G6 Epoxy CONDUCTIVE SILVER-CARBON EPOXY G6E-NS11

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CONDUCTIVE SILVER-CARBON EPOXY - G6E-NS11 - G6 Epoxy
Ronkonkoma, NY, United States
CONDUCTIVE SILVER-CARBON EPOXY
G6E-NS11
CONDUCTIVE SILVER-CARBON EPOXY G6E-NS11
DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. This improvement not only reduces the cost of the material but also makes G6E-NS11™ less prone to fracture, thus allowing for stronger adhesion to the target substrate. G6E-NS11™ epoxy is developed for general purpose applications requiring a bond or connection of electrically conductive components/materials that require good electrical conductivity. A heating oven is strongly recommended for curing. FEATURES: · Silver-Carbon Filled (Non-Magnetic) · Very Good Electrical Conductivity · Resistant to Temperature Variations · Impact / Shock Resistant · Corrosion Resistant TYPICAL APPLICATIONS: · PCB Manufacture / Repair · EMI / RFI Shielding · Display Packaging / Bonding · Electronics Manufacture / Repair · Solder Replacement SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth thixotropic dark grey paste Part B – smooth thixotropic silver paste MIX RATIO: 100 (Part A) to 100 (Part B) by weight. POT LIFE: 4 hours CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules: 60 hours @ 25°C / 77°F 3 hours @ 70°C / 158°F 1 hour @ 150°C / 302°F DENSITY: Part A 2.15-2.30 g/cm3 Part B 2.30-2.40 g/cm3 MIXED VISCOSITY: 80 to 85 Pa·s @ 25°C / 77°F GLASS TRANSITION TEMPERATURE (Tg): 65°C / 149°F cured at 150°C / 302°F HARDNESS, SHORE: >65 D VOLUME RESISTIVITY: 0.0007 ω·cm

DESCRIPTION:

Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. This improvement not only reduces the cost of the material but also makes G6E-NS11™ less prone to fracture, thus allowing for stronger adhesion to the target substrate. G6E-NS11™ epoxy is developed for general purpose applications requiring a bond or connection of electrically conductive components/materials that require good electrical conductivity. A heating oven is strongly recommended for curing.

FEATURES:

· Silver-Carbon Filled (Non-Magnetic)

· Very Good Electrical Conductivity

· Resistant to Temperature Variations

· Impact / Shock Resistant

· Corrosion Resistant

TYPICAL APPLICATIONS:

· PCB Manufacture / Repair

· EMI / RFI Shielding

· Display Packaging / Bonding

· Electronics Manufacture / Repair

· Solder Replacement

SPECIFICATIONS:

TWO COMPONENT SYSTEM:

Part A – smooth thixotropic dark grey paste

Part B – smooth thixotropic silver paste

MIX RATIO: 100 (Part A) to 100 (Part B) by weight.

POT LIFE: 4 hours

CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules:

60 hours @ 25°C / 77°F

3 hours @ 70°C / 158°F

1 hour @ 150°C / 302°F

DENSITY: Part A 2.15-2.30 g/cm3

Part B 2.30-2.40 g/cm3

MIXED VISCOSITY: 80 to 85 Pa·s @ 25°C / 77°F

GLASS TRANSITION

TEMPERATURE (Tg): 65°C / 149°F cured at 150°C / 302°F

HARDNESS, SHORE: >65 D

VOLUME RESISTIVITY: 0.0007 Ω·cm

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Technical Specifications

  G6 Epoxy
Product Category Specialty Adhesives, Sealants, and Compounds
Product Number G6E-NS11
Product Name CONDUCTIVE SILVER-CARBON EPOXY
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; PCB Manufacture / Repair, EMI / RFI Shielding, Display Packaging / Bonding, Solder Replacement
Viscosity 80000 to 85000 cP
Composition Filled
Use Temperature 77 to 302 F (25 to 150 C)
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