Hernon Manufacturing, Inc. Formulations - Applications - Bonding - Tuffbond 305 3305AB22

Description
Tuffbond® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 305 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
Datasheet
Description
Tuffbond® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 305 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Formulations - Applications - Bonding - Tuffbond 305 - 3305AB22 - Hernon Manufacturing, Inc.
Sanford, FL, United States
Formulations - Applications - Bonding - Tuffbond 305
3305AB22
Formulations - Applications - Bonding - Tuffbond 305 3305AB22
Tuffbond® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 305 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.

Tuffbond® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond® 305 is also recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.

Supplier's Site Datasheet

Technical Specifications

  Hernon Manufacturing, Inc.
Product Category Industrial Adhesives
Product Number 3305AB22
Product Name Formulations - Applications - Bonding - Tuffbond 305
Chemical System Ceramic; Epoxy
Unlock Full Specs
to access all available technical data

Similar Products

Formulations - Applications - Bonding - Grenade Igniter Case Sealant 47422 - 34742230 - Hernon Manufacturing, Inc.
Specs
Cure / Technology Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
Features Sealant
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Formulations - Applications - Threadlocking - Nuts N' Bolts 431 - 343101 - Hernon Manufacturing, Inc.
Specs
Cure / Technology Thermoset
Features Threadlocker or Retainer
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Formulations - Applications - Bonding - ReAct 767 - 376730 - Hernon Manufacturing, Inc.
Specs
Chemical System Ceramic; Acrylic
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Formulations - Applications - Sealing - Dripstop 946 - 394660 - Hernon Manufacturing, Inc.
Specs
Cure / Technology Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Features Sealant
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details