Graphene Laboratories, Inc. Datasheets for Specialty Adhesives, Sealants, and Compounds
Specialty adhesives, sealants and compounds are specialized and/or proprietary products with unique chemistries, cure technologies and/or compositions.
Specialty Adhesives, Sealants, and Compounds: Learn more
| Product Name | Notes |
|---|---|
| DESCRIPTION: G6E-FRP™ is a flexible version of our G6E-P™ general purpose epoxy. G6E-FRP™ epoxy was developed primarily for high-performance bonding, connection, sealing and coating applications requiring a flexible bond or... | |
| DESCRIPTION: G6E-FXNS™ epoxy is developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials as well as for low electrical resistivity. G6E-FXNS™ is developed based on... | |
| DESCRIPTION: G6E-FXSG™ epoxy is primarily developed for applications requiring a high-performance flexible bond or connection of electrically conductive components/materials requiring low electrical resistivity. G6-FXSG™ is well suited for bonding of... | |
| DESCRIPTION: G6E-HTC™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials that operate at higher temperatures. G6E-HTC™ epoxy’s properties result from being formulated... | |
| DESCRIPTION: G6E-HTNS™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS™ is developed... | |
| DESCRIPTION: G6E-HTSG™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG™ | |
| DESCRIPTION: G6E-NS10™ epoxy is developed for general purpose applications requiring high performance bond or connection of electrically conductive components/materials for enhanced electrical conductivity. G6E-NS10™ has been developed based on advanced... | |
| DESCRIPTION: G6E-P™ epoxy is primarily developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials . G6E-P™ is formulated with proprietary nanomaterials and fillers. G6E-P™ epoxy... | |
| DESCRIPTION: G6E-RTC™ Room Temperature Curable Carbon Filled Electrically Conductive epoxy is developed primarily for applications requiring curing at room temperature. G6E-RTC™ epoxy is formulated with proprietary nanomaterials and fillers to... | |
| DESCRIPTION: G6E-RTSG™ epoxy is developed primarily for applications that require curing at room temperature. Room temperature curing eliminates the necessity for a heating oven. This allows easier and safer bond/connection... | |
| DESCRIPTION: G6E-SG™ epoxy is developed for general purpose applications requiring high-performance bond or connection of electrically conductive components/materials that require low electrical resistivity. G6E-SG™ is formulated with proprietary nanomaterials and... | |
| DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11™ has been... | |
| Our G6E-TSAL™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials . It is designed to provide efficient heat transfer... | |
| Our G6E-TSHV™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials . It is designed to provide efficient heat transfer... |