Hernon Manufacturing, Inc. Formulations - Applications - Bonding - Tuffbond 313 3313AB22

Description
Tuffbond® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
Datasheet
Description
Tuffbond® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Formulations - Applications - Bonding - Tuffbond 313 - 3313AB22 - Hernon Manufacturing, Inc.
Sanford, FL, United States
Formulations - Applications - Bonding - Tuffbond 313
3313AB22
Formulations - Applications - Bonding - Tuffbond 313 3313AB22
Tuffbond® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.

Tuffbond® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components.

Supplier's Site Datasheet

Technical Specifications

  Hernon Manufacturing, Inc.
Product Category Industrial Adhesives
Product Number 3313AB22
Product Name Formulations - Applications - Bonding - Tuffbond 313
Cure / Technology Two Component  ; Room Temperature Vulcanizing or Curing
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