DESCRIPTION:
G6E-HTNS™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS™ is developed based on advanced proprietary technology that utilizes 20% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. G6E-HTNS™ epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. A heating oven is required for curing. Uses for G6E-HTNS™ epoxy include printed circuit board, RFID tags, medical device manufacture and repair, etc.
FEATURES:
· Higher Glass Transition & Operating Temperature
· Silver-Carbon Filled (Non-Magnetic)
· Very Good Electrical Conductivity
· Resistant to Temperature Variations
· Impact / Shock Resistant
· Corrosion Resistant
· Moderate Cost (as an alternative to silver only based epoxies)
TYPICAL APPLICATIONS:
· Printed Circuit Board Manufacture / Repair
· Radio Frequency Identification (RFID) tags
· EMI / RFI Shielding
· Electrical Sensors / Transducers
· Solder Replacement
SPECIFICATIONS:
TWO COMPONENT SYSTEM:
Part A – smooth dark grey paste
Part B – smooth thixotropic silver paste
MIX RATIO: 100 (Part A) to 100 (Part B) by weight.
POT LIFE: 4 hours
CURING SCHEDULE: Best results are obtained when product is cured at 4 hours @ 150°C / 302°F. Post cure for 1-2 hours @ 180°C / 356°F for optimum properties.
DENSITY: Part A 2.15-2.30 g/cm3
Part B 2.30-2.40 g/cm3
MIXED VISCOSITY: 220 to 230 Pa·s @ 25°C / 77°F
OPERATING TEMPERATURE: up to 315°C / 599°F
GLASS TRANSITION TEMPERATURE (Tg): 140°C / 284°F
HARDNESS, SHORE: >83 D
VOLUME RESISTIVITY: 0.003 ω·cm
DESCRIPTION:
G6E-HTNS™ epoxy is developed primarily for applications requiring a high-performance bond or connection of electrically conductive components/materials which operate at higher temperatures requiring low electrical resistivity. G6E-HTNS™ is developed based on advanced proprietary technology that utilizes 20% or less silver content to be at par with leading silver-based epoxies in terms of electrical properties. G6E-HTNS™ epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. A heating oven is required for curing. Uses for G6E-HTNS™ epoxy include printed circuit board, RFID tags, medical device manufacture and repair, etc.
FEATURES:
· Higher Glass Transition & Operating Temperature
· Silver-Carbon Filled (Non-Magnetic)
· Very Good Electrical Conductivity
· Resistant to Temperature Variations
· Impact / Shock Resistant
· Corrosion Resistant
· Moderate Cost (as an alternative to silver only based epoxies)
TYPICAL APPLICATIONS:
· Printed Circuit Board Manufacture / Repair
· Radio Frequency Identification (RFID) tags
· EMI / RFI Shielding
· Electrical Sensors / Transducers
· Solder Replacement
SPECIFICATIONS:
TWO COMPONENT SYSTEM:
Part A – smooth dark grey paste
Part B – smooth thixotropic silver paste
MIX RATIO: 100 (Part A) to 100 (Part B) by weight.
POT LIFE: 4 hours
CURING SCHEDULE: Best results are obtained when product is cured at 4 hours @ 150°C / 302°F. Post cure for 1-2 hours @ 180°C / 356°F for optimum properties.
DENSITY: Part A 2.15-2.30 g/cm3
Part B 2.30-2.40 g/cm3
MIXED VISCOSITY: 220 to 230 Pa·s @ 25°C / 77°F
OPERATING TEMPERATURE: up to 315°C / 599°F
GLASS TRANSITION TEMPERATURE (Tg): 140°C / 284°F
HARDNESS, SHORE: >83 D
VOLUME RESISTIVITY: 0.003 Ω·cm
