Graphene Laboratories, Inc. Conductive Silver-Carbon Epoxy G6E-NS11

DESCRIPTION: Traditional silver-based adhesives require up to 80% weight load of silver fillers and as a result tend to be costly, brittle and prone to mechanical failure. G6E-NS11™ has been developed based on advanced proprietary technology that requires 15% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. This improvement not only reduces the cost of the material but also makes G6E-NS11™ less prone to fracture, thus allowing for stronger adhesion to the target substrate. G6E-NS11™ epoxy is developed for general purpose applications requiring a bond or connection of electrically conductive components/materials that require good electrical conductivity. A heating oven is strongly recommended for curing. FEATURES: · Silver-Carbon Filled (Non-Magnetic) · Very Good Electrical Conductivity · Resistant to Temperature Variations · Impact / Shock Resistant · Corrosion Resistant TYPICAL APPLICATIONS: · PCB Manufacture / Repair · EMI / RFI Shielding · Display Packaging / Bonding · Electronics Manufacture / Repair · Solder Replacement SPECIFICATIONS: TWO COMPONENT SYSTEM: Part A – smooth thixotropic dark grey paste Part B – smooth thixotropic silver paste MIX RATIO: 100 (Part A) to 100 (Part B) by weight. POT LIFE: 4 hours CURING SCHEDULE: Best results are obtained when the product is cured at one of the following schedules: 60 hours @ 25°C / 77°F 3 hours @ 70°C / 158°F 1 hour @ 150°C / 302°F DENSITY: Part A 2.15-2.30 g/cm3 Part B 2.30-2.40 g/cm3 MIXED VISCOSITY: 80 to 85 Pa·s @ 25°C / 77°F GLASS TRANSITION TEMPERATURE (Tg): 65°C / 149°F cured at 150°C / 302°F HARDNESS, SHORE: >65 D VOLUME RESISTIVITY: 0.0007 ω·cm