIBRE AMPLIFIERS. BASIC SPECIFICATION. PART 7-1: TEST METHODS FOR OUT-OF-BAND INSERTION LOSSES. FILTERED OPTICAL POWER METER. (Endorsed by AENOR in November of 1998.) | |
| OPTICAL FIBRE AMPLIFIERS. BASIC SPECIFICATIONS. PART 2-2: TEST METHODSFOR OPTICAL POWER PARAMETERS. ELECTRICAL SPECTRUM ANALYZER (Endorsed by AENOR in November of 1998.) | |
| OPTICAL FIBRE AMPLIFIERS. BASIS SPECIFICATION. PART 1-2: TEST METHODS FOR GAIN PARAMETERS. ELECTRICAL SPECTRUM ANALYZER (Endorsed by AENOR in November of 1998.) | |
| OPTICAL FIBRE AMPLIFIERS. PART 1:GENERIC SPECIFICATION (Endorsed by AENOR in October of 1998.) | |
| Opticial amplifiers -- Part 6-1: Interfaces - Command set (Endorsed by AENOR in February of 2009.) | |
| OVERHEAD LINES. REQUIREMENTS AND TESTS FOR FITTINGS. | |
| Petroleum products and lubricants - Triaryl phosphate ester turbine control fluids (category ISO-L-TCD) - Specifications | |
| PETROLEUM PRODUCTS AND LUBRICANTS. TRIARYL PHOSPHATE ESTER TURBINE CONTROL FLUIDS (CATEGORY ISO-L-TCD). SPECIFICATIONS. | |
| Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules (Endorsed by AENOR in November of 2012.) | |
| Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules (Endorsed by Asociación Española de Normalización in March of 2017.) | |
| PIEZOELECTRIC DEVICES. PREPARATION OF OUTLINE DRAWINGS OF SURFACE-MOUNTED DEVICES (SMD) FOR FRECUENCY CONTROL AND SELECTION. GENERAL RULES (Endorsed by AENOR in December of 1997.) | |
| PM-cores made of magnetic oxides and associated parts - Dimensions | |
| Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (Endorsed by AENOR in October of 2013.)... | |
| Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies | |
| Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by AENOR in November of 2013.) | |
| Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2019.) | |
| Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in November of 2017.) | |
| Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies | |
| Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.) | |
| Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies | |
| Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2017.) | |
| Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies | |
| Printed board assemblies -- Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (Endorsed by AENOR in August of 2010.) | |
| Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description (Endorsed by AENOR in August of... | |
| Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies | |
| Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance | |
| Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements | |
| Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides (Endorsed by AENOR in March of... | |
| Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (Endorsed by AENOR in March of... | |
| Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides (Endorsed by AENOR in March of... | |
| Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (Endorsed by AENOR in July of... | |
| Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (Endorsed by Asociación Española de Normalización in August of... | |
| Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction | |
| Printed boards and printed board assemblies - Design and use -- Part 5-2: Attachment (land/joint) considerations - Discrete components (Endorsed by AENOR in January of 2004.) | |
| Printed boards and printed board assemblies - Design and use -- Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides (Endorsed by AENOR in July of... | |
| PRINTED BOARDS. ELECTRONIC DATA DESCRIPTION AND TRANSFER. PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM. | |
| PROCESS MEASUREMENT AND CONTROL DEVICES - GENERAL METHODS AND PROCEDURES FOR EVALUATING PERFORMANCE - PART 3: TESTS FOR THE EFFECTS OF INFLUENCE QUANTITIES (Endorsed by AENOR in July of 1998.)... | |
| Process measurement and control devices - General methods and procedures for evaluating performance -- Part 1: General considerations (Endorsed by AENOR in March of 2009.) | |
| Process measurement and control devices - General methods and procedures for evaluating performance -- Part 2: Tests under reference conditions (Endorsed by AENOR in March of 2009.) | |
| Process measurement and control devices - General methods and procedures for evaluating performance -- Part 3: Tests for the effects of influence quantities (Endorsed by AENOR in March of 2009.)... | |
| Process measurement and control devices - General methods and procedures for evaluating performance -- Part 4: Evaluation report content (Endorsed by AENOR in March of 2009.) | |
| PROCESS MEASUREMENT AND CONTROL DEVICES. GENERAL METHODS AND PROCEDURES FOR EVALUATING PERFORMANCE. PART 1: GENERAL CONSIDERATIONS. (Endorsed by AENOR in May of 1996.) | |
| PROCESS MEASUREMENT AND CONTROL DEVICES. GENERAL METHODS AND PROCEDURES FOR EVALUATING PERFORMANCE. PART 2: TESTS UNDER REFERENCE CONDITIONS. (Endorsed by AENOR in May of 1996.) | |
| PROCESS MEASUREMENT AND CONTROL DEVICES. GENERAL METHODS AND PROCEDURES FOR EVALUATING PERFORMANCE. PART 4: EVALUATION REPORT CONTENT. (Endorsed by AENOR in May of 1996.) | |
| Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (Endorsed by AENOR in June of 2013.) | |
| Quality assessment systems -- Part 1: Registration and analysis of defects on printed board assemblies (Endorsed by AENOR in July of 2002.) | |
| Quality assessment systems -- Part 2: Selection and use of sampling plans for inspection of electronic components and packages (IEC 61193-2:2007). (Endorsed by AENOR in March of 2008.) | |
| Radio frequency cables -- Part 3-2: Coaxial cables for digital communication in horizontal floor wiring - Detail specification for coaxial cables with solid dielectric for local area networks of 185... | |
| Radio frequency cables -- Part 3-3: Coaxial cables for digital communication in horizontal floor wiring - Detail specification for coaxial cables with foamed dielectric for local area networks of 185... | |
| RADIO FREQUENCY CABLES -- PART 3: SECTIONAL SPECIFICATION FOR COAXIAL CABLES FOR LOCAL AREA NETWORKS (Endorsed by AENOR in February of 1999.) | |
| Radio frequency cables -- Part 3: Sectional specification for coaxial cables for local area networks. | |
| RADIO FREQUENCY CABLES. PART 3-2:COAXIAL CABLES FOR DIGITAL COMMUNICATION IN HORIZONTAL FLOOR WIRING. DETAIL SPECIFICATION FOR COAXIAL CABLES WITH SOLID DIELECTRIC FOR LOCAL AREA NETWORKS OF 185 M REACH AND... | |
| RADIO FREQUENCY CABLES. PART 3-3: COAXIAL CABLES FOR DIGITAL COMMUNICATION IN HORIZONTAL FLOOR WIRING. DETAIL SPECIFICATION FOR COAXIAL CABLES WITH FOAMED DIELECTRIC FOR LOCAL AREA NETWORKS OF 185 M REACH... | |
| Radio-frequency cables - Part 2: Sectional specification for semi-rigid radio-frequency and coaxial cables with polytetrafluoroethyl ene (PTFE) insulation | |
| Radio-frequency cables - Specifications -- Part 2: Semi-rigid radio-frequency and coaxial cables with polytetrafluoroethyl ene (PTFE) insulation - Sectional specification. | |
| RADIO-FREQUENCY CABLES. SPECIFICATIONS. PART 2: SEMI-RIGID RADIO-FREQUENCY AND COAXIAL CABLES WITH POLYTETRAFLUOROETHYL ENE (PTFE) INSULATION. SECTIONAL SPECIFICATION. (Endorsed by AENOR in November of 1995.) | |
| Radiotherapy equipment - Coordinates, movements and scales (Endorsed by AENOR in June of 2012.) | |
| Radiotherapy equipment - Coordinates, movements and scales. | |
| Radiotherapy equipment- Coordinates, movements and scales | |
| RADIOTHERAPY EQUIPMENT. COORDINATES, MOVEMENTS AND SCALES | |
| Railway applications - Power converters installed on board rolling stock - Part 1: Characteristics and test methods | |
| Railway applications - Power convertors installed on board rolling stock - Part 1: Characteristics and test methods | |
| RIGID PROTECTIVE COVERS FOR LIVE WORKING ON A.C. INSTALLATIONS. | |
| SADDLES, POLE CLAMPS (STICK CLAMPS) AND ACCESSORIES FOR LIVE WORKING. | |
| Single-capped fluorescent lamps - Safety specifications. | |
| Single-capped fluorescent lamps - Safety specifications | |
| SINGLE-CAPPED FLUORESCENT LAMPS. SAFETY SPECIFICATIONS. | |
| SINGLE-CAPPED FLUORESCENT LAMPS. SAFETY SPECIFICATIONS | |
| SYNTHETIC ORGANIC ESTERS FOR ELECTRICAL PURPOSES. GUIDE FOR MAINTENANCE OF TRANSFORMER ESTERS IN EQUIPMENT. | |
| Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 1-1: Special requirements for testing of crystalline silicon photovoltaic (PV) modules | |
| Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 1-2: Special requirements for testing of thin-film Cadmium Telluride (CdTe) based photovoltaic (PV) modules | |
| Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 1-3: Special requirements for testing of thin-film amorphous silicon based photovoltaic (PV) modules | |
| Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 1-4: Special requirements for testing of thin-film Cu(In,GA)(S,Se)2 based photovoltaic (PV) modules | |
| Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 1: Test requirements | |
| Terrestrial photovoltaic (PV) modules - Design qualification and type approval - Part 2: Test procedures | |
| Terrestrial photovoltaic (PV) power generating systems - General and guide. | |
| Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies | |
| Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies | |
| Test methods for electrical materials, interconnection structures and assemblies -- Part 1: General test methods and methodology. (Endorsed by AENOR in March of 2002.) | |
| TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES. PART 1: GENERAL TEST METHODS AND METHODOLOGY (Endorsed by AENOR in November of 1997.) | |
| TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES. PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES (Endorsed by AENOR in November of 1997.) | |
| TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES. PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES. CORRIGENDUM. (Endorsed by AENOR in June of 1999.) | |
| TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES. PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) (Endorsed by AENOR in November of 1997.) | |
| TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES. PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) (Endorsed by AENOR in November of 1999.) | |
| Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of... | |
| Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (Endorsed by AENOR... | |
| Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500... | |
| Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss... | |
| Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH)... | |
| Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (Endorsed... | |
| Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies... | |
| Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies... | |
| Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed... | |
| Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures (Endorsed by AENOR in November of 2000.)... | |
| Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006). (Endorsed by AENOR in January... | |
| Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards) (Endorsed by AENOR in May of 2008.)... | |
| Transformers and inductors for use in electronic and telecommunication equipment - Part 1: Generic specification | |
| Transformers and inductors for use in electronic and telecommunication equipment - Part 2: Sectional specification for signal transformers on the basis of the capability approval procedure | |
| Transformers and inductors for use in electronic and telecommunication equipment - Part 3: Sectional specification for power transformers on the basis of the capability approval procedure | |
| Transformers and inductors for use in electronic and telecommunication equipment - Part 4: Sectional specification for power transformers for switched mode power supplies (SMPS) on the basis of the capability... | |
| Transformers and inductors for use in electronic and telecommunication equipment - Part 5: Sectional specification for pulse transformers on the basis of the capability approval procedure | |
| Transformers and inductors for use in electronic and telecommunication equipment - Part 6: Sectional specification for inductors on the basis of the capability approval procedure | |
| Transformers and inductors for use in electronic and telecommunication equipment - Part 7: Sectional specification for high-frequency inductors and intermediate frequency transformers on the basis of the capability approval procedure... | |
| Ultrasonics - Dental descaler systems - Measurement and declaration of the output characteristics | |
| ULTRASONICS. CONTINUOUS-WAVE DOPPLER SYSTEMS. TEST PROCEDURES. | |
| ULTRASONICS. FIELDS. GUIDANCE FOR THE MEASUREMENT AND CHARACTERIZATION OF ULTRASONIC FIELDS GENERATED BY MEDICAL ULTRASONIC EQUIPMENT USING HYDROPHONES IN THE FREQUENCY RANGE 0,5 MHZ TO 15 MHZ. | |
| ULTRASONICS. HAND-HELD PROBE DOPPLER FOETAL HEARTBEAT DETECTORS. PERFORMANCE REQUIREMENTS AND METHODS OF MEASUREMENT AND REPORTING. | |
| Workmanship requirements for soldered electronic assemblies - Part 1: General | |
| Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies | |
| Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies | |
| Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies | |
| Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies |
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