DESCRIPTION:
G6E-HTSG™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG™ epoxy is formulated with proprietary nanomaterials and fillers. G6E-HTSG™ epoxy has good electrical conductivity. G6E-HTSG™ epoxy incorporates a proprietary graphene additive to enhance crack resistance. A heating oven is required for curing. Uses for G6E-HTSG™ epoxy include electronics, embedded electrical heater manufacture and repair, etc.
FEATURES:
· Higher Glass Transition & Operating Temperature
· Silver-Graphene Filled (Non-Magnetic)
· Excellent Electrical Conductivity
· Graphene Loaded (Improves Cracking Resistance)
· Wide Temperature Operation (Cracking Resistant)
TYPICAL APPLICATIONS:
· Electronics operated or exposed to High Temperature
· Embedded Electrical Heaters
· EMI / RFI Shielding
· Electrical Sensors / Transducers
· Solder Replacement
SPECIFICATIONS:
TWO COMPONENT SYSTEM:
Part A – smooth dark grey paste
Part B – smooth thixotropic silver paste
MIX RATIO: 100 (Part A) to 50 (Part B) by weight.
POT LIFE: 4 hours
CURING SCHEDULE: Best results are obtained when product is cured at 4 hours @ 150°C / 302°F. Post cure for 1-2 hours @ 180°C / 356°F for optimum properties.
DENSITY: Part A 3.1-3.3 g/cm3
Part B 3.0-3.2 g/cm3
MIXED VISCOSITY: 290 to 310 Pa·s @ 25°C / 77°F
OPERATING TEMPERATURE: up to 315°C / 599°F
GLASS TRANSITION TEMPERATURE (Tg): 129°C / 264°F
HARDNESS, SHORE: >80 D
VOLUME RESISTIVITY: 0.0005 ω·cm
DESCRIPTION:
G6E-HTSG™ epoxy is primarily developed for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures and which require low electrical resistivity. G6E-HTSG™ epoxy is formulated with proprietary nanomaterials and fillers. G6E-HTSG™ epoxy has good electrical conductivity. G6E-HTSG™ epoxy incorporates a proprietary graphene additive to enhance crack resistance. A heating oven is required for curing. Uses for G6E-HTSG™ epoxy include electronics, embedded electrical heater manufacture and repair, etc.
FEATURES:
· Higher Glass Transition & Operating Temperature
· Silver-Graphene Filled (Non-Magnetic)
· Excellent Electrical Conductivity
· Graphene Loaded (Improves Cracking Resistance)
· Wide Temperature Operation (Cracking Resistant)
TYPICAL APPLICATIONS:
· Electronics operated or exposed to High Temperature
· Embedded Electrical Heaters
· EMI / RFI Shielding
· Electrical Sensors / Transducers
· Solder Replacement
SPECIFICATIONS:
TWO COMPONENT SYSTEM:
Part A – smooth dark grey paste
Part B – smooth thixotropic silver paste
MIX RATIO: 100 (Part A) to 50 (Part B) by weight.
POT LIFE: 4 hours
CURING SCHEDULE: Best results are obtained when product is cured at 4 hours @ 150°C / 302°F. Post cure for 1-2 hours @ 180°C / 356°F for optimum properties.
DENSITY: Part A 3.1-3.3 g/cm3
Part B 3.0-3.2 g/cm3
MIXED VISCOSITY: 290 to 310 Pa·s @ 25°C / 77°F
OPERATING TEMPERATURE: up to 315°C / 599°F
GLASS TRANSITION TEMPERATURE (Tg): 129°C / 264°F
HARDNESS, SHORE: >80 D
VOLUME RESISTIVITY: 0.0005 Ω·cm
